• Journal of Power System Engineering
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• v.2 no.2
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• pp.35-40
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• 1998

In this study, the author investigated the effects of strengthening treatments on the mechanical properties of plasma sprayed Ni-base self fluxing alloy. Strengthening treatments for sprayed specimens were carried out in 4 different temperature conditions in vacuum furnace. The mechanical properties, such as microhardness, thermal shock resistance and erosion resistance were tested for the sprayed specimens after strengthening treatments. And it was proved that the mechanical properties of coating layer were much improved by strengthening treatments.

• Journal of the Korean Society of Clothing and Textiles
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• v.24 no.3
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• pp.429-439
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• 2000

This study was aimed to investigate the handle and mechanical properties of silk woven fabrics according to the fabric structure and yarn types 56 male and female students evaluated 16 black specimens with semantic differential scale of 20 hand adjectives. Mechanical parameters such as surface properties, bending properties and compression properties were tested using by KES-FS system. Data were analyzed through factor analysis, pearson correlation coefficient and t-test using PC SAS package. The results were as follows: The hand adjectives were grouped as 4 'surface roughness', 'flexibility', ;sense of thermal', and 'dryness'. 'Surface roughness' was highly sensed at satin fabrics of hard-twist yarn, noil yarn and spun yarn, while it was not at the fabrics of normal satin and twill at all. 'Flexibility' was reverse to 'surface roughness'. Thermal sense was felt highly at satin fabrics of noil-yarn, while low at plain fabrics of normal yarn. 'Dryness' was high at satin fabrics of hard-twist yarn and while it was low at normal satin fabrics. Predicted equations for subjective hand from mechanical properties of fabrics were developed using Stevens's law and stepwise regression and the coefficients of determination were high.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2003.10a
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• pp.21-24
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• 2003

In general, to enhance physical properties of PET-layered silicate nanocomposites $(P_{et}LSNs)$, it has been well known that the organic modifiers should introduce into gallery regions. However, the organic modifiers in$(P_{et}LSNs)$ may result in thermal decomposition by melt processing at high temperature, and it necessarily lead to deteriorate various physical properties of final products. Therefore, in this study, $(P_{et}LSNs)$ excluding and including organic modifiers were prepared by solution method $(S-P_{et}LSNs_{eom} and S-P_{et}LSNs_{iom})$ and we (focused on the effects of the organic modifiers in $P_{et}$ LSNs with exfoliation structure on the crystallization behaviors, the optical transparency, the thermal stability and the mechanical property. The absence and existence of organic modifiers in $S-P_{et}LSNs_{eom} and S-P_{et}LSNs_{iom}$ were investigated by EA and TGA, and nano-structure of silicate layers in $S-P_{et}LSNs$ was evaluated by using WXRD, SAXS and TEM. $S-P_{et}LSNs_{eom} and S-P_{et}LSNs_{iom}$ were mixed with neat PET as masterbatches by melt method $(M-P_{et}LSNs_{eom} and M-P_{et}LSNs_{iom})$, and also neat PET was mixed with organically modified layered silicates (OLS) by conventional direct melt method $(D-P_{et}LSNs) at 270^{\circ}C$. As results, it was found that $M-P_{et}LSNs_{eom}, M-P_{et}LSNs_{iom}, and D-P_{et}LSN$ showed a exfoliated structure and exhibited faster crystallization rate, better thermal stability and mechanical property than those of neat PET due to the dispersed and detaminated silicate layers in PET matrix. Whereas, considering organic modifiers effect, $M-P_{et}LSNs_{eom} and D-P_{et}LSN$ exhibited slower crystallization rate, poorer optical, thermal and mechanical properties, in comparison to $M-P_{et}LSNs_{eom}> due to the thermal decomposition of organic modifier in $D-P_{et}LSNs$ during melt method.

• Proceedings of the Polymer Society of Korea Conference
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• 2006.10a
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• pp.373-373
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• 2006

Rigid polyurethane foams(PUFs) are widely used in most areas of insulations such as storage tank and pipe line for transporting liquefied gas. Glass fiber and nanoclay are used for improvement in mechanical property and thermal insulation of rigid PUF at very low temperature(<$-150^{\circ}C$). These rigid PUFs have been characterized in terms of thermal, mechanical, dynamic mechanical properties and cell morphology. It was found that mechanical properties, thermal conductivity and dimensional stability of rigid PU foams were improved by glass fiber and nanoclay.

• Journal of Powder Materials
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• v.21 no.6
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• pp.467-472
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• 2014

RBSC (reaction-bonded silicon carbide) represents a family of composite ceramics processed by infiltrating with molten silicon into a skeleton of SiC particles and carbon in order to fabricate a fully dense body of silicon carbide. RBSC has been commercially used and widely studied for many years, because of its advantages, such as relatively low temperature for fabrication and easier to form components with near-net-shape and high relative density, compared with other sintering methods. In this study, RBSC was fabricated with different size of SiC in the raw material. Microstructure, thermal and mechanical properties were characterized with the reaction-sintered samples in order to examine the effect of SiC size on the thermal and mechanical properties of RBSC ceramics. Especially, phase volume fraction of each component phase, such as Si, SiC, and C, was evaluated by using an image analyzer. The relationship between microstructures and physical properties was also discussed.

