Introduction to COST 531-A European Action on Lead-free Soldering

• Lee Hyuck-Mo
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2004.09a
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  • pp.59-78
  • /
  • 2004
• PDF

Lead-free Solders on the Electronics (전자부품에서의 무연솔더)

• 김미진;김문일;신규식;정재필
• • Journal of the Microelectronics and Packaging Society
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  • v.7 no.4
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  • pp.49-56
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  • 2000
• PDF

Materials Design and Process Development of Environmental Conscious Materials (Lead-Free Solder Products) (환경 친화적인 반도체 패키지용 소재개발과 공정개발)

• Chung, Eun
• • Proceedings of the Materials Research Society of Korea Conference
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  • 2001.05a
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  • pp.14-14
  • /
  • 2001
• PDF

Characterization of the interface between lead-free solder/UBM using electron microscopy (전자현미경을 이용한 무연솔더/UBM 계면반응 분석)

• 양철웅
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2004.02a
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  • pp.73-94
  • /
  • 2004
• PDF

Lead Free Soldering Technology

• Raish, Thomas
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2000.09a
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  • pp.1-30
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  • 2000
• PDF

(Development of reliability specification of lead free solder ball) (무연솔더볼 신뢰성평가규격 개발)

• 박재현
• • Proceedings of the International Microelectronics And Packaging Society Conference
  • /
  • 2004.11a
  • /
  • pp.8-8
  • /
  • 2004
• PDF

Plating Technology for Lead Free Soldering in Japan

• Arai, Susumu
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2001.09a
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  • pp.1-19
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  • 2001
• PDF

The Growth Kinetics of Intermetallic Compound Layer in Lead-Free Solder Joints (무연솔더 접합 계면의 금속간화합물 생성 및 성장)

• 이창배;이창열;서창제;정승부
• • Journal of Welding and Joining
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  • v.20 no.3
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  • pp.16-23
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  • 2002
• PDF KSCI

Reliability Study of A New Lead-free SnAgBiln Solder For Precision Motor Application

• Yu Chung-Sik
• • Proceedings of the International Microelectronics And Packaging Society Conference
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  • 2005.04a
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  • pp.73-87
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  • 2005
• PDF

SMT 공정에서 Lead-free solder(무연 솔더) 적용에 따른 비전검사기 시스템의 변경 연구

• Park, Jong-Hyeop
• • Proceedings of the IEEK Conference
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  • 2006.06a
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  • pp.431-432
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  • 2006
• PDF

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