• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.191-195
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• 2003

The formation degree of sustain (ITO pattern) decides quality of PDP (plasma display panel). For this reason. it makes efforts in search defects more than 30 ${\mu}{\textrm}{m}$. Now, the existing inspection process is dependent upon naked eye or SEM equipment in off-line PDP manufacturing process. In this study developed prototype inspection system of PDP ITO glass. This system creates information that detects and sorts kind of defect automatically. Design ed inspection technology adopts line-scan method by slip-beam formation for the minimum of inspection time and image processing algorithm is embodied in detection ability of developed system. Designed algorithm had to make good use of kernel matrix which draws up an approach to geometry. A characteristic of area-shaped defects, as pin hole, substance, protrusion et al, are extracted from blob analysis method. Defects, as open, short, spots, et al, are distinguished by line type inspection algorithm. In experiment results, we could have ensured ability of inspection that can be detected with reliability of up to 95% in about 60 seconds

• 한국공작기계학회논문집
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• 제13권5호
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• pp.87-95
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• 2004

From the results of AE(Acoustic Emission) source location occurred by the spot exciting as suggested in this research, it has been confirmed that AE technique is quite fruitful in figuring out the location of the occurrence, form, size and direction of the defects. As the results of examining the distribution of event for the angle of crack $\alpha$ to Xs and Ys, as the increases from $0^{\circ}$ ~ $90^{\circ}$, gradually changes its width from the axis Xs to the axis Ys. So event appears approximately similar in its size at the angle of crack $\alpha$=$45^{\circ}$, yet opposite when $\alpha$ is lager. It is believed that this is a phenomenon where its crack legnth $\alpha$, assumed as a planar defect, is to be prcjected toward the direction with a larger size. Thus, it is expected that the application of the experimental method suggested in this study would make it possible to identify the location of the defect in the material in the nondestructive way.

• 한국공작기계학회논문집
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• 제17권1호
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• pp.50-58
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• 2008

The SM45C metallic coupons have been tested under static tensile loading with acoustic emission (AE) as the load-deflection curve mainly. In this study, we used AE to detect the yielding of material and AE techniques was applied to rapidly estimate the mechanical characteristics of a material. First, coupons without an artificial defect were tested at different cross-head speed. For all cases in this analysis, yielding point of SM45C coupons did not appear definitely compared to mild steel, whereas coupons start to generate AE counts upon yielding. So all cases are normalized to know the possibility of accelerated life test of a material. And next, coupons with different from sizes of circular hole defects were tested at the same cross-head speed of 5 mm/min. Results were classified into 3 classes and analyzed by AE amplitude & signal strength as a function of time. Summarizing the specific conclusions, we need to additional research considering plate with width-ratio in order to estimate the fracture mechanism.

• Tribology and Lubricants
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• 제31권6호
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• pp.239-244
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• 2015

Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

• Structural Engineering and Mechanics
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• 제58권3호
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• pp.443-458
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• 2016

In this paper, we propose a method for taking into account uncertainties based on the projection on polynomial chaos. Due to the manufacturing and assembly errors, uncertainties in material and geometric properties, the system parameters including assembly defect, damping coefficients, bending stiffness and traction-compression stiffness are uncertain. The proposed method is used to determine the dynamic response of a one-stage spur gear system with uncertainty associated to gear system parameters. An analysis of the effect of these parameters on the one stage gear system dynamic behavior is then treated. The simulation results are obtained by the polynomial chaos method for dynamic analysis under uncertainty. The proposed method is an efficient probabilistic tool for uncertainty propagation. The polynomial chaos results are compared with Monte Carlo simulations.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2004년도 ICCAS
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• pp.126-131
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• 2004

The popularity of flat-panel display(FPD), including plasma display panel(PDP) and liquid-crystal display(LCD), has given rise to the need to streamline their production. In these days, PDP is one of the most popular display devices because of its expansion of manufacturing process and simplicity. Bus electrodes, sustain electrodes, barrier ribs and RGB phosphors are patterned on PDP panel to display an image. Since a minute damage on the pattern can cause a serious defect to display, it is important to inspect the pattern precisely. In this paper, an automatic inspection system of repeated pattern in PDP panel has been introduced to find the defect, such as open, short, dirt, island, and so on. And the inspection system has been operated in the mass production line of PDP.

• 소성∙가공
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• 제4권1호
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• pp.79-91
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• 1995

Precision forming of electronic components has appeared to be competitive according to manufacturing cost and dimensional tolerances. Now domestic electronic companies have been involving in utilization of the finite element method in process design of precision forming. A forming process to produce an electronic component, aperture, has been inbestigated to find out forming defects during multi-operations. The applications of the commercial FEM software MARC show a possibility of defect in precision coining process among the whole multi-process. Thus the coining process of three-dimensional deformation is analyzed using DAMF-3D which has been developed in this lab with the rigid-plastic algorithm. The result f simulations by DAMF-3D provides clear description of the defect involved in the coining process.

• 산업경영시스템학회지
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• 제20권41호
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• pp.135-145
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• 1997

The statistical approach to quality control aims at alerting its user to any variations in the properties of a manufactured product. Motorola developed and pursued a quality management program called six sigma. The goal of six sigma programs is to improve customer satisfaction through reducing and eliminating defects. six sigma uses several statistical measure to characterize defect levels and process capabilities. The upper and lower specification limits are $\pm6\sigma$(sigma) from nominal, and the process mean is centered at nominal. only 0.002PPM are outside specification limits. Cp=2. this is the design target in a six sigma program. This article presents an important tool available for quality control of a production process at the occurrence of defects in manufactured products at view low levels to improve the efficiency of the manufacturing productivity and to satisfy customer through the reduction of defect rates. To understand the consequences of the level of quality on competitive position, a more technical perspective is needed.

• 무역상무연구
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• 제34권
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• pp.3-26
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• 2007

Product liability law lies at the center of the modem world. This law concerns liability for damages arising from the commercial sale of a product that causes personal injury or property damage because it was defective or falsely represented. One engaged in the business of selling or otherwise distributing products who sells or distributes a defective product is subject to liability for harm to persons or property caused by the defect. In short, product defectiveness is the heart of products liability law. Regardless of the underlying cause of action, the plaintiff in nearly every products liability case must prove that the defendant's product contained an unnecessary hazard that caused the harm. The purpose of this paper is to clarify the meaning of the product defectiveness to products liability claims in China. In China, Product to include most movable personal property, but to exclude services. And a product is defective when, at the time of sale or distribution, it contains a manufacturing defect, is defective in design, or is defective because of inadequate instructions or warnings.

• International Journal of Precision Engineering and Manufacturing
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• 제1권1호
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• pp.56-61
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• 2000

We present a fast inspection method of machine vision for in-line quality assurance of liquid crystal displays(LCD) and plasma display panels(PDP). The method incorporates an optical spatial filter in the Fourier plane of the imaging optics to block the normal periodic pattern, extracting only defects real time without relying on intensive software image process. Special emphasis is on designing a collimated white light source to provide high degree of spatial coherence for effective real time Fourier transform. At the same time, a low level of temporal coherence is attained to improve defect detection capabilities by avoiding undesirable coherent noises. Experimental results show that the proposed inspection method offers a detection accuracy of 15% tolerance, which is sufficient for industrial applications.