• Title/Summary/Keyword: leadframe

Search Result 66, Processing Time 0.076 seconds

Adhesion Strength Measurements of Cu-based Leadframe/EMC Interface

  • Lee, Ho-Young;Jin Yu
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.6 no.2
    • /
    • pp.1-12
    • /
    • 1999
  • Brown oxide and/or black oxide layers were formed on the surface of Cu-based leadframe by chemical oxidation of leadframe in hot alkaline solutions, and their growth characteristics were studied. Then, to measure the adhesion strength between leadframe and epoxy molding compound (EMC), oxidized leadframe samples were molded with EMC and machined to form sandwiched double-cantilever beam (SDCB) specimens and pull-out specimens, respectively. Results showed that the adhesion strength of un-oxidized leadframe/EMC interface was inherently very poor but could be increased drastically with the nucleation of acicular CuO precipitates on the surface of leadframe. The presence of smooth faceted $Cu_2O $ on the surfaces of leadframe gave close to zero interfacial fracture toughness (Gc) and reasonable pull strength (PS). A direct correlation between Gc and PS showed that PS can be a measure of Gc only in a limited range.

  • PDF

Design Analysis in a Cavity with Leadframe during Semiconductor Chip Encapsulation (반도체 칩 캡슐화(encapsulation)를 위한 트랜스퍼 금형 캐비티(cavity)에서의 설계 해석 및 실험에 관한 연구)

  • S.J. Han;Y.J. Huh
    • Journal of the Korean Society for Precision Engineering
    • /
    • v.12 no.12
    • /
    • pp.91-99
    • /
    • 1995
  • An effort has been made to more accurately analyze the flow in the chip cavity, particularly to model the flow through the openings in the leadframe and correctly treat the thermal boundary condition at the leadframe. The theoretical analysis of the flow has been done by using the Hele- Shaw approximation in each cavity separated by a leadframe. The cross-flow through the openings in the leadframe has been incorporated into the Hele-Shaw formulation as a mass source term. The temperature of the leadframe has been calculated based on energy balance in the leadframe. The flow behavior in the leadframe has been verified experimentally. In the experiment, a transparent mold and clear fluid have been used for flow visualization. Comparisons were made between the calculation and experimental results which showed a good agreement.

  • PDF

Fracture Toughness of Leadframe/EMC Interface (리드프레임/EMC 계면의 파괴 인성치)

  • 이호영;유진
    • Journal of the Korean institute of surface engineering
    • /
    • v.32 no.6
    • /
    • pp.647-657
    • /
    • 1999
  • Due to the inherently poor adhesion strength of Cu-based leadframe/EMC (Epoxy Molding Compound) interface, popcorn cracking of thin plastic packages frequently occurs during the solder reflow process. In the present work, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, black-oxide layer was formed on the leadframe surface by chemical oxidation of leadframe, and then oxidized leadframe sheets were molded with EMC and machined to form SDCB (Sandwiched Double-Cantilever Beam) and SBN (Sandwiched Brazil-Nut) specimens. SDCB and SBN specimens were designed to measure the adhesion strength between leadframe and EMC in terms of critical energy-release rate under quasi-Mode I ($G_{IC}$ ) and mixed Mode loading ($G_{C}$ /) conditions, respectively. Results showed that black-oxide treatment of Cu-based leadframe initially introduced pebble-like X$C_2$O crystals with smooth facets on its surface, and after the full growth of $Cu_2$O layer, acicular CuO crystals were formed atop of the $Cu_2$O layer. According to the result of SDCB test, $Cu_2$O crystals on the leadframe surface did not increase ($G_{IC}$), however, acicular CuO crystals on the $Cu_2$O layer enhanced $G_{IC}$ considerably. The main reason for the adhesion improvement seems to be associated with the adhesion of CuO to EMC by mechanical interlocking mechanism. On the other hand, as the Mode II component increased, $G_{C}$ was increased, and when the phase angle was -34$^{\circ}$, crack Kinking into EMC was occured.d.

  • PDF

Effect of Brown Oxide Formation on the Fracture Toughness of Leadframe/EMC Interface (Brown Oxide 형성이 리드프레임/EMC 계면의 파괴인성치에 미치는 영향)

  • H. Y., Lee;J., Yu
    • Journal of the Korean institute of surface engineering
    • /
    • v.32 no.4
    • /
    • pp.531-537
    • /
    • 1999
  • A copper based leadframe was oxidized in brown-oxide forming solution, then the growth characteristics of brown oxide and the effect of brown-oxide formation on the adhesion strength of leadframe to epoxy molding compound (EMC) were studied by using sandwiched double cantilever beam (SDCB) specimens. The brown oxide is composed of fine acicular CuO, and its thickness increased up to ~150 nm within 2 minutes and saturated. Bare leadframe showed alomost no adhesion to EMC, while once the brown-oxide layer formed on the Surface of leadframe, the adhesion strength increased up to ~80 J/$\m^2$ within 2 minutes. Correlation between oxide thickness, $\delta$ and the adhesion strength in terms of interfacial fracture toughness, $G_{c}$ was linear. Considering the above results, we might conclude that the main adhesion mechanism of brown-oxide treated leadframe to EMC is mechanical interlocking, in which fine acicular CuO plays a major role.e.

