• Transactions of Materials Processing
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• v.7 no.6
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• pp.554-561
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• 1998

This paper describes a research work of developing a computer-aided design of lead frame semicon-ductor with piercing operation which is very precise for progressive working. An approach to the sys-tem is based on to knowledge-based rules. Knowledge for the system is formulated from plasticity theories experimental results and the empirical knowledge of field experts. This system has been writ-ten using AutoLISP to AutoCAD on a personal computer and is composed of three main modules which are input and shape treatment production feasibility check and strip-layout module. Based on the knowledge-based rules the system is designed by considering several factors such as material and thickness of product complexities of blank geometry and punch profile, and availability of press. Also strip-layout drawing generated by piercing operation according to punch profiles considered V-notch dimple. pad chamfer spank cavity punch camber and cross bow of lead frame is displayed in graphic forms. This system can be used by a novice who may not have any knowledge of tool design and will invrease efficiencies to the designer in this field.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2001.10a
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• pp.71-74
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• 2001

Using the Taguchi method, optimum process condition of lead frame blanking has been determined in the point of view of shape of blanked profile. As the main process parameters, clearance, strip holding pressure and bridge width are selected. According to the orthogonal array table, three levels of experiment have been carried out for each factors. The optimal blanking condition is analyzed with the SN ratio. It has been verified that the optimal process condition can be determined with a combination of basic blanking experiment and experiment design method. Both the effect of each factors and gain can be judged in the quantitative manners from the analysis of SN ratio.

• Transactions of the Korean Society for Noise and Vibration Engineering
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• v.22 no.4
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• pp.352-357
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• 2012

The ground resonance instability of a helicopter with bearingless main rotor hub were investigated. The ground resonance instability is caused by an interaction between the blade lag motion and hub inplane motion. This instability occurs when the helicopter is on the ground and is important for soft-inplane rotors where the rotating lag mode frequency is less than the rotor rotational speed. For the analysis, the bearingless rotor was composed of blades, flexbeam, torque tube, damper, shear restrainer, and pitch links. The fuselage was modeled as a mass-damper-spring system having natural frequencies in roll and pitch motions. The rotor-fuselage coupling equations are derived in non-rotating frame to consider the rotor and fuselage equations in the same frame. The ground resonance instabilities for three cases where are without lead-lag damper and fuselage damping, with lead-lag damper and without fuselage damping, and finally with lead-lag damper and fuselage damping. There is no ground resonance instability in the only rotor-fuselage configuration with lead-lag damper and fuselage damping.

• Journal of Mechanical Science and Technology
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• v.18 no.12
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• pp.2294-2302
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• 2004

The objective of this study is to obtain detailed information for the micro fabrication of lead frames by applying spray technology to wet etching process. Wet etching experiments were performed with different etching parameters such as injection pressure, distance from nozzle tip to etched substrate, nozzle pitch and etchant temperature. The characteristics of single and twin spray were measured to investigate the correlation between the spray characteristics and the etching characteristics. Drop size and velocity were measured by Phase-Doppler Anemometer (PDA). Four liquids of different viscosity were used to reveal the effects of viscosity on the spray characteristics. The results indicated that the shorter the distance from nozzle tip and the nozzle pitch, the larger etching factor became. The average etching factor had good positive correlation with average axial velocity and impact force. It was found that the etching characteristics depended strongly on the spray characteristics.

• Applied Chemistry for Engineering
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• v.27 no.1
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• pp.21-25
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• 2016

When copper alloy is used in etching process for the production of lead frame, the high concentration of heavy metals, such as iron, nickel and zinc may be included in the etching waste. Those etching waste is classified as a specified one. Therefore a customized design was designed for the purification process of the lead frame etching waste liquid containing high concentrations of heavy metals for the production of an electroplating copper(II) oxide. Since the lead frame etching waste solution contains highly concentrated heavy metal species, an ion exchange method is difficult to remove all heavy metals. In this study, a copper(I) chloride was manufactured by using water solubility difference related to the reduction-oxidation method followed by the reunion of copper(II) chloride using sodium sulfate as an oxidant. The hydrazine was chosen as a reducing agent. The optimum added amount was 1.4 mol per 1.0 mol of copper. In the case of removal of heavy metals by using the combination of reduction-oxidation and ion exchange resin methods, 4.3 ppm of $Fe^{3+}$, 2.4 ppm of $Ni^{2+}$ and 0.78 ppm of $Zn^{2+}$ can be reused as raw materials for electroplating copper(II) oxide when repeated three times.

