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Lee, Hyun-Joo;Kim, So-Jeong;Lee, Seung-Yeon;Lee, Seung-Jun;Shin, Hyung-Soon
- Journal of the Institute of Electronics Engineers of Korea SD
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- v.45 no.12
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- pp.1-7
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- 2008
Magnetic Tunneling Junction (MTJ) has been used as a nonvolatile universal storage element mainly in memory technology. However, according to several recent studies, magneto-logic using MTJ elements show much potential in substitution for the transistor-based logic device. Magneto-logic based on MTJ can maintain the data during the power-off mode, since an MTJ element can store the result data in itself. Moreover, just by changing input signals, the full logic functions can be realized. Because of its programmability, it can embody the reconfigurable magneto-logic circuit in the rigid physical architecture. In this paper, we propose a novel 3-bit arbitrary magneto-logic circuit beyond the simple combinational logic or the short sequential one. We design the 3-bit magneto-logic which has the most complexity using MTJ elements and verify its functionality. The simulation results are presented with the HSPICE macro-model of MTJ that we have developed in our previous work. This novel magneto-logic based on MTJ can realize the most complex logic function. What is more, 3-bit arbitrary logic operations can be implemented by changing gate signals of the current drivel circuit.
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Shin, Byul;Park, Ik Hyun;Chung, Chee Won
- Korean Chemical Engineering Research
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- v.43 no.4
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- pp.531-536
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- 2005
Inductively coupled plasma reactive ion etching of CoTb and CoZrNb magnetic materials with the photoresist mask was performed using $Cl_2/Ar$ and $C_2F_6/Ar$ gas mixtures and characterized in terms of etch rate and etch profile. As the concentrations of $Cl_2$ and $C_2F_6$ gases increased, the etch rates of magnetic films decreased and the etch slopes became slanted. The $Cl_2/Ar$ gas was more effective in obtaining fast etch rate and steep sidewall slope than the $C_2F_6/Ar$ gas. As the coil rf power and dc bias increased, fast etch rate and steep etch slope were obtained but the redeposition on the sidewall was observed. This is due to the increase of ion and radical densities in plasma with increasing the coil rf power and the increase of incident ion energy to the substrate with increasing the dc bias voltage. By applying high density reactive ion etching to magnetic tunnel junction stack containing various magnetic films and metal oxide, steep etch slope and clean etch profile without redeposition were obtained.
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