• 제어로봇시스템학회논문지
• /
• 제22권7호
• /
• pp.557-561
• /
• 2016

Recently, in the manufacturing process of flat panel displays, mass production methods of inline system has been emerged. In particular the next generation OLED display manufacturing process, horizontal inline evaporation process has been tried. It is important for the success of OLED inline evaporation process to develop a magnetic levitation transport system capable of transferring a carrier equipped with a mother glass with high accuracy without any physical contact along the rail under vacuum condition. In the case of existing wheel-based transfer system, it is not suitable for OLED evaporation process requiring high cleanliness. On the other hand, the magnetic levitation transport system has an advantage that it does not generate any dust and it is possible to achieve high-precision control because there are not non-linear factors such as friction force. In this paper, we introduce the high-precision magnetic levitation transport system, which is currently under development, for OLED evaporation process.

• 전기학회논문지
• /
• 제67권1호
• /
• pp.87-95
• /
• 2018

The high-precision magnetic levitation transport system is a transport device applying the principle of magnetic levitation. So it is preferable for manufactory process of semiconductor and display industries. In this system, the gap sensors are arranged discontinuously and turned on or off when the tray moves in the running direction. Therefore, precise gap data is important for precise control of the carrier. However, a slight error occurs in the process of installing the gap sensor. So, in this paper, we introduce the high-precision magnetic levitation transport system for OLED evaporation process. Also, we propose a strategy for stable flight control and an offset algorithm for tracking installation errors transport system. The performances of the proposed algorithm are validated through simulation.

• 대한기계학회논문집A
• /
• 제21권12호
• /
• pp.2196-2208
• /
• 1997

In this work, a magnetic levitation (maglev) system is developed to transport a wafer between semiconductor fabrication process modules in clean rooms to take advantages of eliminating particle and oil contamination that normally exist in conventional transport systems due to contact motion of mechanical components. A main feature of the maglev system developed in this work is that a controller and power supplying part are not mounted on the moving carrier but on the stationary track, which is defined a controller-free carrier, to reduce carrier's weight. Iron-core electromagnets and irons are used for levitation, and air-core electromagnets and permanent magnets are used for stabilization. Analysis, design, and modeling of the magnetically levitated transport system are presented. The performance of the maglev system is experimentally demonstrated.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2007년도 추계학술대회논문집
• /
• pp.1241-1246
• /
• 2007

In recent years, the semiconductor industry and the optical industry are developed rapidly. The recent demands have expanded for optical components such as the optical lens, the optical semiconductor and the measuring instrument. Object transport systems are driven typically by the magnetic field and the conveyer belt. Recent industry requires more faster and efficient transport system. However, conventional transport systems are not adequate for transportation of optical elements and semiconductors. The conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. The steady state flexural vibration of the beam is expressed using Euler-Bernoulli beam theory. The transport direction of an object is examined according to phase difference and frequency. The theoretical results are verified by experiments.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2005년도 추계학술대회논문집
• /
• pp.959-962
• /
• 2005

In the semiconductor and optical industry. a new transport system which can replace the conventional transport system is required. The Transport systems are driven by the magnetic field and conveyer belts. The magnetic field may damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this semiconductor and optical industry, the non-contact system is required for reducing the damages. The ultrasonic transportation is the solution of the problem. In this paper, the ultrasonic levitation system for levitation object are proposed. The 3D vibration profiles of the beam are measured by Laser Scanning Vibrometer for verifying the vibration characteristics of the system and the amplitudes of the beam and the levitation heights of object are measured fore evaluating the performance.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2005년도 추계학술대회 논문집
• /
• pp.415-418
• /
• 2005

In the semiconductor and optical industry, a new transport system which can replace the conventional transport systems is required. The transport systems are driven by the magnetic field and conveyer belts. The magnetic field may damage semiconductor and the contact force may scratch the optical lens. The ultrasonic wave driven system can solve these problems. In this semiconductor and optical industry, the non-contact system is required fur reducing the damages. The ultrasonic transportation is the solution of the problem. In this paper, the ultrasonic levitation system fur levitating object are proposed. The 3D vibration profiles of the beam are measured by Laser scanning Vibrometer fur verifying the vibration characteristics of the system and the amplitudes of the beam and the levitation heights of object are measured for evaluating the performance.

