• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.296-299
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• 2002

The precision blanking of thin sheet metal is important process on production of precision electronic machine parts such as IC leadframe. In the blanking process, the factors that friction coefficient, tool clearance, material properties are the most important factors in the precision blanking process, because these factors affect the sheared face of product, side forces to punch during blanking process and surface condition after blanking process. So, many investigations have been performed. But, the former studies did not take up the characteristic of material. In this paper, in order to investigate the characteristic of blank, such as K(strength coefficient) and n(strain hardening coefficient), on the sheared face of blank and the side force to punch, FE-simulation has been analyzed by means of DEFORM-2D. To obtain input Parameters on FE-simulation, tensile and friction test has been done.

• Journal of the Korean institute of surface engineering
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• v.34 no.2
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• pp.142-150
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• 2001

Due to naturally formed copper oxides, the adhesion strength between copper and epoxy resin is often very poor. To improve the adhesion strength between copper and epoxy resin, Cu-based leadframe sheets were oxidized in a brown-oxide forming solution. Then the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) was studied using pull-out specimens. After the pull-out test, fracture surfaces were analyzed using SEM, AES and EDS to determine failure path. The results showed that the failure path lay over inside the CuO and inside the EMC irrespective of the pull strength.

• Journal of the Korean Society for Precision Engineering
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• v.20 no.3
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• pp.35-41
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• 2003

The multihole blanking of thin sheet metal using progressive die set is an important process on production of precision electronic machine parts such as IC leadframe. In this paper, in order to investigate the influence of blanking order on the final lead profile and deformed configuration, simulation technique for progressive blanking process is proposed and analyzed by LS-DYNA. The results of FE-simulations are in good agreement with the experimental results. Consequently, from the results of FE-analysis based on the procedure proposed in this paper, it is possible to predict the deformation of lead and to manufacture high precision leadframes in progressive blanking process and these results might be used as a guideline to develop layout design system in multihole blanking process.

• Journal of the Korean institute of surface engineering
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• v.56 no.1
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• pp.77-83
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• 2023

The reliability of leadframe-based semiconductor package depends on the adhesion between metal and epoxy molding compound (EMC). In this study, the Ag surface was electrochemically treated in a solution containing silanes in order to improve the adhesion between Ag and epoxy substrate. After electrochemical treatment, the thin silane layer was deposited on the Ag surface, whereby the peel strength between Ag and epoxy substrate was clearly improved. The improvement of peel strength depended on the functional group of silane, implying the chemical linkage between Ag and epoxy.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2003.11a
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• pp.21-21
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• 2003

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.71-72
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.100.4-100
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• 1998

• Journal of the Microelectronics and Packaging Society
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• v.19 no.3
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• pp.71-76
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• 2012

A chip interconnection technology for smart fabrics was investigated by using flip-chip bonding of SnBi low-temperature solder. A fabric substrate with a Cu leadframe could be successfully fabricated with transferring a Cu leadframe from a carrier film to a fabric by hot-pressing at $130^{\circ}C$. A chip specimen with SnBi solder bumps was formed by screen printing of SnBi solder paste and was connected to the Cu leadframe of the fabric substrate by flip-chip bonding at $180^{\circ}C$ for 60 sec. The average contact resistance of the SnBi flip-chip joint of the smart fabric was measured as $9m{\Omega}$.

• Korean Journal of Materials Research
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• v.10 no.8
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• pp.551-557
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• 2000

Cu-based leadframe sheets were oxidized ic a hot alkaline solution to black-oxide layer on the surface and molded with epoxy molding compound(EMC), and finally machined to form sandwiched double-cantilever beam(SDCB) and sandwiched Brazil-nut(SBN)specimers to measure the adhesion strength of leadframe-EMC interface. The SDCB and the SBN specimens were designed to measure the adhesion strength in terms fracture toughness under puasi-mode I and mixed mode loadinf, respectively. After the tests, fracture surfaces were analyzed paths were observed in the SDCB-tested speciments, failure paths varied with crack speed and loading conditions.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.551-552
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• 2007