• 한국세라믹학회지
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• 제54권4호
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• pp.261-271
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• 2017

Environment-friendly $(K,Na)NbO_3-based$ (KNN) lead-free piezoelectric materials have been studied extensively in the past decade. Significant progress has been made in this field, manifesting competitive piezoelectric performance with that of lead-based, for specific application scenarios. Further understanding of the relationship between high piezoelectricity and microstructure or more precisely, ferroelectric domain structure, domain wall pinning effect, domain wall conduction and local polarization switching underpins the continuous advancement of piezoelectric properties, with the help of piezoresponse force microscopy (PFM). In this review, we will present the fundamentals of scanning probe microscopy (SPM) and its cardinal derivative in piezoelectric and ferroelectric world, PFM. Some representative operational modes and a variety of recent applications in KNN-based piezoelectric materials are presented. We expect that PFM and its combination with some newly developed technology will continue to provide great insight into piezoelectric materials and structures, and will play a valuable role in promoting the performance to a new level.

• 전자통신동향분석
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• 제35권4호
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• pp.1-10
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• 2020

Since the 1960s, semiconductor packaging technology has developed into electrical joining techniques using lead frames or C4 bumps using tin-lead solder compositions based on traditional reflow processes. To meet the demands of a highly integrated semiconductor device, high reliability, high productivity, and an eco-friendly simplified process, packaging technology was required to use new materials and processes such as lead-free solder, epoxy-based non cleaning interconnection material, and laser based high-speed processes. For next generation semiconductor packaging, the study status of two epoxy-based interconnection materials such as fluxing and hybrid underfills along with a laser-assisted bonding process were introduced for fine pitch semiconductor applications. The fluxing underfill is a solvent-free and non-washing epoxy-based material, which combines the underfill role and fluxing function of the Surface Mounting Technology (SMT) process. The hybrid underfill is a mixture of the above fluxing underfill and lead-free solder powder. For low-heat-resistant substrate applications such as polyethylene terephthalate (PET) and high productivity, laser-assisted bonding technology is introduced with two epoxy-based underfill materials. Fluxing and hybrid underfills as next-generation semiconductor packaging materials along with laser-assisted bonding as a new process are expected to play an active role in next-generation large displays and Augmented Reality (AR) and Virtual Reality (VR) markets.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.37-42
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• 2003

전자 패키징에 사용되는 솔더합금에 납을 함유됨으로써 인하여 야기되는 환경적 문제와 인체 유해성 때문에 Pb-Sn 합금계를 대체할 수 있는 새로운 무연 솔더 재료의 필요성이 대두되고 있다. 새로운 솔더합금의 개발에 있어서 솔더 조인트의 신뢰성이 가장 중요한 문제라고 할 수 있는데, 솔더 조인트의 신뢰성은 솔더와 기판 사이의 계면 반응 형태와 그 정도에 의해서 크게 영향을 받기 때문에 솔더와 기판 사이의 계면 현상에 관한 더 깊은 이해가 필요하게 된다 솔더링 동안 기판/솔더 계면에서 가장 먼저 생성되는 금속간 화합물의 상을 예측하기 위한 열역학적인 방법이 제안되었다. 계면 에너지와 석출 구동력의 함수로 표현되는 각각의 금속간 화합물에 대한 핵생성 활성화 에너지를 비교함으로써 활성화 에너지가 가장 낮은 금속간 화합물이 가장 먼저 생성된다고 예측하였다. 거기에 더해 에너지를 기반으로 한 계산을 통하여 솔더 조인트에서 금속간 화합물의 입자 형상을 설명하였다. 울퉁불퉁한 계면을 가진 금속간 화합물의 Jackson의 parameter 값은 2보다 작은 반면 평평한 입자의 경우 2보다 크게 된다.

