• 한국세라믹학회지
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• 제37권6호
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• pp.545-551
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• 2000

Sintering behaviors of the glass-alumina composites for low firing temperature were investigated as a function of the particle size of glass frit. The system of glass frit was Pb-B-Si-Al-O. The median particle sizes of the glass frits were 2.72$\mu\textrm{m}$, 2.67$\mu\textrm{m}$ and 1.33$\mu\textrm{m}$, which were prepared with changing ball-milling times as 24 h, 48 h and 96 h. The glass-alumina composites showed maximum density at certain temperature, and further heating led to dedensification behaviors, so called over-firing. The sintering temperature, which showed maximum density, raised from 425$^{\circ}C$ to 475$^{\circ}C$ with increase of particle size of glass frit from 1.33$\mu\textrm{m}$ to 2.72$\mu\textrm{m}$. Especially, the over firing behaviors, which were occurred at high sintering temperatures, were greatly increased with decrease of particle size of glass frit.

• 한국전기전자재료학회논문지
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• 제21권6호
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• pp.517-523
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• 2008

The microwave dielectric properties of $LiNb_3O_8-TiO_2$ based ceramics with low firing agents, CuO, $Bi_2O_3$, $B_2O_3$, $SiO_2$, $TiO_2$, were investigated to improve the sintering condition for the LTCC system. According to the X-ray diffraction and SEM, the ceramics of $LiNb_3O_8-TiO_2$ with low firing agents showed no significant second phases within a range of experiments, and fine microstructures. By adding the low firing agents, the sintering temperature decreased from $1200^{\circ}C$ to $925^{\circ}C$. Based on the results of electrical measurements, the $LiNb_3O_8-TiO_2$ ceramics showed a promising microwave dielectric properties for LTCC applications, those are ${\varepsilon}_r$ (dielectric constant) = 44, Q f (quality factor) = 18000, and ${\tau}_f$ (the temperature coefficient of resonant frequency) = $-1.5\;ppm/^{\circ}C$.

• 한국세라믹학회지
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• 제31권4호
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• pp.381-388
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• 1994

A new process which co-fires the low-firing-substrate and copper conductor was studied to achieve good bond strength and low sheet resistance of conductor. Cupric oxide is used as the precursor of conductive material in the new method and the firing atmosphere of the new process is changed sequently in air H2N2. The addition of cupric oxide and variations of firing atmosphere permited complete binder-burnout in comparison with the conventional method and contributed to the improvement of resistance and bonding behaviors. The potimum conditions of this experiment to obtain the satisfactory resistance and bond strength are as follows (binder-burnout temperature in air; 55$0^{\circ}C$, reducing temperature in H2; 40$0^{\circ}C$ for 30 min, ratio of copper and cupric oxide; 60:40~30:70 wt%). The bonding mechanism between the substrate and metal was explained by metal diffusion layer in the interface and the bond strength mainly depended on the stress caused by the difference of shrinkage and thermal expansion coefficient between the substrate and metal.

• 한국인쇄학회:학술대회논문집
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• 한국인쇄학회 2007년도 추계 학술논문 발표회
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• pp.75-81
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• 2007

As manufacturing the low temperature firing paste applicable flat light source for LCD BLU, this study examined the specific quality. For the phosphor pastes, the low temperature firing acryl resin is used as the binder resin. As the result of thermal decomposition characteristics, residual hydroxylcarbon rested under 0.1wt% on 400$^{\circ}C$. With the manufactured paste in this study, the flat light source device is manufactured through the screen printing and it brought the almost 100% of special quality radiation about the phosphor brightness.

• 한국세라믹학회지
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• 제37권7호
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• pp.638-644
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• 2000

The sintering behaviors of the glass-alumina composites for low firing temperature were investigated as functiions of the volume fraction of alumina powder and the particle size with respect to porosity and pore shape. As the volume fraction of alumina powder was increased or the particle size of it was decreased, the sintering temperature of open pore-closing was raised. When the volume fractions of alumina which had 2.19$\mu\textrm{m}$ median diameter were increased with 20, 30, 40, and 50%, the sintering temperatures of open pore-closing were 425, 450, 475, and 500$^{\circ}C$. And when the median particle size of alumina was diminished from 2.19$\mu\textrm{m}$ to 0.38$\mu\textrm{m}$, the sintering temperature of open pore-closing was increased from 450$^{\circ}C$ to 475$^{\circ}C$. Especially, the sintering temperature, which showed maximum density, was corresponded with the stage of open pore-closing and after achieving maximum density over heating resulted in dedensification of specimen, so called, over-firing behavior.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.278-278
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• 2007

