• Title/Summary/Keyword: manufacturing defect

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AE Source Location in Planar Defects using Spot Excitation (Spot 가진을 이용한 평면결함의 음향방출 위치표정)

  • Rhee Zhang-Kyu;Park Sung-Oan;Woo Chang-Ki
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.13 no.5
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    • pp.87-95
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    • 2004
  • From the results of AE(Acoustic Emission) source location occurred by the spot exciting as suggested in this research, it has been confirmed that AE technique is quite fruitful in figuring out the location of the occurrence, form, size and direction of the defects. As the results of examining the distribution of event for the angle of crack $\alpha$ to Xs and Ys, as the increases from $0^{\circ}$ ~ $90^{\circ}$, gradually changes its width from the axis Xs to the axis Ys. So event appears approximately similar in its size at the angle of crack $\alpha$=$45^{\circ}$, yet opposite when $\alpha$ is lager. It is believed that this is a phenomenon where its crack legnth $\alpha$, assumed as a planar defect, is to be prcjected toward the direction with a larger size. Thus, it is expected that the application of the experimental method suggested in this study would make it possible to identify the location of the defect in the material in the nondestructive way.

Case Study on the Load-Deflection and Acoustic Emission Analysis of SM45C Coupons with a Circular Hole Defect under Tensile Loading (원공결함을 갖는 SM45C 인장시험편의 강도해석과 음향방출에 관한 사례연구)

  • Woo, Chang-Ki;Rhee, Zhang-Kyu
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.17 no.1
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    • pp.50-58
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    • 2008
  • The SM45C metallic coupons have been tested under static tensile loading with acoustic emission (AE) as the load-deflection curve mainly. In this study, we used AE to detect the yielding of material and AE techniques was applied to rapidly estimate the mechanical characteristics of a material. First, coupons without an artificial defect were tested at different cross-head speed. For all cases in this analysis, yielding point of SM45C coupons did not appear definitely compared to mild steel, whereas coupons start to generate AE counts upon yielding. So all cases are normalized to know the possibility of accelerated life test of a material. And next, coupons with different from sizes of circular hole defects were tested at the same cross-head speed of 5 mm/min. Results were classified into 3 classes and analyzed by AE amplitude & signal strength as a function of time. Summarizing the specific conclusions, we need to additional research considering plate with width-ratio in order to estimate the fracture mechanism.

Effect of Brush Treatment and Brush Contact Sequence on Cross Contaminated Defects during CMP in-situ Cleaning

  • Kim, Hong Jin
    • Tribology and Lubricants
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    • v.31 no.6
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    • pp.239-244
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    • 2015
  • Chemical mechanical polishing (CMP) is one of the most important processes for enabling sub-14 nm semiconductor manufacturing. Moreover, post-CMP defect control is a key process parameter for the purpose of yield enhancement and device reliability. Due to the complexity of device with sub-14 nm node structure, CMP-induced defects need to be fixed in the CMP in-situ cleaning module instead of during post ex-situ wet cleaning. Therefore, post-CMP in-situ cleaning optimization and cleaning efficiency improvement play a pivotal role in post-CMP defect control. CMP in-situ cleaning module normally consists of megasonic and brush scrubber processes. And there has been an increasing effort for the optimization of cleaning chemistry and brush scrubber cleaning in the CMP cleaning module. Although there have been many studies conducted on improving particle removal efficiency by brush cleaning, these studies do not consider the effects of brush contamination. Depending on the process condition and brush condition, brush cross contamination effects significantly influence post-CMP cleaning defects. This study investigates brush cross contamination effects in the CMP in-situ cleaning module by conducting experiments using 300mm tetraethyl orthosilicate (TEOS) blanket wafers. This study also explores brush pre-treatment in the CMP tool and proposes recipe effects, and critical process parameters for optimized CMP in-situ cleaning process through experimental results.

Dynamic behavior of the one-stage gear system with uncertainties

  • Beyaoui, M.;Guerine, A.;Walha, L.;Hami, A. El;Fakhfakh, T.;Haddar, M.
    • Structural Engineering and Mechanics
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    • v.58 no.3
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    • pp.443-458
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    • 2016
  • In this paper, we propose a method for taking into account uncertainties based on the projection on polynomial chaos. Due to the manufacturing and assembly errors, uncertainties in material and geometric properties, the system parameters including assembly defect, damping coefficients, bending stiffness and traction-compression stiffness are uncertain. The proposed method is used to determine the dynamic response of a one-stage spur gear system with uncertainty associated to gear system parameters. An analysis of the effect of these parameters on the one stage gear system dynamic behavior is then treated. The simulation results are obtained by the polynomial chaos method for dynamic analysis under uncertainty. The proposed method is an efficient probabilistic tool for uncertainty propagation. The polynomial chaos results are compared with Monte Carlo simulations.