  • PDF

Measurement of Adhesion Strength between Oxidized Cu-based Leadframe and EMC (산화처리된 구리계 리드프레임과 EMC 사이의 접착력 측정)

  • Lee, Ho-Young;Yu, Jin
    • Korean Journal of Materials Research
    • /
    • v.9 no.10
    • /
    • pp.992-999
    • /
    • 1999
  • Due to the inherently poor adhesion strength of Cu-based leadframe/EMC(Epoxy Molding Compound) interface, popcorn-cracking phenomena of thin plastic packages frequently occur during the solder reflow process. In this study, in order to enhance the adhesion strength of Cu-based leadframe/EMC interface, brown-oxide layer was formed on the leadframe surface by immersing of leadframe sheets in hot alkaline solution, and the adhesion strength of leadframe/EMC interface was measured by using SDCB(Sandwiched Double Cantilever Beam) and SBN(Sandwiched Brazil-Nut) specimens. Results showed that brown oxide treatment of leadframe introduced fine acicular CuO crystals on the leadframe surface and improved the adhesion strength of leadframe/EMC interface. Enhancement of adhesion strength was directly related to the thickening kinetics of oxide layer. This might be due to the mechanical interlocking of fine acicular CuO crystals into EMC.

  • PDF

Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading I: Experimental Result (인장하중하에서의 고분자/거친금속 계면의 파손에 대한 비교연구 I: 실험결과)

  • Lee Ho-Young;Kim Sung-Ryong
    • Korean Journal of Materials Research
    • /
    • v.15 no.1
    • /
    • pp.1-5
    • /
    • 2005
  • Copper-based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The present paper deals with the failure path, and the cause of the failure path formation with an adhesion model will be treated in the succeeding paper.

Comparative Study on the Failure of Polymer/Roughened Metal Interfaces under Mode-I Loading II: Adhesion Model (인장하중하에서의 고분자/거친금속 계면의 파손에 대한 비교연구 II: 접착모델)

  • Lee Ho-Young;Kim Sung-Ryong
    • Korean Journal of Materials Research
    • /
    • v.15 no.1
    • /
    • pp.6-13
    • /
    • 2005
  • Copper based leadframe sheets were immersed in two kinds of hot alkaline solutions to form brown-oxide or blackoxide layer on the surface. The oxide-coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched double-cantilever beam (SDCB) specimens. The SDCB specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under quasi-Mode I loading conditions. After fracture toughness testing, the fracture surface were analyzed by various equipment to investigate failure path. An adhesion model was suggested to explain the failure path formation. The adhesion model is based on the strengthening mechanism of fiber-reinforced composite. The present paper deals with the introduction of the adhesion model. The explanation of the failure path with the proposed adhesion model was introduced in the companion paper.

Friction Characteristics on the Sheet Metal Blanking of Leadframe (리드 프레임 블랭킹 공정의 마찰특성에 관한 연구)

  • Ko, D.C.;Kim, D.H.;Kim, M.K.;Kim, B.M.
    • Transactions of Materials Processing
    • /
    • v.15 no.6 s.87
    • /
    • pp.428-435
    • /
    • 2006
  • IC leadframe needs precision shape for good efficiency. Friction conditions also have a significant impact on blanking deformation. Therefore, studying the friction produced by the tribology between die and materials becomes necessary. In this study, in order to measure mechanical properties and frictions for leadframe materials such as Ni alloys and coppers, tensile test and straight pulling friction test are executed. In particular, the effect of clearance on the blanking characteristics depending on friction coefficient is examined by finite element simulation. From the finite element simulation, the metal flow, side pressure of punch and crack initiation are evaluated according to the leadframe materials.

Leadframe SiP with Conformal Shield

  • Kim, ByongJin;Sim, KiDong;Hong, SeoungJoon;Moon, DaeHo;Son, YongHo;Kang, DaeByoung;Khim, JinYoung;Yoon, JuHoon
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.23 no.4
    • /
    • pp.31-34
    • /
    • 2016
  • System In Package (SiP) is getting popular and momentum for the recent wearable, IoT and connectivity application apart from mobile phone. This is driven by market demands of cost competitive, lighter and smaller/thinner and higher performance. As one of many semiconducting assembly products, Leadframe product has been widely used for low cost solution, light/ small and thin form factor. But It has not been applied for SiP although Leadframe product has many advantages in cost, size and reliability performance. SiP is mostly based on laminate substrate and technically difficult on Leadframe substrate because of a limitation in SMT performance. In this paper, Leadframe based SiP product has been evaluated about key technical challenges in SMT performance and electrical shield technology. Mostly Leadframe is considered not available to apply EMI shield because of tie-bar around package edge. In order to overcome two major challenges, connection bars were deployed properly for SMT pad to pad and additional back-side etching was implemented after molding process to achieve electrical isolation from outer shield coating. This product was confirmed assembly workability as well as reliability.