• Title/Summary/Keyword: lead free

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Evaluating the Reduction of Spatial Scattering based on Lead-free Radiation Shielding Sheet using MCNPX Simulation (MCNPX 시뮬레이션을 이용한 무납 방사선 차폐 시트 기반의 공간산란 저감화 평가)

  • Yang, Seung u;Park, Geum-byeol;Heo, Ye Ji;Park, Ji-Koon
    • Journal of the Korean Society of Radiology
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    • v.14 no.4
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    • pp.367-373
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    • 2020
  • Most of the spatial scattered dose caused by the scattered rays generated by the collision between the object and X-rays is relatively easily absorbed by the human body as electromagnetic waves in the low energy region, thereby increasing the degree of radiation exposure. Such spatial scattering dose is also used as an indicator of the degree of radiation exposure of radiation workers and patients, and there is a need for a method to reduce exposure by reducing the spatial scattered dose that occurs indirectly. Therefore, in this study, a lead-free radiation shielding sheet was proposed as a way to reduce the spatial scattering dose, and a Monte Carlo (MC) simulation was performed based on a chest X-ray examination. The absorbed dose was calculated and the measured value and the shielding rate were compared and evaluated.

Fluxless Plasma Soldering with Different Thickness of UBM Layers on Si-Wafer (Si 웨이퍼의 UBM층 도금두께에 따른 무플럭스 플라즈마 솔더링)

  • 문준권;강경인;이재식;정재필;주운홍
    • Journal of the Korean institute of surface engineering
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    • v.36 no.5
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    • pp.373-378
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    • 2003
  • With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

Effects of High Energy Ball Milling on the Piezoelectric Properties of Lead-free (K0.44Na0.52)(Nb0.86Ta0.10)-0.04LiSbO3 Ceramics (고에너지 볼 밀링을 이용한 (K0.44Na0.52)(Nb0.86Ta0.10)-0.04LiSbO3 무연 압전 세라믹스의 특성)

  • Kim, Young-Hyeok;Heo, Dae-Young;Tai, Weon-Pil;Lee, Jae-Shin
    • Journal of the Korean Ceramic Society
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    • v.45 no.6
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    • pp.363-367
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    • 2008
  • Lead-free $(K_{0.44}Na_{0.52})(Nb_{0.86}Ta_{0.10})-0.04LiSbO_3$ piezoelectric ceramics have been synthesized by conventional sintering process and then investigated on the sintering and piezoelectric properties by high energy ball milling (HEBM) treatment. The powders milled for different time are characterized by XRD, FE-SEM. The powders are pressed into a pellet and sintered. It is found that the piezoelectric properties of sintered specimens are strongly dependent on the milling time. The piezoelectric properties are enhanced by high energy ball milling treatment. The planer electromechanical coupling factor ($k_p$) and piezoelectric constant ($d_{33}$) of a specimen sintered at $1050^{\circ}C$ are 0.44 and 267 pC/N, respectively.

Phase Transitional Behavior and Piezoelectric Properties of 0.94(Na0.5K0.5NbO3-0.06Ba(Ti0.9Sn0.1)O3 Lead-free Ceramics (무연계 0.94(Na0.5K0.5NbO3-0.06Ba(Ti0.9Sn0.1)O3 세라믹의 상전이 거동과 압전 특성)

  • Cha, Yu-Joung;Nahm, Sahn;Jeong, Young-Hun;Lee, Young-Jin;Paik, Jong-Hoo
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.22 no.9
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    • pp.766-771
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    • 2009
  • Lead-free $0.94(Na_{0.5}K_{0.5})NbO_3$-0.06Ba$(Ti_{0.9}Sn_{0.1})O_3$ [0.94NKN-0.06BTS] ceramics doped with 1 mol% $MnO_2$ were synthesized by a conventional solid state method. The phase transitional behavior and piezoelectric properties of the ceramics sintered at various temperatures were investigated. The 0.94NKN-0.06BTS ceramics sintered at $1050^{\circ}C$, having morphotropic phase boundary of orthorhombic and tetragonal phases, exhibited a microstructure with abnormal grain growth. A diffused phase transition behavior for all the specimens was verified as high degree of diffuseness (${\gamma}$) values from 1.45 to 1.79. A high piezoelectric constant of $d_{33}=256$ pC/N and a satisfactory electromechanical coupling factor of $k_p=42%$ were obtained for the relatively dense 0.94NKN-0.06BTS ceramics sintered at $1050^{\circ}C$.

