• 한국정보통신학회논문지
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• 제26권3호
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• pp.422-429
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• 2022

본 논문에서는 현재 기술 개발 과제로 진행 중인 다중 공중 이동 및 검증을 위한 다채널 공중 중계 장치와 다수의 임무 장치로 구성된 네트워크 시스템 기반 기저대역부와 RF부간의 중간주파수 전송 신호 레벨을 기준 신호 레벨로 일정하게 유지하도록 하고, 상대방의 수신 입력 범위를 고려하여 단거리 장거리 무선 통신 환경 변화에도 RF부 내의 송수신 회로 상의 신호 탐지와 자동이득제어, 자동출력제어 기능을 통해 신호가 안정되고 신뢰성 있게 전송되도록 하는 다중 링크 보호, MLP-A 알고리즘을 제시한다. 그리고, MLP-A 알고리즘이 적용된 RF부를 설계, 제작, 구현하고 다중 공중 이동 및 검증 네트워크 구성으로 거리 산출 수식을 적용하여 단거리, 장거리 무선 환경을 고려한 실험 및 분석을 수행하였다. 이를 통해 안정적이고 신뢰성 있는 RF 통신 시스템 운용이 가능함을 확인하였다.

• Journal of Platform Technology
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• 제11권3호
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• pp.76-82
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• 2023

제4차 산업혁명을 기점으로 핵심기술들이 산업에 적용되어 각종 스마트 환경을 구축하기 시작하였다. 제조업의 스마트팩토리는 맞춤형 생산을 위한 광범위한 데이터의 수집과 제어를 실행할 수 있는 IIoT를 핵심기술로 적용하여 고품질 제품을 생산하게 되었다. 그러나, IIoT를 통하여 개방형으로 전환된 스마트팩토리의 네트워크 환경은 다양한 보안 위험에 노출되었다. 보안 침해에 따라 IIoT는 네트워크 망의 교란, 위변조된 IIoT의 사용 및 유지로 인하여 생산 제품, 생산 공정의 품질저하를 나타내었으며, 기업의 비즈니스에 신뢰성에 문제를 발생시킬 수 있다. 이에 따라 본 연구에서는 스마트팩토리 초기 구축 시 IIoT의 안전한 연결 및 활용을 위하여 스마트팩토리에 연결된 IIoT에 대한 실질성 확인과 무해화 환경 구축을 실행할 수 있는 방법으로 IIoT 연결 상황을 확인할 수 있는 연구를 실행하였다.

• Composites Research
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• 제19권4호
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• pp.31-38
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• 2006

본 연구에서는 열탄성 해석과 복합재/알루미늄 링시편 실험을 통해 성형 온도와 자긴 압력이 복합재와 알루미늄 라이너로 구성된 Type 3 극저온 추진제 탱크에 미치는 영향을 살펴보았다. 우선 Type 3 탱크의 온도분포를 구한 뒤 이를 경계조건으로 사용하여 성형온도와 자긴 압력의 영향을 고려한 탄성해석을 수행하였다. 그 결과 복합재의 성형온도가 증가할수록 복합재와 알루미늄 라이너에 각각 잔류압축응력과 잔류인장응력이 증가하였다. 한편 자긴 압력은 극저온 환경에 의해 유발된 잔류열응력의 감소를 초래하였으며 자긴 압력의 크기가 증가할수록 이러한 경향은 두드러졌다. 이러한 성형 온도와 자긴 압력의 영향은 Type 3 극저온 추진제 탱크의 설계 및 제작 단계에 반드시 고려되어야 한다.