• Korean Journal of Materials Research
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• v.9 no.9
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• pp.926-931
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• 1999

The microstructure, wettability, shear strength and aging effect of Sn-3.5Ag/Cu and Alloy42 lead-frame solder joints were measured for comparison. In the case of Sn-3.5Ag/Cu, $Ag_3Sn and Cu_6Sn_5$ phases in the matrix Sn and $1~2\mu\textrm{m}$ thick $Cu_6Sn_5$ phase at the interface of solder/lead-frame were formed. In the case of Sn-3.5Agl Alloy42, only AgJSn phase of low density in the matrix Sn and $0.5~1.5\mu\textrm{m}$ thick $FeSn_2$, phase at the interface of solder/leadframe were formed. Comparing to Cu, Alloy42 showed wider area of spread and smaller contact angle, thus better wet­tability. But shear strength and ductility of Alloy 42 solder joints were only 33% and 75% of those of Cu, respectively After aging at $180^{\circ}C$ for 1 week, $\xi-Cu_3Sn$ layer on $\eta-Cu_6Sn_5$ layer was formed on Cu lead-frame, while coarsened cir­cular $Ag_3Sn$ phase in the matrix and thickened $FeSn_2$, at the interface were formed on Alloy42 lead- frame.

• International conference on construction engineering and project management
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• 2020.12a
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• pp.30-37
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• 2020

In the building construction, the steel-frame work occupies an important position in terms of structure, cost and quality. Especially in Japan, steel frames have traditionally been the main structure of many buildings. For steel-frame works in such positions, this paper investigates an existing steel fabricator to clarify the actual conditions of design decision making process and management method in steel production process. This study focuses on a steel fabricator (Company M in the following sentences), whose main market is Japan and which has facilities in Thailand, China, and Japan. Company M uses QR codes to control the production status of products, and exchanges all information between inside and outside the company via specialized departments in the form of documents. The authors have already analyzed the relationship between production lead time and defect rate based on actual project data at Architectural Institute of Japan in 2016. In 2019, we expressed the process from the confirmation of the design information of the current steel frame to the production by WBS, and clarified the relationship between the production lead time and steel frame product quality structurally. In this paper, the authors reoport the progress of the survey conducted so far, the positioning of the collected data, and the future survey policy.

• Journal of Welding and Joining
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• v.16 no.4
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• pp.92-97
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• 1998

Because of the low melting temperature of solder, each temperature cycle initiates an irrecoverable creep deformation at the solder interconnection which connects the package body with the PCB. The crack starts and propagates from the position where the creep deformation is maximized. This work has tried to compare and analyze the thermal fatigue life of solder interconnection which is affected by the lead material, the size of die pad, chip thickness, and interface delamination of 48-Pin TSOP under the temperature cycle ($0^{\circ}C$~1$25^{\circ}C$). The crack initiation position and thermal fatigue life which are calculated by using FEA method are well matched with the results of experiments. The thermal Fatigue life of copper lead frame is extended around 3.6 times longer than that of alloy 42 lead frame. It is maximized when the chip size is matched with the length of the lead. It tends to be extended as the thickness of chip got thinner. As the interfacial delamination between die pad and EMC is increased, the thermal fatigue life tends to decrease in the beginning of delamination, and increase after the delamination grew after 45% of the length of die pad.

• Journal of the Korean institute of surface engineering
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• v.19 no.3
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• pp.92-108
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• 1986

An electroplating on the lead frame fabricated from domestic copper plate was studied experimentally. In this study, nickel was plated on the thin copper lead frame and silver layer was coated on the nickel film in the cyanide electrolyte. The effect of process variables such as current density, plating time, coating thickness and flow rate of electrolytic solution on the properties of coating was investigated. Some samples on each step were fabricated during electroplating. The results obtained from polarization measurement, observation of SEM photograph, adhesion test of coating and microhardness test are as follows. On silver plating, polarization resistance of potentiostatic cathodic polarization curve is reduced as the flow rate of Ag electrolytic solution increases. And above resistance is also reduced when the minor chemicals of sodium cyanide and sodium carbonate are added in potassium silver cyanide bath. The reduced polarization resistance makes silver deposition on the cathode easy. An increase in the current density and the coating thickness causes the particle size of deposit to coarsen, and consequently the Knoop microhardness of the coating decreases. On selective plating an increase in the flow rate of plating solution lead to do high speed plating with high current density. In this case, the surface morphology of deposit is of fine microstructure with high Knoop hardness. An increasing trend of the adhesion of coating was shown with increasing the current density and flow rate of electrolytic solution.

• Journal of Korean Electronics
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• v.6 no.5
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• pp.19-22
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• 1986