• Title/Summary/Keyword: low temperature embedding

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Finite Element Analysis for Behavior of Aluminum Alloy Embedding a Particle under Equal Channel Angular Pressing (ECAP 공정시 강화상이 첨가된 금속기지 거동에 대한 유한요소해석)

  • Lee, S.C.;Ha, S.R.;Kim, K.T.;Chung, H.S.
    • Proceedings of the KSME Conference
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    • 2003.11a
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    • pp.1157-1162
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    • 2003
  • Behavior of aluminum alloy embedding a particle was investigated at room temperature under ECAP. Finite element analysis by using ABAQUS shows that ECAP is a useful tool for eliminating residual porosity in the specimen, and much more effective under friction condition. The simulation, however, shows considerably low density distributions for matrix near a particle at which rich defects may occur during severe deformation. Finite element results of effective strains and deformed shapes for matrix with a particle were compared with theoretical calculations under simple shear stress. Also, based on the distribution of the maximum principal stress in the specimen, Weibull fracture probability was obtained for particle sizes and particle-coating layer materials. The probability was useful to predict the trend of more susceptible failure of a brittle coating layer than a particle without an interphase in metal matrix composites.

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Modeling of High-speed 3-Disional Embedded Inductors (고속 3차원 매립 인덕터에 대한 모델링)

  • 이서구;최종성;윤일구
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.07a
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    • pp.139-142
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    • 2001
  • As microeletronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important for many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (5-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

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Modeling of 3-D Embedded Inductors Fabricated in LTCC Process (저온 동시소성 공정으로 제작된 3차원 매립 인덕터 모델링)

  • 이서구;최종성;윤일구
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.15 no.4
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    • pp.344-348
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    • 2002
  • As microelectronics technology continues to progress, there is also a continuous demand on highly integration and miniaturization of systems. For example, it is desirable to package several integrated circuits together in multilayer structure, such as multichip modules, to achieve higher levels of compactness and higher performance. Passive components (i.e., capacitors, resistors, and inductors) are very important fort many MCM applications. In addition, the low-temperature co-fired ceramic (LTCC) process has considerable potential for embedding passive components in a small area at a low cost. In this paper, we investigate a method of statistically modeling integrated passive devices from just a small number of test structures. A set of LTCC inductors is fabricated and their scattering parameters (s-parameters) are measured for a range of frequencies from 50MHz to 5GHz. An accurate model for each test structure is obtained by using a building block based modeling methodology and circuit parameter optimization using the HSPICE circuit simulator.

A Study on the Optimum Design for LTCC Micro-Reformer: (Performance Evaluation of Various Flow Channel Structures ('LTCC를 소재로 하는 마이크로 리포머의 최적 설계에 관한 연구: (다양한 채널구조에 따른 성능변화 고찰)')

  • Chung Chan-Hwa;Oh Jeong-Hoon
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2006.05a
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    • pp.551-552
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    • 2006
  • The miniature fuel cells have emerged as a promising power source for applications such as cellular phones, small digital devices, and autonomous sensors to embedded monitors or to micro-electro mechanical system (MEMS) devices. Several chemicals run candidate at a fuel in those systems, such as hydrogen. methanol, ethanol, acetic acid, and di-methyl ether (DME). Among them, hydrogen shows most efficient fuel performance. However, there are some difficulties in practical application for portable power sources. Therefore, more recently, there have been many efforts for development of micro-reformer to operate highly efficient micro fuel cells with liquid fuels such as methanol, ethanol, and DME In our experiments, we have integrated a micro-fuel processor system using low temperature co-fired ceramics (LTCC) materials. Our integrated micro-fuel processor system is containing embedded heaters, cavities, and 3D structures of micro- channels within LTCC layers for embedding catalysts (cf. Figs. 1 and 2). In the micro-channels of LTCC, we have loaded $CuO/ZnO/Al_2O_3$ catalysts using several different coating methods such as powder packing or spraying, dipping, and washing of catalyst slurry.

