• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 3rd Korea-Japan Advanced Semiconductor Packaging Technology Seminar
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• pp.21-50
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• 2001

EC's/Japanese environmental regulation drive the Pb-free/Halogen-free application. Most Japanese electronics companies are preparing the green products. All items concerning to Pb-free/Halogen-ree technology should be coparallely designed and developed. More works need to clear the unknowns on Pb-free materials. Need of consensus on materials and standards. EBM (Environmental Benign Manufacturing)

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.39-40
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• 2006

AE sensor using lead-free ceramics should be developed for prohibiting environment protection. In this study, Langevin type AE sensor was manufactured as air backing structure. Here, the piezoelectic element was used as PZT(EC-65) and NKN, respectively. The resonant frequency of AE sensor using PZT was 143 kHz and the resonant frequency of AE sensor using NKN was 178 kHz. The waveform of AE sensor using NKN was responded more sensitively than that of AE sensor using PZT.

• 한국전기전자재료학회논문지
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• 제20권3호
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• pp.218-222
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• 2007

In this study, Acoustic emission(AE) sensors were fabricated using lead-free piezoelectric ceramics for prohibiting environmental pollution. Structure of AE sensors were designed as Langvin type air backing form. Here, the piezoelectic element was used as PZT(EC-65)(AE1) and NKN(AE2), respectively. The measured resonant frequency, the maximum sensitivity frequency and sensitivity of AE sensors were as follows ; 143 kHz, 29.4 kHz and 69.3 dB in AE1 and 179 kHz, 29.4 kHz and 66.3dB in AE2, respectively.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.126-129
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• 2002

This article presents that the affecting factors to solderability and initial reliability. It was discussed that effect of the solder ball hardness and composition on the reliability of solder joints. In this study, lead free solder alloys with compositions of Sn-Cu, Sn-Ag, Sn-Ag-Cu, Sn-Ag-Cu-Bi were applied to the $\muBGA$ packages. As a result of experiments, the high degree of hardness with the displacement of 0.22mm was obtained Sn-2.0Ag-0.7Cu-3.0Bi. The shear strength of lead free solder was higher than of Sn-37Pb solder, and it was increased about 150% in Sn-2.0Ag-0.7Cu-3.0Bi.

• Journal of Nutrition and Health
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• 제29권9호
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• pp.958-970
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• 1996

This study was performed to investigate the effect of dietary calcium level on cadmium and lead toxicity in rats. Fifty-four male rats of Sprague-Dawely strain weighing 152$\pm$12g were blocked into 9 groups according to body weight, and were raised for 30 days. Nine experimental diets different with cadmium(0%, 0.04%), lead (0%, 0.071%) and calcijm(0.5%, 1.0%, 1.5%) levels were prepared. The results are summarized as follow. Weight gain, F.E.R.(food efficiency ratio), and weights of liver, kidney and femur were lower in cadmium exposed groups than those of heavy metal free groups. Weight gain F.E.R. and ash weight of lead groups were lower than those of heavy metal free groups. But, these were increased with increasing dietary calcium level. Cadmium and lead concentrations in blood, liver, kidney and femur were lower in rats fed 1.5% calcium than 0.5% calcium diet. Fecal cadmium and lead excretions were remarkably increased in 1.5% calcium groups, and cadmium and lead retention rates were decreased in 1.5% calcium groups. Metallothionein concentrations in liver, kidney and small intestine were higher in rats exposed to cadmium and lead. Calcium content in blood, femur and daily urinary and fecal calcium excretion were decreased by cadmium and lead additions, and increased in 1.5% calcium groups. Creatinine clearance were decreased with cadmium administratino and calcium addition. In conclusion, weight gain and organ weights were decreased with cadmium or lead administration. But, cadmium administration was more toxic than lead adminstration. Cadmium or lead toxicity was alleviated by increasing dietary calcium level. Especially, lead toxicity was alleviated in proportion to dietary calcium level.

• 한국산업융합학회 논문집
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• 제12권4호
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• pp.215-219
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• 2009

A packaging technology based on flip-chip bonding and Pb-free solder for silicon pressure sensors on printed circuit board (PCB) is presented. First, the bump formation process was conducted by Pb-free solder. Ag-Sn-Cu solder and the pressed-screen printing method were used to fabricate solder bumps. The fabricated solder bumps had $189-223{\mu}m$ width, $120-160{\mu}m$ thickness, and 5.4-6.9 standard deviation. Also, shear tests was conducted to measure the bump shear strength by a Dage 2400 PC shear tester; the average shear strength was 74 g at 0.125 mm/s of test speed and $5{\mu}m$ shear height. Then, silicon pressure sensor packaging was implemented using the Pb-free solder and bump formation process. The characteristics of the pressure sensor were analogous to the results obtained when the pressure sensor dice are assembled and packaged using the standard wire-bonding technique.