• Safety and Health at Work
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• 제2권2호
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• pp.87-96
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• 2011

In 1967, the problem of occupational lead exposure came to public attention in Korea. Since then, regular progress has been made in lowering workplace lead exposures, instituting new workplace controls, and implementing health examinations of exposed workers. Past serious lead poisoning episodes made it possible to introduce biological monitoring programs on a voluntary basis in high-lead-exposure facilities in Korea. Industry-specific occupational health services for lead workers in Korea during the last 22 years can be categorized into three phases. During the first phase (1988-1993), efforts were directed at increasing awareness among workers about the hazards of lead exposure, biological monitoring of blood zinc protoporphyrin began, and a respiratory protection program was introduced. During the second phase (1994-1997), a computerized health management system for lead workers was developed, blood-lead measurement was added to biologic monitoring, and engineering controls were introduced in the workplace to lower air-lead levels to comply with air-lead regulations. Finally, during the third phase (1998-present), a new biomarker, bone-lead measurement by X-ray fluorescence, was introduced. Bone-lead measurement proved to be useful for assessing body burden and to demonstrate past lead exposure in retired workers. Occupational health service practice for lead workers, including the industry-specific group occupational health system, has brought considerable success in the prevention of lead poisoning and in reducing the lead burden in Korean lead workers during the last several decades. The successful achievement of prevention of lead poisoning in Korea was a result of the combined efforts of lead workers, employers, relevant government agencies, and academic institutes.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.25-30
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• 2018

Sn-Pb솔더는 그동안 자동차 전장품에서 많이 사용되어 왔다. 그러나 최근에 환경과 인체에 대한 유해성 때문에 end-of-life vehicle (ELV)과 같은 국제 환경 규제로 인하여 Pb의 사용이 금지되었다. 이러한 이유로 자동차 전장품을 위한 Pb-free 솔더링에 관한 많은 연구들이 보고 되어 왔다. 한편, 자동차의 연료 효율성과 공간 활용을 위하여 유연성과 경량의 특성을 가지는 플렉시블 기판이 자동차 전장품에 사용되고 있다. 자동차 전장품에 대한 Pb-free 솔더 접합부 특성에 관한 연구들이 많이 진행되었음에도 불구하고 자동차의 사용 환경을 고려한 플렉시블 기판 솔더 접합부에 대한 신뢰성 특성에 관한 연구는 아직 부족한 실정이다. 본 연구에서는 organic solderability preservative (OSP) 및 electroless nickel immersion gold (ENIG) 표면처리 된 플렉시블 기판 위 Sn3.0Ag0.5Cu, Sn0.7Cu, Sn0.5Cu0.01Al(Si) 세 가지 Pb-free 솔더 접합부에 대한 특성을 보고 하였다. 솔더 조성과 기판 표면처리에 따른 접합부의 특성 및 신뢰성을 비교 평가 하기 위하여 인장 강도 시험, 열 충격 시험과 반복 굽힘 시험을 진행 하고 그 결과를 분석하였다. OSP 표면처리 된 기판 접합부에 대한 반복 굽힘 시험 결과 세 종류의 솔더 접합부 모두 파괴는 솔더 내부에서 일어 났으며 Sn3.0Ag0.5Cu 솔더의 접합부에서 반복 굽힘 수명이 가장 길게 나타났다.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2015년도 춘계 학술논문 발표대회
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• pp.126-127
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• 2015

New technologies using a CNC machine to reduce the production cost of free-form buildings are being developed. To produce free-form members with such technologies, a vast free form building should be first divided into multiple panels that can be produced. Considering the curved surface of free-form buildings, the shape and size of divided freeform panels vary, which will lead to a great deal of errors. Currently, the engineers and designers complete the panelizing work through trials and errors even in large-scale projects, which results in increased construction duration and cost. Thus, it is necessary to develop a freeform panelizing technology to maximize the economic effects of free-form concrete member production technology. The purpose of the study is to analyze influence factors on panelizing of free-form buildings, which is a preceding research for development of a panelizing technology. The influence factors drawn will provide a core basis for development of panelizing technologies for free-form buildings.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.221-232
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.181-199
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.135-144
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• 2004

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.123-134
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• 2004