The Properties and Processing of Bismuth and Indium Added Sn-Cu-Ni Solder Alloy System (Bi, In을 함유한 Sn-Cu-Ni계 솔더 합금 제조와 물성)

  • 박종원;최정철;최승철
    • Journal of the Microelectronics and Packaging Society
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    • v.9 no.1
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    • pp.21-28
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    • 2002
  • Bismuth and Indium added Sn-Cu-Ni solder alloy was investigated for a new lead free solder. The thermal, electrical and mechanical properties were characterized for the Sn-0.7%(Cu+Ni) solder alloy by adding 2~5% Bi and 2~ 10% In. The melting point of solder alloy was in range of 200 to $222^{\circ}C$ and the mushy zone was in range of 20 to $37^{\circ}C$. This alloys could be adapted to middle and high temperature solder materials. A new solder alloy composition. Sn-0.7%(Cu+Ni) -3.5%Bi-2%In is very promising with high performance and effective cost. The melting point was $220^{\circ}C$, the mushy zone range was $25^{\circ}C$, and mechanical, electrical and wetting properties were competitive with those of other lead-free solder except the lower elongation value.

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Effects of La2O3 on the Piezoelectric Properties of Lead-Free (Bi0.5Na0.5)0.94Ba0.06TiO3 Piezoelectric Ceramics (무연 BNBT 세라믹스의 압전특성에 미치는 La2O3의 영향)

  • Son Young-Jin;Yoon Man-Soon;Ur Soon-Chul
    • Korean Journal of Materials Research
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    • v.15 no.12
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    • pp.756-759
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    • 2005
  • A lead free piezoelectric material, bismuth sodium barium titanate $(Bi_{0.5}Na_{0.5})_{0.94}Ba_{0.06}TiO_3$ (BNBT), was considered as an environment-friendly alternatives for the current PZT system. A perovskite BNBT was synthesized by conventional bulk ceramic processing technique. In order to improve piezoelectric properties, $La_2O_3$ as a dopant was incorporated into the BNBT system up to 0.025 moi, ana the effects on subsequent the piezoelectric ana dielectric properties were systematically investigated. With increasing $La_2O_3$ contents, the equilibrium grain shape was remarkably evidenced and sintered density was increased. Piezoelectric and dielectric properties were s]town to have maximum values at the $La_2O_3$ contents of 0.02 mol. $La^{3+}$ ions seemed to act as a softener in the BNBT system and to enhance dielectric and piezoelectric properties in this study.

"Lead-free" Piezoelectric Ba(Ti0.94Zr0.06)O3 Single Crystals with Electromechanical Coupling Factor (k33) Higher Than 0.8 (0.8 이상의 전기기계결합계수(k33)를 가지는 고효율 무연 압전 Ba(Ti0.94Zr0.06)O3 단결정)

  • Lee, Jong-Yeb;Oh, Hyun-Taek;Lee, Ho-Yong
    • Journal of the Korean Ceramic Society
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    • v.51 no.6
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    • pp.623-628
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    • 2014
  • Orthorhombic $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals are fabricated using the cost-effective solid-state single crystal growth (SSCG) method; their dielectric and piezoelectric properties are also characterized. Measurements show that (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals have an electromechanical coupling factor ($k_{33}$) higher than 0.83, piezoelectric charge constant ($d_{33}$) of about 400 [pC/N], and piezoelectric voltage constant ($g_{33}$) higher than 50 [${\times}10^{-3}Vm/N$]. The transition temperature ($T_{OT}$) of the (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals between orthorhombic and tetragonal phases is also observed to be about $61^{\circ}C$. Because their electromechanical coupling factor ($k_{33}$) and piezoelectric voltage constant ($g_{33}$) are higher than those of soft PZT ceramics, it is expected that (001) $Ba(Ti_{0.94}Zr_{0.06})O_3$ single crystals can be used as "lead-free" piezoelectric materials in many piezoelectric applications.