Ag conductive thick film has been used in bus and address electrodes of PDP (Plasma display panel). In PDP fabrication, the firing temperature of electrode is normally $550{\sim}580^{\circ}C$. For the application of PDP industry, we investigated an Ag conductive thick film with firing temperature. Low melting glass frit was used in the conductive thick film. The thermal properties of Ag and frit were determined by a hot stage microscopy. Based on the our results, we suggest that the Ag conductive thick film should be considered of the firing temperature which is correlated to the shrinkage, conductivity, and shape of thick film.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 춘계학술대회 논문집
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• pp.673-676
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• 1999

We fabricated green sheet by tape casting method with fluormica glass-ceramic powders for fabrication of low temperature co-firing substrate. After ball milling with organic additives, we investigated green strength and density of green sheets which were casted by doctor blade machine. Green sheets were sintered at 700 ~ 1,00$0^{\circ}C$ for 1 ~3hrs. Microstructure, linear shrinkage and dielectric constant of substrates were surveyed.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 추계학술대회 초록집
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• pp.53.2-53.2
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• 2010

In this study, we focused on our specialized electrode process for Si back-contact crystalline solar cell. It is different from other well-known back-contact cell process for thermal aspect and specialized process. In general, aluminum makes ohmic contact to the Si wafer and acts as a back surface reflector. And, silver is used for low series resistance metal grid lines. Aluminum was sputtered onto back side of wafer. Next, silver is directly patterned on the wafer by screen printing. The sputtered aluminum was removed by wet etching process after rear silver electrode was formed. In this process, the silver paste must have good printability, electrical property and adhesion strength, before and after the aluminum etching process. Silver paste also needs low temperature firing characteristics to reduce the thermal budget. So it was seriously collected by the products of several company of regarding low temperature firing (below $250^{\circ}C$) and aluminum etching endurance. First of all, silver pastes for etching selectivity were selected to evaluate as low temperature firing condition, electrical properties and adhesive strength. Using the nano- and micron-sized silver paste, so called hybrid type, made low temperature firing. So we could minimize the thermal budget in metallization process. Also the adhesion property greatly depended on the composition of paste, especially added resin and inorganic additives. In this paper, we will show that the metallization process of back-contact solar cell was realized as optimized nano-paste characteristics.

• 건축역사연구
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• 제25권3호
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• pp.37-45
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• 2016

This study was to investigate the firing method of limestone in Joseon Dynasty, and analyze the physical chemical properties of lime mortars in Joseon Dynasty. This study was to manufacture and evaluate the firing experiment and mortar of Limestone by each sort in order to reproduce the traditional lime mortars in Joseon Dynasty, and investigate the behavior to improve physical properties according to the firing method of Limestone. This study has found out that there were screening criteria and standard of appropriate firing temperature about the Limestone in Joseon Dynasty. Accordingly, this study was to improve its strength through various additives and mixture. In particular, in case of Limestone, the black and blue Limestone were preferred, and most of domestic Limestones were low grade Limestone including the clay and took ivory white or blue with low whiteness. This study has shown that the low grade Limestone was mined by the surface mining compared with the high grade Limestone as underground mining method, and could be used because it was easy to mine relatively and there was possibility that Natural Hydraulic Lime(NHL) was used with the traditional lime mortars in Joseon Dynasty.

• 한국세라믹학회지
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• 제29권10호
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• pp.827-835
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• 1992

The effects of CeO2 on the properties of cordierite-based glass-ceramics and its applicability to low firing temperature substrate were examined. Glass-ceramics were prepared by sintering the glass powder compacts at 900~100$0^{\circ}C$ for 3 h. Density, bending strength, dielectric constant and thermal expansion coefficient of the glass-ceramics were measured as functions of CeO2 contents and sintering temperatures. By adding CeO2, dense glass-ceramics were obtained below 100$0^{\circ}C$. dielectric constant and bending strength were more dependent on the porosity of glass-ceramics containing 5 wt% CeO2, sintered at 100$0^{\circ}C$ for 3 h, were as follows; relative density is 95.3%, bending strength is 178$\pm$11 MPa, dielectric constant is 4.98$\pm$0.20 (at 1 MHz) and thermal expansion coefficient is 33.7$\times$10-7/$^{\circ}C$. Therefore, the glass-ceramics containing 5 wt% CeO2 appeared to be suitable for low firing temperature substrate of electronic devices.