• 반도체디스플레이기술학회지
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• 제21권4호
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• pp.65-70
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• 2022

In manufacturing and semiconductor industries, transfer robots increase productivity through accurate and continuous work. Due to the nature of the semiconductor process, there are environments where humans cannot intervene to maintain internal temperature and humidity in a clean room. So, transport robots take responsibility over humans. In such an environment where the manpower of the process is cutting down, the lack of maintenance and management technology of the machine may adversely affect the production, and that's why it is necessary to develop a technology for the machine failure diagnosis system. Therefore, this paper tries to identify various causes of failure of transport robots that are widely used in semiconductor automation, and the Prognostics and Health Management (PHM) method is considered for determining and predicting the process of failures. The robot mainly fails in the driving unit due to long-term repetitive motion, and the core components of the driving unit are motors and gear reducer. A simulation drive unit was manufactured and tested around this component and then applied to 6-axis vertical multi-joint robots used in actual industrial sites. Vibration data was collected for each cause of failure of the robot, and then the collected data was processed through signal processing and frequency analysis. The processed data can determine the fault of the robot by utilizing machine learning algorithms such as SVM (Support Vector Machine) and KNN (K-Nearest Neighbor). As a result, the PHM environment was built based on machine learning algorithms using SVM and KNN, confirming that failure prediction was partially possible.

• Journal of Radiation Protection and Research
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• 제47권4호
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• pp.214-225
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• 2022

Background: The conventional cerium-doped Gd₂Al₂Ga₃O₁₂ (GAGG(Ce)) scintillator-based gamma-ray imager has a bulky detector, which can lead to incorrect positioning of the gammaray source if the shielding against background radiation is not appropriately designed. In addition, portability is important in complex environments such as inside nuclear power plants, yet existing gamma-ray imager based on a tungsten mask tends to be weighty and therefore difficult to handle. Motivated by the need to develop a system that is not sensitive to background radiation and is portable, we changed the material of the scintillator and the coded aperture. Materials and Methods: The existing GAGG(Ce) was replaced with Bi₄Ge₃O₁₂ (BGO), a scintillator with high gamma-ray detection efficiency but low energy resolution, and replaced the tungsten (W) used in the existing coded aperture with lead (Pb). Each BGO scintillator is pixelated with 144 elements (12 × 12), and each pixel has an area of 4 mm × 4 mm and the scintillator thickness ranges from 5 to 20 mm (5, 10, and 20 mm). A coded aperture consisting of Pb with a thickness of 20 mm was applied to the BGO scintillators of all thicknesses. Results and Discussion: Spectroscopic characterization, imaging performance, and image quality evaluation revealed the 10 mm-thick BGO scintillators enabled the portable gamma-ray imager to deliver optimal performance. Although its performance is slightly inferior to that of existing GAGG(Ce)-based gamma-ray imager, the results confirmed that the manufacturing cost and the system's overall weight can be reduced. Conclusion: Despite the spectral characteristics, imaging system performance, and image quality is slightly lower than that of GAGG(Ce), the results show that BGO scintillators are preferable for gamma-ray imaging systems in terms of cost and ease of deployment, and the proposed design is well worth applying to systems intended for use in areas that do not require high precision.

• 한국산업융합학회 논문집
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• 제26권6_2호
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• pp.1019-1024
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• 2023

Ceramic materials have excellent material properties such as stability at high temperatures, chemical stability, corrosion resistance, and wear resistance, so they are applicable even in extreme environments of high temperature and pressure. In particular, silicon carbide can be applied in the field of structural ceramics due to its characteristics of high strength, hardness, corrosion resistance, and heat resistance even at high temperatures. In this study, considering the application of silicon carbide materials to next-generation turbines, silicon carbide materials were manufactured using a liquid phase sintering method. When manufacturing liquid phase sintered silicon carbide, sintering additives were added to lower the sintering temperature and densify the material. In Al₂O₃-SiO₂, it was confirmed that the secondary product of the sintering additive was observed as a slightly dark area and was evenly distributed overall, and the fracture surface of Al₂O₃-SiO₂ was in the form of transgranular fracture in which cracks progressed along the crystal plane, and the flexural strength for Al₂O₃-SiO₂ was about 445.6 MPa.