• 한국정밀공학회:학술대회논문집
• /
• 한국정밀공학회 2006년도 춘계학술대회 논문집
• /
• pp.331-332
• /
• 2006

Transport systems which are the important part of the factory automation have much influence on improving productivity. Object transport systems are driven typically by the magnetic field and conveyer belt. In recent years, as the transmission and processing of information is required more quickly, demands of optical elements and semiconductors increase. However, conventional transport systems are not adequate for transportation of those. The reason is that conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. Vibration modes of each flexural beam are verified by using Laser Scanning Vibrometer.

• 한국소음진동공학회:학술대회논문집
• /
• 한국소음진동공학회 2006년도 추계학술대회논문집
• /
• pp.792-796
• /
• 2006

In recent years, the semiconductor industry and the optical industry is developed rapidly. The recent demand has expanded for optical components such as a optical lens, a optical semiconductor and a measuring instrument. Object transport systems are driven typically by the magnetic field and the conveyer belt. Recent industry requires more faster and efficient transport system. However, conventional transport systems are not adequate for transportation of optical elements and semiconductors. Because conveyor belts can damage precision optical elements by the contact force and magnetic systems can destroy the inner structure of semiconductor by the magnetic field. In this paper, the levitation transport system using ultrasonic wave is developed for transporting precision elements without damages. This transport system is using 2-mode ultrasonic wave excitation and flexural beam modes shapes are evaluated. It compared simulation results with experimental results

• 융복합기술연구소 논문집
• /
• 제3권2호
• /
• pp.11-15
• /
• 2013

These days, the quality of goods is required to improve in the process of manufacturing the semiconductor through the short working hours and clean transportation. The non-contact transport device using magnetic levitation can be a solution in the manufacturing process. The non-contact transport device, using electromagnetic actuation, is the system that can actually transport them by only using attraction force from the electromagnetic source without authentic contact. Moreover, the system using electromagnetic force has a substantial number of benefits ranging from unrestricted design to unlimited expansion. Especially, the price is competitive. The non-contact transport device, using electromagnetic force, has another merits in controlling by giving the same amount of attraction force to ferromagnetic body. By controlling the currents given to coil, the operator is able to decide the direction of the transportation. In order to design the optimal system, we implemented five different things such as the presence of the links below the electromagnetic, the electromagnet changes due to coupling method, the change according to the thickness of the links below electromagnet, due to changes in between electromagnetic distance direction, and the size of the current. Through simulations and the optimum design, it seems to control easily and figure out the exact size of power. It might definitely be the non-contact transport that can sharply reduce tiny scratches and particles in the process of manufacturing the semiconductor.

• 센서학회지
• /
• 제25권5호
• /
• pp.310-319
• /
• 2016

Three types of gap sensors, a capacitive gap sensor, an eddy current gap sensor, and a Hall effect gap sensor are described and evaluated through experiments for the purpose of precise gap sensing for micrometer scale movement, and a novel type of differential hall effect gap sensor is proposed. Each gap sensor is analyzed in terms of resolution and environment dependency including temperature dependency. Furthermore, a transport system for AMOLED deposition is introduced as a typical application of gap sensors, which are recently receiving considerable attention. Based on the analyses, the proposed differential Hall effect gap sensor is found to be the most suitable gap sensor for precise gap sensing, especially for application to a transport system for AMOLED deposition. The sensor shows resolution of $0.63mV/{\mu}m$ for the overall range of the gap from 0 mm to 2.5 mm, temperature dependency of $3{\mu}m/^{\circ}C$ from $20^{\circ}C$ to $30^{\circ}C$, and a monotonic characteristic for the gap between the sensor and the target.