A Study on an Inspection System of Repeated Pattern in PDP panel

  • Jung, Ji-Hun;Nam, Sang-woon;Hwang, Yong-Ha;Park, Yong-June;Kang, Tea-Kyu;Jeong, Dea-Hwa
    • 제어로봇시스템학회:학술대회논문집
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    • 2004.08a
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    • pp.126-131
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    • 2004
  • The popularity of flat-panel display(FPD), including plasma display panel(PDP) and liquid-crystal display(LCD), has given rise to the need to streamline their production. In these days, PDP is one of the most popular display devices because of its expansion of manufacturing process and simplicity. Bus electrodes, sustain electrodes, barrier ribs and RGB phosphors are patterned on PDP panel to display an image. Since a minute damage on the pattern can cause a serious defect to display, it is important to inspect the pattern precisely. In this paper, an automatic inspection system of repeated pattern in PDP panel has been introduced to find the defect, such as open, short, dirt, island, and so on. And the inspection system has been operated in the mass production line of PDP.

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Process Design in Precision Press Forming of Electronic Components (정밀 전자부품 성형을 위한 소성가공 공정설계)

  • 변상규;최한호;강범수
    • Transactions of Materials Processing
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    • v.4 no.1
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    • pp.79-91
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    • 1995
  • Precision forming of electronic components has appeared to be competitive according to manufacturing cost and dimensional tolerances. Now domestic electronic companies have been involving in utilization of the finite element method in process design of precision forming. A forming process to produce an electronic component, aperture, has been inbestigated to find out forming defects during multi-operations. The applications of the commercial FEM software MARC show a possibility of defect in precision coining process among the whole multi-process. Thus the coining process of three-dimensional deformation is analyzed using DAMF-3D which has been developed in this lab with the rigid-plastic algorithm. The result f simulations by DAMF-3D provides clear description of the defect involved in the coining process.

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Six sigma quality program using Cp (공정능력지수를 이용한 6 시그마 활용)

  • 박기주
    • Journal of Korean Society of Industrial and Systems Engineering
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    • v.20 no.41
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    • pp.135-145
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    • 1997
  • The statistical approach to quality control aims at alerting its user to any variations in the properties of a manufactured product. Motorola developed and pursued a quality management program called six sigma. The goal of six sigma programs is to improve customer satisfaction through reducing and eliminating defects. six sigma uses several statistical measure to characterize defect levels and process capabilities. The upper and lower specification limits are $\pm6\sigma$(sigma) from nominal, and the process mean is centered at nominal. only 0.002PPM are outside specification limits. Cp=2. this is the design target in a six sigma program. This article presents an important tool available for quality control of a production process at the occurrence of defects in manufactured products at view low levels to improve the efficiency of the manufacturing productivity and to satisfy customer through the reduction of defect rates. To understand the consequences of the level of quality on competitive position, a more technical perspective is needed.

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The Product Defectiveness to Products Liability Claims in China (중국의 제조물책임 관련법규에서의 제조물결함에 관한 연구)

  • Lee, Shie-Hwan
    • THE INTERNATIONAL COMMERCE & LAW REVIEW
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    • v.34
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    • pp.3-26
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    • 2007
  • Product liability law lies at the center of the modem world. This law concerns liability for damages arising from the commercial sale of a product that causes personal injury or property damage because it was defective or falsely represented. One engaged in the business of selling or otherwise distributing products who sells or distributes a defective product is subject to liability for harm to persons or property caused by the defect. In short, product defectiveness is the heart of products liability law. Regardless of the underlying cause of action, the plaintiff in nearly every products liability case must prove that the defendant's product contained an unnecessary hazard that caused the harm. The purpose of this paper is to clarify the meaning of the product defectiveness to products liability claims in China. In China, Product to include most movable personal property, but to exclude services. And a product is defective when, at the time of sale or distribution, it contains a manufacturing defect, is defective in design, or is defective because of inadequate instructions or warnings.

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Rapid Defect Inspection of Display Device with Optical Spatial Filtering

  • Yoon, Dong-Seon;Kim, Seung-Woo
    • International Journal of Precision Engineering and Manufacturing
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    • v.1 no.1
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    • pp.56-61
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    • 2000
  • We present a fast inspection method of machine vision for in-line quality assurance of liquid crystal displays(LCD) and plasma display panels(PDP). The method incorporates an optical spatial filter in the Fourier plane of the imaging optics to block the normal periodic pattern, extracting only defects real time without relying on intensive software image process. Special emphasis is on designing a collimated white light source to provide high degree of spatial coherence for effective real time Fourier transform. At the same time, a low level of temporal coherence is attained to improve defect detection capabilities by avoiding undesirable coherent noises. Experimental results show that the proposed inspection method offers a detection accuracy of 15% tolerance, which is sufficient for industrial applications.

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Quantitative Evaluation of Impact Defects inside of Composite Material Plate by ESPI (ESPI를 이용한 충격손상을 받은 복합재료 내부결함의 정량평가)

  • 김경석;양광영;장호섭;지창준;윤홍석
    • Proceedings of the Korean Society of Machine Tool Engineers Conference
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    • 2003.10a
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    • pp.254-258
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    • 2003
  • Electronic Speckle Pattern for quantitative evaluation of a impact defect inside of composite material plate are described. The impact on composite material makes inside delamination which is difficult to detect visual inspection and ultrasonic testing due to non-homeogenous structure. This paper proposes the quantitative evaluation technique of defects under real impact. Artificial defects are designed inside of composite plate for development of inspection technique and real defects under impact are inspected and compared with results of visual inspection.

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