• Design & Manufacturing
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• 제17권4호
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• pp.1-7
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• 2023

In the fabrication of curved multi-display glass for automotive use, the surface roughness of the mold is a critical quality factor. However, the difficulty in detecting micro-cutting signals in a micro-machining environment and the absence of a standardized model for predicting micro-cutting forces make it challenging to intuitively infer the correlation between cutting variables and actual surface roughness under machining conditions. Consequently, current practices heavily rely on machining condition optimization through the utilization of cutting models and experimental research for force prediction. To overcome these limitations, this study employs a surface roughness prediction formula instead of a cutting force prediction model and converts the surface roughness prediction formula into experimental data. Additionally, to account for changes in surface roughness during machining runtime, the theory of position variables has been introduced. By leveraging artificial neural network technology, the accuracy of the surface roughness prediction formula model has improved by 98%. Through the application of artificial neural network technology, the surface roughness prediction formula model, with enhanced accuracy, is anticipated to reliably perform the derivation of optimal machining conditions and the prediction of surface roughness in various machining environments at the analytical stage.

• Design & Manufacturing
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• 제17권4호
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• pp.14-23
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• 2023

The electric vehicle market is developing rapidly around the world. Also, parts of electric vehicles require precision.In order to produce high-precision motor cores,Press equipment must also have good precision. Drive motor cores are an important technology for electric vehicles. It uses a large high-speed press to mass-produce drive motor cores. Because it's a large high-speed press, there are many reasons why the precision is not good. One of the causes is vibration and noise. Recently, as environmental demands have become stricter, regulations on noise and vibration have been strengthened. It is important for press machines to reduce vibration first for sound insulation and dust proofing. This is because the "breakthrough" phenomenon occurs in the press. Dynamic precision is the precision under the load of the press, Design considering strain and stiffness shall be made. Vibration and noise may occur due to SPM of high-speed press,And vibration and noise can cause structural deformation of the press. Structural deformation of the press can affect the precision of the product.Noise and vibration also cause problems for workers and work environments. Problems with vibration and noise occur during press processing, and vibration and noise lead to damage to the mold or defects in the product. Reliability in high-quality technology must be secured with low noise and low vibration during press processing. Modular shape and deformation energy effects were analyzed through finite element analysis. In this study, a study on vibration and noise countermeasures was conducted through finite element analysis of a large high-speed press.

• 품질경영학회지
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• 제51권4호
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• pp.663-675
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• 2023

Purpose: Skewness is an indicator used to measure the asymmetry of data distribution. In the past, product quality was judged only by mean and variance, but in modern management and manufacturing environments, various factors and volatility must be considered. Therefore, skewness helps accurately understand the shape of data distribution and identify outliers or problems, and skewness can be utilized from this new perspective. Therefore, we would like to propose a statistical quality control method using skewness. Methods: In order to generate data with the same mean and variance but different skewness, data was generated using normal distribution and gamma distribution. Using Minitab 18, we created 20 sets of 1,000 random data of normal distribution and gamma distribution. Using this data, it was proven that the process state can be sensitively identified by using skewness. Results: As a result of the analysis of this study, if the skewness is within ± 0.2, there is no difference in judgment from management based on the probability of errors that can be made in the management state as discussed in quality control. However, if the skewness exceeds ±0.2, the control chart considering only the standard deviation determines that it is in control, but it can be seen that the data is out of control. Conclusion: By using skewness in process management, the ability to evaluate data quality is improved and the ability to detect abnormal signals is excellent. By using this, process improvement and process non-sub-stitutability issues can be quickly identified and improved.

• 한국산업보건학회지
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• 제34권2호
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• pp.125-133
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• 2024

Objectives: The aim of this study is to develop a comprehensive Occupational Safety and Health (OSH) guide for maintenance tasks in semiconductor processing, specifically focusing on etching, deposition, and ion implantation processes. Methods: The development of the OSH guide involved a literature review, consultations with industry experts, and field investigations. It concentrates on Maintenance Work (MW) operations in these specialized areas. Results: The result is a detailed OSH guide tailored to MW in etching, deposition, and ion implantation facilities within semiconductor processing. This guide is structured to assist maintenance workers through pre-, during and post-MW phases, ensuring easy comprehension and adherence to safety protocols. It highlights the necessity of safety and health measures throughout the MW process to protect personnel. The guide is enriched with real-life scenarios and visual aids, including cartoons and photographs, to aid in the understanding and implementation of safety and health principles. Conclusions: This OSH guide is designed to enhance the protection of workers engaged in maintenance activities in the electronics sector, particularly in semiconductor manufacturing. It aims to improve compliance with safety and health standards in these high-risk environments.