• Journal of the Korean Society for Precision Engineering
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• v.13 no.11
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• pp.38-45
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• 1996

In recent years, ultrasonic has been widely applied in measurement and industrial fields and its application range has been expanded as a result of continuous research and development. Wire Bonding Machine, an instrument fabricating semi-conductor, makes use of ultrasonic bonding method. Specially, the method utilizes the longitudinal vibration of ultrasonic transducer composed of piezoelectric vibrator and horn. This work investigates the design conditions affecting the dynamic characteristics through the theretical and experimental analysis. It conducts separately the system identification of piezoelectric vibrator in time domain and the modal analysis of horn in frequency domain. The integrated modeling is conducted via a combbination of dynamic identification of piezoelectric vibrator and theroretical analysis of horn. Then comparison is made for theroretical and experimental results of the dynamic characteristics of the ultrasonic transducer comprised of piezoelectric vibrator and horn. Form the results of the comparison we develop the design technique of ultrasonic transducer using dynamic characteristics analysis and propose the possibility of ultrasonic bonding considering the optimal conditions for the longitudinal vibration of ultrasonic transducer and other conditions.

• Korean Journal of Child Studies
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• v.31 no.1
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• pp.1-17
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• 2010

This study explored the differences in gender, developmental period and parents in terms of parenting, the cross-sectional and longitudinal relationships in parenting by gender, and the cross-sectional and longitudinal relationships between participant roles in bullying situations and parenting by gender. The subjects were 498 4-5th grade children and the instruments utilized in this study were the Parental Bonding Instrument (Bowers, Smith, & Binney, 1994) and the Participant Roles Scale (Sutton & Smith, 1999). The subjects were contacted again one year after the first contact. Results showed that the relationships between parents were longitudinally quite stable. Girls whose fathers had higher levels of accurate monitoring were more likely to be defenders cross-sectionally. Girls whose parents had more accurate monitoring were less likely to be victims longitudinally. The results underscore the importance of examining both gender and participant roles in bullying situations.

• Nuclear Engineering and Technology
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• v.54 no.4
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• pp.1221-1229
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• 2022

In this work, the guided wave de-bonding area-detecting technique was studied for application to containment liner plates in nuclear power plant areas. To apply this technique, an appropriate Lamb wave mode, symmetric and longitudinal dominance, was verified by the frequency shifting technique. The S0 2.7 MHz mm Lamb wave mode was chosen to realize quantitative experimental results and their visualization. Results of the bulk wave, longitudinal wave mode, and comparison experiments indicate that the wave mode was able to distinguish between the de-bonded and bonded areas. Similar to the bulk wave cases, the bonded region could be distinguished from the de-bonded region using the Lamb wave approach. The Lamb wave technique results showed significant correlation to the de-bonding area. As the de-bonding area increased, the Lamb wave energy attenuation effect decreased, which was a prominent factor in the realization of quantitative tomographic visualization. The feasibility of tomographic visualization was studied via the application of Lamb waves. The reconstruction algorithm for the probabilistic inspection of damage (RAPID) technique was applied to the containment liner plate to verify and visualize the de-bonding condition. The results obtained using the tomography image indicated that the Lamb wave-based RAPID algorithm was capable of delineating debonding areas.

• Journal of Welding and Joining
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• v.22 no.3
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• pp.62-68
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• 2004

The strip Au bumps are bonded using longitudinal ultrasonic far the electronic package. Au bumps on the chip and substrate are aligned in a crossed shape, and the ultrasonic is imposed on the chip to form the solid-state bond between the Au bumps. Deformed bump shapes are calculated using the finite element method, and the bond strength is measured experimentally. The crossed strip Au bumps are deformed similar to the saddle, which provides larger contact surface area and higher friction force. Compared with the previous bonding method between the Au bump and planar pad, higher bond strength is obtained using the crossed strip bumps.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2010.05a
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• pp.1309-1310
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• 2010