Dielectric and Piezoelectric Properties of (Na0.54K0.46)0.96Li0.04(Nb1-0.10-xTa0.10Sbx)O3 Ceramics ((Na0.54K0.46)0.96Li0.04(Nb1-0.10-xTa0.10Sbx)O3 세라믹스의 유전 및 압전 특성)

  • Byeon, Sun-Min;Yoo, Ju-Hyun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.24 no.8
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    • pp.622-626
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    • 2011
  • Lead-free piezoelectric ceramics with the composition of $(Na_{0.54}K_{0.46})_{0.96}Li_{0.04}(Nb_{1-0.10-x}Ta_{0.10}Sb_x)O_{3}$ (x= 0~8 mol%) were fabricated by nomal sintering at $1,090^{\circ}C$ for 5 h. the phase structure, microstructure and electrical properties were investigated with a emphasis on the influence of the Sb content. All samples exhibit a single perovskite phase over the whole compositional range. For the ceramics with x= 4 [mol%], two phase transitions are observed at $75^{\circ}C$ and $366^{\circ}C$, corresponding to the phase transitions of orthorhombic to tetragonal (To-t) and tetragonal to cubic (Tc), respectively. high electrical properties of $d_{33}$= 210.83 pC/N, kp= 40%, ${\varepsilon}_r$= 1,091.35, $\rho$= 4.54 g/$cm^2$ were obtained from the specimen with x= 4 [mol%], which suggests that the composition ceramics is a promising lead-free piezoelectric material.

Piezoelectric Properties of lead free (Na0.44K0.52)Nb0.84O3-Li0.04(Sb0.06Ta0.1)O3 Ceramics with ZnO Addition (ZnO 첨가량에 따른 비납계 (Na0.44K0.52)Nb0.84O3-Li0.04(Sb0.06Ta0.1)O3 세라믹스의 압전 특성)

  • Lee, Dong-Hyun;Lee, Seung-Hwan;Nam, Sun-Pill;Lee, Young-Hie
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.11
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    • pp.2021-2025
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    • 2010
  • Electrical and structural properties were investigated on the effects of ZnO and the lead-free NKN-LST ceramics with the addition of ZnO were fabricated by a conventional mixed oxide method. A gradual change in the crystal and microstructure was observed with the increase of ZnO addition. For the NKN-LST-ZnO ceramics sintered at $1050^{\circ}C$, bulk density increased with the addition of ZnO and showed maximum value at addition 2.0mol% of ZnO. Curie temperature of the NKN-LST-ZnO ceramics slightly decreased with adding ZnO. The dielectric constant, piezoelectric constant ($d_{33}$) and electromechanical coupling factor ($k_p$) increased at the small amount of ZnO addition, which might be due to the increase in density. The high piezoelectric properties = 153 pC/N, electromechanical coupling factor = 0.484 and dielectric constant = 2883 were obtained for the NKN-LST+0.5ZnO ceramics sintered at $1050^{\circ}C$ for 2h.

Electrical Properties of lead free (Na,K,Li)(Nb,Sb,Ta)O3 Ceramics with MnO2 Addition (MnO2 첨가량에 따른 비납계 (Na,K,Li)(Nb,Sb,Ta)O3 세라믹스의 전기적특성)

  • Lee, Seung-Hwan;Nam, Sung-Pill;Lee, Dong-Hyun;Lee, Sung-Gap;Lee, Sang-Chul;Lee, Young-Hie
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.60 no.4
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    • pp.801-804
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    • 2011
  • Electrical properties and microstructure were investigated on the effects of $MnO_2$ and the lead-free $(Na_{0.44}K_{0.52}Li_{0.04})(Nb_{0.83}Sb_{0.07}Ta_{0.1})O_3$ ceramics with the addition of $MnO_2$ were fabricated by a conventional mixed oxide method. A gradual change in the crystal and microstructure was observed with the increase of $MnO_2$ addition. For the NKN-LST-xmol%$MnO_2$ sintered at $1100^{\circ}C$, bulk density increased with the addition of $MnO_2$ and showed maximum value at addition 1.0mol% of $MnO_2$. Curie temperature of the NKN-LST ceramics slightly decreased with adding $MnO_2$. The dielectric constant, piezoelectric constant ($d_{33}$) and electromechanical coupling factor ($k_p$) increased below 0.25mol% of $MnO_2$ addition, which might be due to the increase in density. The high piezoelectric properties = 145 pC/N, electromechanical coupling factor = 0.421 and dielectric constant = 2883 were obtained for the NKN-LST-0.25mol%$MnO_2$ sintered at $1100^{\circ}C$ for 4h.