• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.46-50
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• 1996

Die sinking Electrical Discharge Machining(EDM) of TiC/Al$_2$O$_3$Ceramic Matrix Composite(CMC) was conducted for positive and negative polarity according to the change of current and Duty Factor(DF). Also FEM analysis about temperature distribution of workpiece by one spark was executed. Maximum surface roughness( R$_{max}$ ) and SEM photographs of the EDMed surface for different conditions were evaluated. Higher Material Removal Rate(MRR) was obtained for negative polarity than positive one. Better surface morphology was found as the current is decreased, but the MRR was also decreased. From the SEM photographs, the size of melt cavity due to one spark is about 100 to 150${\mu}{\textrm}{m}$ in diameterer

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1999년도 춘계학술대회 논문집
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• pp.245-250
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• 1999

The experimental study of die-sinking electrical discharge machining for alloy tool steel of STD-11 with circular electrode was conducted for various conditions of the peak current and duty factor with the change of internal size of electrode for distributing the amount of dielectric flow through the electrode. From this study, the material removal rate(MRR) was found to be increased with the peak current and duty factor. The more MRR was obtained for the case of electrode inside diameter of 10mm. The surface roughness and roundness values were analyzed regularity under various conditions, and these values were not affected by the inside diameter change of electrode.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.930-933
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• 2000

In this report experimental ultrasonic machine system has been fabricated and experimental machining has been performed using glass as a workpiece material. As grit size increases, material removal rate(MRR) was observed to be increased at decreased applied tool pressure on the workpiece, however at the higher applied pressure above $2-4\;kg/cm^2$ for smaller grit size, the MRR was not increased. Also better surface roughness was obtained for smaller grit size. Microchipping was observed from the microscopic examination and the pattern is similar to the iso-stress field where cracking is considered to be initiated near the surface.

• 한국공작기계학회논문집
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• 제12권6호
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• pp.36-43
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• 2003

In machining of ceramic materials, they are very difficult-to cut materials because of there high strength and hardness. Machining of ceramics are characterized by cracking and brittle fracture. Generally, ceramics are machined using conventional method such as finding and polishing. However these processes are generally costly and have low MRR(material removal rate). This paper focuses on determining the optimal levels of process parameters for products with CNC machining center. For this purpose, the optimization of cutting parameters is performed based on experimental design method. A design and analysis of experiments is conducted to study the effects of these parameters on the surface roughness by using the S/N ratio, analysis of ANOVA and F-test. Cutting parameters, namely, cutting speed, feed and depth of cut are optimized with consideration of the surface roughness.

• International Journal of Precision Engineering and Manufacturing
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• 제8권4호
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• pp.10-15
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• 2007

Taguchi methods have been used for a long time to improve the product quality and process performance of a manufacturing system, Few researchers have applied this methodology in laser beam cutting (LBC) of sheet metals and found the considerable improvement in cut qualities. In all experimental investigations of LBC so far, the objective was to optimize the single quality characteristic at a time. In this paper the simultaneous optimization of multiple quality characteristics such as Kerf width and material removal rate (MRR) during pulsed Nd:YAG LBC of thin sheet of magnetic material (high Silicon-steel) has been presented using Taguchi's quality loss function. The results show the considerable improvement in multiple S/N ratio as compared to initial cutting condition. Also, the comparison of results from single and multi-objective optimization have been presented and it was found that the loss in quality is always possible shifting from single quality to multiple quality optimization.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2001년도 춘계학술대회 논문집
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• pp.1068-1071
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• 2001

Recently, the minimum line width shows a tendancy to decrease and the multi-level to increase in semiconductor. Therefore, a planarization technique is needed, which chemical polishing(CMP) is considered as one of the most important process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as microscratches, abrasive contaminations, and non-uniformity of polished wafer edges. Spin Etching can improve the defects of CMP. It uses abrasive-free chemical solution instead of slurry. Wafer rotates and chemical solution is simultaneously dispensed on a whole surface of the wafer. Thereby chemical reaction is occurred on the surface of wafer, material is removed. On this study, TEOS film is removed by CMP and Spin Etching, the results are estimated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU).

• 한국정밀공학회지
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• 제16권8호
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• pp.9-15
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• 1999

Die-sinking electrical discharge machining(EDM) for conductive ceramic matrix composite(CMC) of Tic/$Al_2O_3$ was experienced with addition of ultrasonic emission, and the results were compared with ones obtained by the EDM only. From this experimental study, the values of material removal rate(MRR) and surface roughness($R_{max}$), scanning electron microscope(SEM) micrographs, and weibull probability distribution of bending strength for the specimens were obtained and compared. The trend of MRR was found to be increased slightly with the current and the duty factor for both EDM only and EDM with ultrasonic emission. The MRR values were found to be increased for EDM with ultrasonic emission. The SEM micrographs of EDMed surface by under various operating conditions showed less micro cracks in various places. Although smaller bending strength value was obtained by EDMed surface with ultrasonic emission by weibull probability distribution analysis of bending strength.

• 정보저장시스템학회논문집
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• 제3권2호
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• pp.66-72
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• 2007

Surface finishing using magnetorheological (MR) fluid is useful to finish small but not too small workpieces such as those in a few millimeter scale. However, due to the high surface hardness, this finishing process does not seem to be suit for applying to a hard disk slider. In this work, a preliminary study is performed on the finishing of the hard disk slider surface with a mixture of an MR fluid and diamond powder. During a wheel type MR finishing process, centrifugal force is found to be a major factor to cause a reduction in material remove rate (MRR), which is supported by a theoretical model. To facilitate this founding, the rotational speed of tool is confined to 500rpm while a rectilinear alternating motion with the mean speed, which is equivalent to the rotational speed, is additionally applied to the workpieces. As a consequence, MRR of about 2 times of the sole rotational case is obtained. This paper shows that MR finishing process can be used to polish a hard material in millimeter scale efficiently by controlling the speeds of the tool and the workpiece.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1997년도 추계학술대회 논문집
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• pp.935-938
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• 1997

Recently, the minimum line width shows a tendency to decrease and the multi-level increase in semiconductor. Therefore, a planarization technique is needed and chemical mechanical polishing(CMP) is considered as one of the most suitable process. CMP accomplishes a high polishing performance and a global planarization of high quality. But there are several defects in CMP such as micro-scratches, abrasive contaminations, and non-uniformity of polished wafer edges. Wet etching include of Spin-etching can improve he defects of CMP. It uses abrasive-free chemical solution instead of slurry. On this study, ILD(INterlayer-Dielectric) was removed by CMP and wet-etching methods in order to investigate the superiority of wet etching mechanism. In the thin film wafer, the results were evaluated at a viewpoint of material removal rate(MRR) and within wafer non-uniformity(WIWNU). And pattern step height was also compared for planarization characteristics of the patterned wafer.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.709-712
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• 2002

For the electro-discharge machining of an electro-conductive anisotropic composite, an unsteady state formulation was established and solved by Galerkin's finite element method. The distribution of temperature on work piece, the shape of the crater and the material removal rate were obtained in terms of the process parameters. As the spark was initiated the workpiece immediately started to melt and the heat affected zone was formed. The moving boundary of the crater was also identified with time. When the radial and axial conductivities were increased separately the temperature distribution and the shape of the crater were shifted in the same direction respectively and the material removal rate was found to be higher in the case of increasing radial conductivity rather than the axial conductivity.