• Journal of the Korean institute of surface engineering
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• v.48 no.6
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.467-471
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• 2005

In this paper, experimental methods about the flow behavior of thin polymer film by various edge patterns in the spin coating process for stable cover layer coating of a blu-ray disc is described. The blu-ray disc, a next-generation optical disc format over 25GB, consists of a 1.1m thick substrate and a 0.1mm tick cover layer. Generally, cover layer on the blu-ray disc is made by the polymer spin coating process. However, it is hard to secure sufficient coating uniformity around the rim on the cover layer. In order to get the uniform thickness deviation and to minimize the bead around the rim, the edge of the disc substrate can be modified into various patterns, such as normal plain, trench, step and chamfer pattern, etc, around the rim on the disc and experimented with various parameters, such as surface tension, viscosity, coating time, temperature and rotation speed, etc. And the optimal shape of the rim was tried to get by 3 dimensional computer simulation of the polymer expulsion process.

• Journal of the Korean Institute of Telematics and Electronics B
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• v.31B no.9
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• pp.159-165
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• 1994

In this paper, we propose a multi-layer associative neural network structure suitable for hardware implementaion with the function of performance refinement and improved robutst capability. Unlike other methods which reduce network complexity by putting restrictions on synaptic weithts, we are imposing a requirement of hidden layer neurons for the function. The proposed network has synaptic weights obtainted by Hebbian rule between adjacent layer's memory patterns such as Kosko's BAM. This network can be extended to arbitary multi-layer network trainable with Genetic algorithm for getting hidden layer memory patterns starting with initial random binary patterns. Learning is done to minimize newly defined network error. The newly defined error is composed of the errors at input, hidden, and output layers. After learning, we have bidirectional recall process for performance improvement of the network with one-shot recall. Experimental results carried out on pattern recognition problems demonstrate its performace according to the parameter which represets relative significance of the hidden layer error over the sum of input and output layer errors, show that the proposed model has much better performance than that of Kosko's bidirectional associative memory (BAM), and show the performance increment due to the bidirectionality in recall process.

• Journal of Internet of Things and Convergence
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• v.9 no.3
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• pp.61-67
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• 2023

In order to optimize the pulse electroforming copper process, a double hidden layer BP (Back Propagation) neural network is constructed. Through sample training, the mapping relationship between electroforming copper process conditions and target properties is accurately established, and the prediction of microhardness and tensile strength of the electroforming layer in the pulse electroforming copper process is realized. The predicted results are verified by electrodeposition copper test in copper pyrophosphate solution system with pulse power supply. The results show that the microhardness and tensile strength of copper layer predicted by "3-4-3-2" structure double hidden layer neural network are very close to the experimental values, and the relative error is less than 2.32%. In the parameter range, the microhardness of copper layer is between 100.3~205.6MPa and the tensile strength is between 112~485MPa.When the microhardness and tensile strength are optimal,the corresponding process conditions are as follows: current density is 2A-dm-2, pulse frequency is 2KHz and pulse duty cycle is 10%.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.3
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• pp.139-143
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• 2017

N-type crystalline silicon solar cells have high metal impurity tolerance and higher minority carrier lifetime that increases conversion efficiency. However, junction quality between the boron diffused layer and the n-type substrate is more important for increased efficiency. In this paper, the current status and prospects for boron diffused layers in N-type crystalline silicon solar cell applications are described. Boron diffused layer formation methods (thermal diffusion and co-diffusion using $a-SiO_X:B$), boron rich layer (BRL) and boron silicate glass (BSG) reactions, and analysis of the effects to improve junction characteristics are discussed. In-situ oxidation is performed to remove the boron rich layer. The oxidation process after diffusion shows a lower B-O peak than before the Oxidation process was changed into $SiO_2$ phase by FTIR and BRL. The $a-SiO_X:B$ layer is deposited by PECVD using $SiH_4$, $B_2H_6$, $H_2$, $CO_2$ gases in N-type wafer and annealed by thermal tube furnace for performing the P+ layer. MCLT (minority carrier lifetime) is improved by increasing $SiH_4$ and $B_2H_6$. When $a-SiO_X:B$ is removed, the Si-O peak decreases and the B-H peak declines a little, but MCLT is improved by hydrogen passivated inactive boron atoms. In this paper, we focused on the boron emitter for N-type crystalline solar cells.

• Korean Journal of Materials Research
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• v.19 no.4
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• pp.207-211
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• 2009

In this study, we attempted to develop a convenient aluminizing process, using Al-Ti mixed slurry as an aluminum source, to control the Al content of the aluminized layer as a result of a one-step process and can be widely adopted for coating complex-shaped components. The aluminizing process was carried out by the heat treatment on disc and rod shaped S45C steel substrates with Al-Ti mixed slurries that were composed of various mixed ratios (wt%) of Al and Ti powders. The surface of the resultant aluminized layer was relatively smooth with no obvious cracks. The aluminized layers mainly contain an Fe-Al compound as the bulk phase. However, the Al concentration and the thickness of the aluminized layer gradually decrease as the Ti proportion among Al-Ti mixed slurries increases. It has also been shown that the Al-Ti compound layer, which formed on the substrate during heat treatment, easily separates from the substrate. In addition, the incorporation of Ti into the substrate surface during heat treatment was not observed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.2
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• pp.126-132
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• 2017

The power conversion efficiency of organic polymer solar cells was enhanced by introducing a ferroelectric polymer layer at the interface between active layer and metal electrode. The power conversion efficiency was increased by 50% through the enhancement of the open circuit voltage. To investigate the role of the ferroelectric layer on the dissociation process of the excitons, non-radiative portion of the exciton decay was directly measured by using photoacoustic technique. The results show that the ferroelectric nature of the buffer layer does not play any roles on the dissociation process of the excitons, which indicates the efficiency enhancement is not due to the ferroelectricity of the buffer layer.

• Journal of Powder Materials
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• v.4 no.3
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2014.11a
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• pp.215-215
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• 2014

Composites layer of Al-Cr-Ni-O system was prepared on a steel plate by hydro-thermal process at $700^{\circ}C$ for 12 hours, which phase identification and thermal conductivity were determined. The composites layer consisted of aluminum nitride, alumina, chromium carbide and aluminium, which density was $3.7kg/m^3$. The thermal conductivity of the coating layer determined by thermal data acquisition system was about 98.0 W/m/ which depended on the AlN content. Numerical modelling of the heat transfer behavior of the coating layer was well agreement with the empirical data.

• ETRI Journal
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• v.36 no.4
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• pp.564-571
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• 2014

Sphere decoding (SD) for multiple-input and multiple-output systems is a well-recognized approach for achieving near-maximum likelihood performance with reduced complexity. SD is a tree search process, whereby a large number of nodes can be searched in an effort to find an estimation of a transmitted symbol vector. In this paper, a simple and generalized approach called layer pruning is proposed to achieve complexity reduction in SD. Pruning a layer from a search process reduces the total number of nodes in a sphere search. The symbols corresponding to the pruned layer are obtained by adopting a QRM-MLD receiver. Simulation results show that the proposed method reduces the number of nodes to be searched for decoding the transmitted symbols by maintaining negligible performance loss. The proposed technique reduces the complexity by 35% to 42% in the low and medium signal-to-noise ratio regime. To demonstrate the potential of our method, we compare the results with another well-known method - namely, probabilistic tree pruning SD.