• Proceedings of the KSME Conference
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• 2003.04a
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• pp.774-779
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• 2003

Arc-shaped line array slits have been used for the laser generation of focused Lamb waves. The spatially expanded Nd:YAG pulse laser was illuminated through the arc-shaped line array slit on the surface of a sample plate to generate the Lamb waves of the same pattern as the slit. Then the generated Lamb waves were focused at the point of which distance from the slit position is dependent on the curvature of slit arc. The proposed method showed better spatial resolution than the conventional linear array slit in the detection of laser machined linear defect and drill machined circular defect on aluminum plates of 1mm thickness.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.2
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• pp.128-132
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• 2010

Photonic crystal is dielectric materials or a set of different dielectric materials with periodic structure. Line defect is obtained by leaving out a row of rods along the $\Gamma$-X direction. We showed the change of group velocity in waveguide mode and found resultant small group velocity. Characteristics of the small group velocity were described by electric field distribution. Investigating the phase shift, it is confirmed if small group velocity is positive or negative.

• Proceedings of the IEEK Conference
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• 2003.11a
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• pp.351-354
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• 2003

To inspect point-defect in LCD pannel, calculate period and eliminated pattern. And then find point-defect to compare block image with each period. First processing, Founded over point defects. To reduce wrong point defect. Next, label point-defects and eliminated not surpass fixed limit-size.

• Journal of Korea Multimedia Society
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• v.13 no.8
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• pp.1115-1127
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• 2010

In order to increase the productivity in manufacturing TFT-LCD(thin film transistor-liquid crystal display), it is essential to classify defects that occur during the production and make an appropriate decision on whether the product with defects is scrapped or not. The decision mainly depends on classifying the defects accurately. In this paper, we present an effective classification method for film defects acquired in the panel production line by analyzing the intensity distribution and shape feature of the defects. We first generate a binary image for each defect by separating defect regions from background (non-defect) regions. Then, we extract various features from the defect regions such as the linearity of the defect, the intensity distribution, and the shape characteristics considering intensity, and construct a referential image database that stores those feature values. Finally, we determine the type of a defect by matching a defect image with a referential image in the database through the matching cost function between the two images. To verify the effectiveness of our method, we conducted a classification experiment using defect images acquired from real TFT-LCD production lines. Experimental results show that our method has achieved highly effective classification enough to be used in the production line.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.21 no.9
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• pp.1681-1688
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• 2017

In this paper, we implemented a high-speed signal processing hardware system for Color Line Scan Camera using FPGA and Nor-Flash. The existing hardware system mainly processed by high-speed DSP based on software and it was a method of detecting defects mainly by RGB individual logic, however we suggested defect detection hardware using RGB-HSL hardware converter, FIFO, HSL Full-Color Defect Decoder and Image Frame Buffer. The defect detection hardware is composed of hardware look-up table in converting RGB to HSL and 4K HSL Full-Color Defect Decoder with high resolution. In addition, we included an image frame for comprehensive image processing based on two dimensional image by line data accumulation instead of local image processing based on line data. As a result, we can apply the implemented system to the grain sorting machine for the sorting of peanuts effectively.

• 한국정보디스플레이학회:학술대회논문집
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• 2009.10a
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• pp.1036-1039
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• 2009

We have developed an automated circuit defect repair method. We focused on the resist patterns on the circuit material layer of TFT substrates before the etching process. In this paper, we report on the repair method that utilizes the syringe system and the stability of the open defect repair process.

• International Journal of Precision Engineering and Manufacturing
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• v.7 no.3
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• pp.18-23
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• 2006

The formation degree of sustain (ITO pattern) determines the quality of a PDP (Plasma Display Panel). Thus, in the present study, we attempt to detect 100% of the defects that are larger than $30{\mu}m$. Currently, the inspection method in the PDP manufacturing process is dependent upon the naked eye or a microscope in off-line mode. In this study, a prototype inspection system for PDP ITO patterned glass is developed. The developed system, which is based on a line-scan mechanism, obtains information on the defects and sorts the defects by type automatically. The developed inspection system adopts a multi-vision method using slit-beam formation for minimum inspection time and the detection algorithm is embodied in the detection ability. Characteristic defects such as pin holes, substances, and protrusions are extracted using the blob analysis method. Defects such as open, short, spots and others are distinguished by the line type inspection algorithm. It was experimentally verified that the developed inspection system can detect defects with reliability of up to 95% in about 60 seconds for the 42-inch PDP panel.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.191-195
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• 2003

The formation degree of sustain (ITO pattern) decides quality of PDP (plasma display panel). For this reason. it makes efforts in search defects more than 30 ${\mu}{\textrm}{m}$. Now, the existing inspection process is dependent upon naked eye or SEM equipment in off-line PDP manufacturing process. In this study developed prototype inspection system of PDP ITO glass. This system creates information that detects and sorts kind of defect automatically. Design ed inspection technology adopts line-scan method by slip-beam formation for the minimum of inspection time and image processing algorithm is embodied in detection ability of developed system. Designed algorithm had to make good use of kernel matrix which draws up an approach to geometry. A characteristic of area-shaped defects, as pin hole, substance, protrusion et al, are extracted from blob analysis method. Defects, as open, short, spots, et al, are distinguished by line type inspection algorithm. In experiment results, we could have ensured ability of inspection that can be detected with reliability of up to 95% in about 60 seconds

• Journal of the Korean Society for Nondestructive Testing
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• v.27 no.3
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• pp.246-254
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• 2007

The scanning laser source (SLS) technique is a promising new laser ultrasonic tool for the detection of small surface-breaking defects. The SLS approach is based on monitoring the changes in laser-generated ultrasound as a laser source is scanned over a defect. Changes in amplitude and frequency content are observed for ultrasound generated by the laser over uniform and defective areas. The SLS technique uses a point or a short line-focused high-power laser beam which is swept across the test specimen surface and passes over surface-breaking or subsurface flaws. The ultrasonic signal that arrives at the Rayleigh wave speed is monitored as the SLS is scanned. It is found that the amplitude and frequency of the measured ultrasonic signal have specific variations when the laser source approaches, passes over and moves behind the defect. In this paper, the setup for SLS experiments with full B-scan capability is described and SLS signatures from small surface-breaking and subsurface flaws are discussed using a point or short line focused laser source.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.585-589
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• 2004

This paper deals with the algorithm development that inspects defects such as Lens Focus, Black Defect, Dim Defect, Color Defect, White Balance, and Line Defect caused by the process of Compact Camera Module (CCM). These days the demand of CCM goes on increasing in various types like PDA, a cellular phone and PC camera every year. However, owing to the defect inspection of CCM by the semiskilled work the average inspection time of CCM takes about 40 to 50 seconds. As time goes by the efficiency takes a sudden turn for the worse because workers must inspect with seeing a monitor directly. In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of assembled CCM. The performances of the developed inspection system and its algorithm are tested on many samples. Experimental results reveal that the proposed system can focus the lens of CCM within 5s and we can recognize various types of defect of CCM modules with good accuracy and high speed.