• Proceedings of the Korean Reliability Society Conference
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• 2004.07a
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• pp.129-137
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• 2004

This paper presents an accelerated life test for burnout of tungsten filament of incandescent lamp. From failure analyses of field samples, it is shown that their root causes are local heating or hot sports in the filament caused by tungsten evaporation and wire sag. Finite element analysis is performed to evaluate the effect of vibration and impact for burnout, but any points of stress concentration or structural weakness are not found in the sample. To estimate the burnout life of lamp, an accelerated life test is planned by using quality function deployment and fractional factorial design, where voltage, vibration, and temperature are selected as accelerating variables. We assumed that Weibull lifetime distribution and a generalized linear model of life-stress relationship hold through goodness of fit test and test for common shape parameter of the distribution. Using accelerated life testing software, we estimated the common shape parameter of Weibull distribution, life-stress relationship, and accelerating factor.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.5
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• pp.430-436
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• 2008

This paper proposes a way to predict electrical lifetime of a relay using Accelerated Life Testings (ALTs). The relay of interest mounting on printed circuit boards is usually under an inrush current stress. The inrush current is generated and accelerated through controlling a lamp switching device in the ALT. We find that the dominant failure mechanism under high levels of inrush current would be contact welding in the contact surface of the relay and the contact welding process is accelerated according to increase in inrush current. The electrical lifetime model based on Inverse Power Law in term of inrush current is proposed, and parameters characterizing relay's lifetime distribution are statistically estimated using ALTA 6 PRO software.

• Communications for Statistical Applications and Methods
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• v.23 no.4
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• pp.269-285
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• 2016

In this paper, a simple step-stress accelerated life test (ALT) under progressive type-II censoring is considered. Progressive type-II censoring and accelerated life testing are provided to decrease the lifetime of testing and lower test expenses. The cumulative exposure model is assumed when the lifetime of test units follows an extension of the exponential distribution. Maximum likelihood estimates (MLEs) and Bayes estimates (BEs) of the model parameters are also obtained. In addition, a real dataset is analyzed to illustrate the proposed procedures. Approximate, bootstrap and credible confidence intervals (CIs) of the estimators are then derived. Finally, the accuracy of the MLEs and BEs for the model parameters is investigated through simulation studies.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1271-1276
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• 2008

This study has explained about LED for BLU which is widely used in the kinds of display devices or lighting. It was shown that the open due to delamination were the dominant LED for BLU failure mode and mechanisms from failure analysis of LED samples. Then, we have defined failure as yellowing and 100% reduction of light output intensity of LED for BLU and acceleration factors as temperature and current in Accelerated Life Test(ALT). Finally, we have estimated the Weibull distribution, life-stress relationship, and accelerating factor is used by ALTA Software.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1277-1282
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• 2008

Recently LCD panels have becom very important components for portable electronics. In the high density interconnection material, ACF's are used to connect the outer lead of the tape automated bonding to the transparent indium tin oxide electrodes of the LCD panel. ACF consists of an adhesive polymer matrix and randomly dispersed conductive balls. In this study, we analyzed Failure Mode / Mechanism of ACF which is identified Conductive ball Corrsion, Delamination, Crack and Polymer Expansion / Swelling. In ALT(Accelerated Life Test), we select primary stress factors as temperature and humidity. As time passes by, an increase of connection resistance was observed. In conclusion, we have found that high temperature / humidity affects the adhesion.