• Journal of the Korean Wood Science and Technology
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• v.46 no.1
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• pp.85-92
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• 2018

In order to use glued built up timber beam as a structural member for post and beam construction, it must be possible to manufacture long-span lumber. In this study, the researchers conducted a performance evaluation for longitudinal bonding of lumber (cross-section $89{\times}120mm$) made from larch. The specimens were prepared in six different forms using the longitudinal bonding method. The bonding strength of these specimens was tested through tensile strength tests and bending strength tests. The tensile strength test result of the longitudinally bonded parts was better than that of the double lap specimens. And, the tensile strength value of the scarf specimen was better than that of the hooked scarf specimen. The tensile strength of the GFRP (Glass Fiber Reinforced Plastic) rod insertion bonding specimen was 3.6 MPa, which was the highest. As for the bending strength test result of the longitudinally bonded part, the average MOR (modulus of rupture) of the specimen where a GFRP rod was inserted and bonded measured 29 MPa, while the specimens of other bonded parts showed a MOR no more than 11 MPa. Toughness destruction was observed in specimens where a GFRP rod was insertion-bonded. The rest of the specimens showed brittle destruction. The average MOR strength of the Rod + Lap specimen was 30.5 MPa, which was the highest among all longitudinally bonded specimens. The bending strength of the Rod + Lap specimens showed an effective strength that was 66% of that of the control group which were not longitudinally bonded.

• Journal of Welding and Joining
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• v.22 no.1
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• pp.65-70
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• 2004

A soldering process with longitudinal ultrasonic is conducted in this work using the Au bump and substrate. Localized heating of the solder is achieved and the stirring action due to the ultrasonic is found to influence the bond strength and microstructure of the eutectic solder The acceptable bonding condition is determined from the tensile strength. Since the multiple bonds can be formed simultaneously with localized heating, the proposed ultrasonic soldering method appears to be applicable to the high-density electronic package.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.578-582
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• 2007

In this paper, vibration modes and frequencies of a ring-type stacked piezoelectric actuator for a wire bonding transducer system are analyzed using FEM simulations. We implement experiments using a commercial product model of the actuator PZT module which consists of 6 layer ring-type PZT and 7 electrodes, combined bolts, nut and tinut. There are two main results: One is that FEM analysis should consider the effect the harmonic voltage input in order to meet the experimental results. The other is that the current wire bonder using exciting frequency of 136 kHz should be modified in order to improve the actuator and bonding performance because the actuator module has the main longitudinal mode of 145 kHz.

• Proceedings of the KWS Conference
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• 2003.05a
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• pp.224-227
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• 2003

The longitudinal thermosonic bonding method is investigated in this work for its application to the soldering process for electronic packaging. The effect of the ultrasonic is analyzed through lumped modeling, and the material properties of a viscoelastic model are measured experimentally. The thermosonic bonding method is verified by inserting the Cu pin and Au bump into solder block. As the solder thickness decreases, temperature of the solder is calculated to increase rapidly because of larger strain. Localized heating due to ultrasonic vibration is observed to melt the solder near the pin, which is adequate to the high density electronic package and Pb-free solder having high melting temperature.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2007.11a
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• pp.583-588
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• 2007

This paper investigates the vibration characteristics of a wire-bonding transducer horn for high speed welding devices. The sample wire-bonder uses the input frequency of 136 kHz. The ultrasonic excitation causes the various vibrations of transducer horn and capillary. The vibration modes and frequencies close to the exciting frequency are identified using ANSYS. The nodal lines and amplification ratio of the ultrasonic horn are also obtained in order to evaluate the bonding performance of the sample wire-bonder system. The FEM results and experimental results show that the sample wire-bonder system uses the bending mode of 136 kHz as principal motion for bonding. The major longitudinal mode exists at 119 kHz below the excitation frequency. It is recommeded that the sample system is to set the excitation frequency at 119 kHz to improve bonding performance.