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The characteristics of bismuth magnesium niobate multi layers deposited by sputtering at room temperature for appling to embedded capacitor (임베디드 커패시터로의 응용을 위해 상온에서 RF 스퍼터링법에 의한 증착된 bismuth magnesium niobate 다층 박막의 특성평가)

  • Ahn, Jun-Ku;Cho, Hyun-Jin;Ryu, Taek-Hee;Park, Kyung-Woo;Cuong, Nguyen Duy;Hur, Sung-Gi;Seong, Nak-Jin;Yoon, Soon-Gil
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.06a
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    • pp.62-62
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    • 2008
  • As micro-system move toward higher speed and miniaturization, requirements for embedding the passive components into printed circuit boards (PCBs) grow consistently. They should be fabricated in smaller size with maintaining and even improving the overall performance. Miniaturization potential steps from the replacement of surface-mount components and the subsequent reduction of the required wiring-board real estate. Among the embedded passive components, capacitors are most widely studied because they are the major components in terms of size and number. Embedding of passive components such as capacitors into polymer-based PCB is becoming an important strategy for electronics miniaturization, device reliability, and manufacturing cost reduction Now days, the dielectric films deposited directly on the polymer substrate are also studied widely. The processing temperature below $200^{\circ}C$ is required for polymer substrates. For a low temperature deposition, bismuth-based pyrochlore materials are known as promising candidate for capacitor $B_2Mg_{2/3}Nb_{4/3}O_7$ ($B_2MN$) multi layers were deposited on Pt/$TiO_2/SiO_2$/Si substrates by radio frequency magnetron sputtering system at room temperature. The physical and structural properties of them are investigated by SEM, AFM, TEM, XPS. The dielectric properties of MIM structured capacitors were evaluated by impedance analyzer (Agilent HP4194A). The leakage current characteristics of MIM structured capacitor were measured by semiconductor parameter analysis (Agilent HP4145B). 200 nm-thick $B_2MN$ muti layer were deposited at room temperature had capacitance density about $1{\mu}F/cm^2$ at 100kHz, dissipation factor of < 1% and dielectric constant of > 100 at 100kHz.

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Prevention of Early Frost Damage of the Concrete under Severely Low Temperature according to Heat Curingmethods (극저온 조건에서 보온양생 방법 변화에 따른 콘크리트의 초기동해 방지)

  • Han, min-Cheol
    • Journal of the Korea Institute of Building Construction
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    • v.16 no.1
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    • pp.67-76
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    • 2016
  • Concrete exposed to severely low temperature below $-20^{\circ}C$ should be provided with proper heat supplying curing to protect the concrete from early frost damage at the time of pouring.meanwhile, so far, effective heat curingmethods of the concrete under severely low temperature are not well established in Korea. For this reason, the objective of this paper is to provide effective heat curingmethod of concrete exposed to severely low temperature to protect early frost damage by varying the combination of heat curingmaterial combinations. Temperature history,maturity development and core strength results are investigated. Fourmock-up specimens simulating slab, wall and column were prepared and heat insulation, heat supplying and both were applied. Test results indicate that the combination of quadruple layer bubble sheet(4BS) and embedding of heating cable has desirable performance for a slab, and heat supplying curing inside heat enclosure and heat generationmat also shows desirable performance for a wall, and for a column, use of EPS heat insulation has proper performance against early frost damage, which reaches $45^{\circ}D{\cdot}D$ and helps the concretemaintain above $0^{\circ}C$ within 3 days. Themethodsmentioned above are believed to be optimum protection from early frost damage of the concrete under $-20^{\circ}C$.

Thermal buckling of rectangular sandwich plates with advanced hybrid SMA/CNT/graphite/epoxy composite face sheets

  • Saeed Kamarian;Jung-Il Song
    • Advances in nano research
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    • v.14 no.3
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    • pp.261-271
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    • 2023
  • The present study follows three main goals. First, an analytical solution with high accuracy is developed to assess the effects of embedding pre-strained shape memory alloy (SMA) wires on the critical buckling temperatures of rectangular sandwich plates made of soft core and graphite fiber/epoxy (GF/EP) face sheets based on piecewise low-order shear deformation theory (PLSDT) using Brinson's model. As the second goal, this study compares the effects of SMAs on the thermal buckling of sandwich plates with those of carbon nanotubes (CNTs). The glass transition temperature is considered as a limiting factor. For each material, the effective ranges of operating temperature and thickness ratio are determined for real situations. The results indicate that depending on the geometric parameters and thermal conditions, one of the SMAs and CNTs may outperform the other. The third purpose is to study the thermal buckling of sandwich plates with advanced hybrid SMA/CNT/GF/EP composite face sheets. It is shown that in some circumstances, the co-incorporation of SMAs and CNTs leads to an astonishing enhancement in the critical buckling temperatures of sandwich plates.