• Proceedings of the KSR Conference
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• 2007.11a
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• pp.824-829
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• 2007

Mechanical and thermal analysis properties of carbon fiber/epoxy composite for train carbody were evaluated by varying with environmental factors such as ultraviolet, temperature, and moisture. Accelerated environmental aging tester was utilized for this study. Testing temperature was set to $80^{\circ}C$ and ultraviolet was obtained through xenon-arc lamp. To consider moisture, water sprayed on specimen for 18 minutes every 2 hour. All the specimens were made of CF1263/Epoxy composite. Mechanical properties such as tensile, bending, and shear properties were evaluated through a material testing system. Also, thermal analysis properties such as storage shear modulus, loss shear modulus, and tan ${\delta}$ were measured through dynamic mechanical analyzer. Finally surfaces of the composite exposed to environmental factors were examined using a scanning electron microscope. From experimental results, those properties of CF1263/Epoxy composite were shown to be slightly decreased due to environmental factors.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.11
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• pp.3538-3548
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• 1996

In this study, as a part of basic study for developing the simulation program for the assemssment of reliability of electronic EMC packaging which covers from EMC mixing step to thermal analysis, comparison between a measured and predicted values of material properties of EMC and finitde element analysis of thermal stress are performed. For the experimental testing specimens of fifty, sixty hive and eighty percent filler($13\mu m$, spherical silica) weight fraction are fabricated using tranfer molding. Coefficient of thermal expansion, elastic modulus and thermla conductivity are measured using these specimens and then these measured values are compared with the predicted values by various equations ( such as dilute suspension method. self consistent method, generalized self consistent method, Hashin-Shtrikman's bounds. Shapery's bounds, Nielsen's method and others). Measured values are distributed within the upper and lower bounds of equations. Measured elastic modulus and coefficient of thermal expansion approaches closely the perdicted values with self consisten mehtod and upper bound of Shaperys equation respectively. However small differences of thermal conductivity between the different filler volume fraction are obserbed. FEM analysis indicates that firstly stress is concentrated at the corner section of EMC and secondly EMC with eighty percent filler weight fraction shows less thermal stress when package is cooling down and relatively high thermal stress when package is heating up.

• Journal of Industrial Technology
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• v.24 no.A
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• pp.9-15
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• 2004

The flexural strength from 3-point bend test and fatigue properties were measured to evaluate mechanical properties of metal/ceramic interface of the multilayer ceramic package produced through tape casting. From the results, the specimens with three electrode layers showed the highest strength. The temperature distribution with time during thermal cycle and thermal stresses with the change of electrode's shape have been estimated by mathematical modelling. Specimen affected by thermal shock, produced microcracks by the difference of thermal expansion coefficient. The results of tensile test and fatigue test showed the rupture at pin. The fact that the pin brazed specimens were always fractured at the pin proved the good bonding condition between pin and electrode.

• Structural Engineering and Mechanics
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• v.58 no.2
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• pp.217-230
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• 2016

Effects of temperature dependent material properties on mixed mode fracture parameters of functionally graded materials subjected to thermal loading are investigated. A domain form of the $J_k$-integral method including temperature-dependent material properties and its numerical implementation using finite element analysis is presented. Temperature and displacement fields are calculated using finite element analysis and are used to compute mixed mode stress intensity factors using the $J_k$-integral. Numerical results indicate that temperature-dependency of material properties has considerable effect on the mixed-mode stress intensity factors of cracked functionally graded structures.

• Journal of the Microelectronics and Packaging Society
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• v.10 no.3
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• pp.9-17
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• 2003

In this paper, thermo-mechanical and rheological properties of NCPs (Non-Conductive Pastes) depending on silica filler contents and diluent contents were investigated. And then, thermal cycling (T/C) reliability of flip chip assembly using selected NCPs was verified. As the silica filler content increased, thermo-mechanical properties of NCPs were changed. The higher the silica filler content was added, glass transition temperature ($T_g$) and storage modulus at room temperature became higher. While, coefficient of thermal expansion (CTE) decreased. On the other hand, rheological properties of NCPs were significantly affected by diluent content. As the diluent content increased, viscosity of NCP decreased and thixotropic index increased. However, the addition of diluent deteriorated thermo-mechanical properties such as modulus, CTE, and $T_g$. Based on these results, three candidates of NCPs with various silica filler and diluent contents were selected as adhesives for reliability test of flip chip assemblies. T/C reliability test was performed by measuring changes of NCP bump connection resistance. Results showed that flip chip assembly using NCP with lower CTE and higher modulus exhibited better T/C reliability behavior because of reduced shear strain in NCP adhesive layer.