• Tribology and Lubricants
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• v.34 no.5
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• pp.197-207
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• 2018

Thermal deterioration of fuel due to long-term storage influences engine performance and causes malfunctions. Fuel stability is usually evaluated via heat resistance and thermal stability during a brief heat shock at high temperature; storage stability in this scenario means that there is very little change in the quality of the fuel during long-term storage. In addition, rubber-based products such as oil seals, O-rings, and rubber hoses can influence the quality of the fuel. When these rubber products are in contact with fuel, they can swell, mechanically weaken, and occasionally crack, thus leaking low molar weight rubber and additives including plasticizer and antioxidant into the fuel to degrade its properties and shorten its useful lifetime. This study determines the thermal stabilities of three kinds of synthetic fuels by evaluating their low temperature kinematic viscosities, chemical composition changes via GC analyses, gross heat of combustion, and color changes. We evaluate the compression set of O-rings by immersing one NBR and two FKM rubber O-rings in the three synthetic fuel samples in airtight containers at variable storage temperatures for six months; from this, we estimate the lifetimes of the O-rings using the Power law model. There were very little changes in the chemical compositions and gross heat of combustion after six months of the experiment. The lifetimes are thus dependent on the materials of the rubber products, and in particular, the FKM O-ring was calculated to have a theoretical lifetime of 200 to 5,700 years. These results indicate that the synthetic fuels maintain their physical properties even after long-term storage at high temperatures, and the FKM O-ring is suitable for long-term sealing of these fuels.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.2
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• pp.31-43
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• 2019

In this study, polymer elastic bumps were fabricated for the flexible electronic package flip chip bonding and the viscoelastic and viscoplastic behavior of the polymer elastic bumps according to the temperature and load were analyzed using FEM and experiments. The polymer elastic bump is easy to deform by the bonding load, and it is confirmed that the bump height flatness problem is easily compensated and the stress concentration on thin chip is reduced remarkably. We also develop a spiral cap type and spoke cap type polymer elastic bump of $200{\mu}m$ diameter to complement Au metal cap crack phenomenon caused by excessive deformation of polymer elastic bump. The proposed polymer elastic bumps could reduce stress of metal wiring during bump deformation compared to metal cap bump, which is completely covered with metal wiring because the metal wiring on these bumps is partially patterned and easily deformable pattern. The spoke cap bump shows the lowest stress concentration in the metal wiring while maintaining the low contact resistance because the contact area between bump and pad was wider than that of the spiral cap bump.