Improvement of Impact Resistance of Composite Structures using Shape Memory Alloys (형상기억합금을 이용한 복합재료 구조물의 저속충격특성 향상)

  • Kim, Eun-Ho;Rim, Mi-Sun;Lee, In;Kim, Hyung-Won
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2009.11a
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    • pp.453-456
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    • 2009
  • Impact resistance of shape memory alloy hybrid composite(SMAHC) plates were experimentally investigated. Shape memory alloy(SMA) have large failure strain and failure stress and can absorb large strain energies through phase transformation. SMA wires were embedded in composite plates to improve their weak impact resistance. Tensile tests of SMA wires were performed at various temperature to investigate their thermo-mechanical properties. Low-Velocity impact tests of several types of composite plates with SMA/Al/Fe were performed. Embedding SMA wires was most effective to improve impact resistance of composite plates. The effects of SMA position on impact resistance were also investigated.

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Cellular and Molecular Pathology of Fungi on Plants Studied by Modern Electron Microscopy

  • Sanwald, Sigrun-Hippe
    • Proceedings of the Korean Society of Plant Pathology Conference
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    • 1995.06b
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    • pp.27-53
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    • 1995
  • In plant pathology there is an increasing necessity for improved cytological techniques as basis for the localization of cellular substances within the dynamic fine structure of the host-(plant)-pathogen-interaction. Low temperature (LT) preparation techniques (shock freezing, freeze substitution, LT embedding) are now successfully applied in plant pathology. They are regarded as important tools to stabilize the dynamic plant-pathogen-interaction as it exists under physiological conditions. - The main advantage of LT techniques versus conventional chemical fixation is seen in the maintenance of the hydration shell of molecules and macromolecular structures. This results in an improved fine structural preservation and in a superior retention of the antigenicity of proteins. - A well defined ultrastructure of small, fungal organisms and large biological samples such as plant material and as well as the plant-pathogen (fungus) infection sites are presented. The mesophyll tissue of Arabidopsis thaliana is characterized by homogeneously structured cytoplasm closely attached to the cell wall. From analyses of the compatible interaction between Erysiphe graminis f. sp. hordei on barley (Hordeum vulgare), various steps in the infection sequence can be identified. Infection sites of powdery mildew on primary leaves of barley are analysed with regard to the fine structural preservation of the haustoria. The presentation s focussed on the ultrastructure of the extrahaustorial matrix and the extrahaustorial membrane. - The integration of improved cellular preservation with a molecular analysis of the infected host cell is achieved by the application of secondary probing techniques, i.e. immunocytochemistry. Recent data on the characterization of freeze substituted powdery mildew and urst infected plant tissue by immunogold methodology are described with special emphasis on the localization of THRGP-like (threonine-hydrxyproline-rich glycoprotein) epitopes. Infection sites of powdery mildew on barley, stem rust as well as leaf rust (Puccinia recondita) on primary leaves of wheat were probed with a polyclonal antiserum to maize THRGP. Cross-reactivity with the anti-THRGP antiserum was observed over the extrahaustorial matrix of the both compatible and incompatible plant-pathogen interactions. The highly localized accumulation of THRGP-like epitopes at the extrahaustorial host-pathogen interface suggests the involvement of structural, interfacial proteins during the infection of monocotyledonous plants by obligate, biotrophic fungi.

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Measurement of Material Properties of Composites under High Temperature using Fiber Bragg Grating Sensors (광섬유 브래그 격자 센서를 이용한 고온용 복합재료의 물성 측정)

  • 강동훈;박상욱;김수현;홍창선;김천곤
    • Composites Research
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    • v.16 no.6
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    • pp.41-47
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    • 2003
  • Composites are widely used for aircraft, satellite and other structures due to its good mechanical and thermal characteristics such as low coefficient of thermal expansion(CTE), heat-resistance, high specific stiffness and specific strength. In order to use composites under condition of high temperature, however, material properties of composites at high temperatures must be measured and verified. In this paper, material properties of T700/Epoxy were measured through tension tests of composite specimens with an embedded FBG sensor in the thermal chamber at the temperatures of RT, $100^{\circ}$, $200^{\circ}$, $300^{\circ}$, $300^{\circ}$. Through the pre-test of an embedded optical fiber, we confirmed the embedding effects of an optical fiber on material properties of the composites. Two kinds of specimens of which stacking sequences are [0/{0}/0]$_{T}$. and [$90_2$/{0}/$90_2$]. were fabricated. From the experimental results, material property changes of composites were successfully shown according to temperatures and we confirmed that fiber Bragg grating sensor is very appropriate to strain measurement of composites under high temperature.