• 한국산학기술학회논문지
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• 제13권1호
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• pp.322-328
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• 2012

본 논문은 무연 솔더를 제거하기 위한 디지털 디솔더링 시스템에 관하여 다룬다. 땜납의 모재가 유연납에서 무연납으로 변화된 작업환경에 대처하고, 설정온도에 빠르게 수렴하며 연속작업이 가능한 디솔더링 시스템을 제안한다. 제안 시스템은 디솔더링 스테이션과 디솔더링건으로 구성되며, PID 온도제어를 위한 주변회로는 8bit MCU를 중심으로 설계하였다. 제안 시스템의 성능을 확인하기 위하여 동종의 수입품과 성능을 비교한 결과, 제안시스템은 기존 시스템에 비해 작업온도 도달시간은 11초 빠르며, 리플온도의 변화량은 $1.5^{\circ}C$ 적고, 열 회복율은 약 $0.14^{\circ}C$/초 빠르게 나타남을 확인 하였다.

• Journal of Welding and Joining
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• 제26권5호
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• pp.43-48
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• 2008

Characteristics of Sn-1.7%Bi-0.7%Cu-0.6%In (hereafter, SBIC) lead-free solder was investigated in this study. The results from SBIC were compared to other lead-free solders such as Sn-3.5%Ag-0.7%Cu (hereafter, SAC), Sn-0.7%Cu (hereafter, SC), and lead-bearing Sn-37%Pb (hereafter, SP) alloy. Tensile properties of bulk solder, wettability, spreading index, bridge and dross were evaluated. As experimental results, tensile strength and elongation of SBIC was 62.5MPa and 21.5%, respectively. The tensile strength was comparable to that of SP solder. The wetting time of SBIC was 1.2 sec at $250^{\circ}C$, and its wetting properties including wetting force were as good as the SAC alloy. However, wettability of the SC was not so good as the SBIC and SAC. The spreading index of SBIC at $250^{\circ}C$ was 71 %, and it was similar level to those of SAC and SC solders. Bridging was not found for all solders of SBIC, SAC and SC in the range from 240 to $260^{\circ}C$. In dross test at $250^{\circ}C$ for an hour, the amount of dross produced from SBIC was about 57% compared to that from SAC.

• Journal of Nutrition and Health
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• 제19권5호
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• pp.323-332
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• 1986

This study was performed to see the effects of lead poisoning and dietary protein levels(6, 15 and 40 % casein diets) on growth, protein and lipid metabolisms in growing rats. It was also investigated whether the high protein intake would alleviate lead toxicity by decreasing Pb absorption and/or increasing Pb excretion. The results obtained were summarized as follows ; 1) Weight gain, F.E.R liver weight, weight and length of bone in Pb-administered groups were lower than in Pb-free groups. However, these values in the 40% casein diet group with Pb were increased to the level in 15% casein diet group without Pb. 2) Hematocrt and hemoglobin content in blood were lower in Pb -adminstered groups than in Pb free groups. Especially, these levels were lower in 6% casein diet group with Pb than in any other group. 3) Plasma protein level in th e 40% casein casein diet group was the highest of all groups and those of Pb-administered groups tended to be lower than those of Pb-free groups. Plasma lipid and cholesterol levels were increased with decreasing dietary protein level, and these levels were higher in the animals exposed to Pb than in free groups.4) Total liver protein, lipid and cholesterol contents were increased with increasing dietary protein level, and these contents were lower in Pb-administered groups than in Pb free groups. 5) Fecal Pb excretion was not different between 6 and 40% casein diet groups. However, urinary Pb excretion was higher in the 40% casein diet group than in the 6% casein diet group. Above results suggest that, in exposing to the Pb pollution, sufficient protien intake must be recommended. High protein intake seemed to alleviate lead toxicity by increasing urinary Pb excretion.

• 열처리공학회지
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• 제24권3호
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• pp.133-139
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• 2011

This study has been investigated for tensile properties with lead-free brass containing 1 wt.% of Bi. And also characteristic of corrosion resistance was analyzed by polarization test. An increase of tempering temperature was found to tend to decrease tensile strength, and percentage of elongation was shown to be the lowest value at $300^{\circ}C$. On the other hand, the elongation was increased with an increase of tempering temperature after $300^{\circ}C$. The change of mechanical properties was closely related with the content and shape of acicular Witmanst$\ddot{a}$tten ${\alpha}$ formed at the interface of ${\beta}$ phase as well as in ${\beta}$ phase. Tensile strength had a tendency to be decreased with an increase of test temperature. The elongation was shown to be the lowest value at around $300^{\circ}C$, while it began to increase as test temperature rose after $300^{\circ}C$. It might be speculated that the reason that elongation was decreased was found to form bismuth film at the interface of ${\alpha}/{\beta}$ phase leading to be easily brittle when loaded by tensile stress. The lead-free brass containing 1 wt.% of Bi had similar characteristic of corrosion resistance with a free-cutting brass with 3.4 wt. % of Pb in spite of higher fraction of ${\beta}$ phase.