• 한국자기학회지
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• 제20권5호
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• pp.191-195
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• 2010

두 차례에 걸친 양극 산화 과정 중 1차 양극 산화 시 성장한 초기 산화 피막의 제거와 2차 양극 산화 시간에 따른 다공성 알루미나 막의 성장에 대해 살펴보았다. 다공성 알루미나 막의 제작은 인산을 전해 용액으로 사용하여 두 차례의 양극산화 과정을 통해 이루어졌으며 초기 산화 피막의 제거가 2차 양극 산화 후 나타나는 알루미나 막 표면상의 기공구조형성에 미치는 영향과 함께 2차 양극 산화 시간에 따라 성장하는 알루미나 막의 두께 변화를 관찰하였다. 그 결과 1차 양극 산화 후 인산과 크롬산을 이용한 식각 과정에서 이루어진 산화 피막의 제거 정도에 따라 형성되는 다공 구조의 균일도가 향상됨을 관찰 할 수 있었다. 또한 2차 양극 산화 시간에 따라 산화 막의 두께가 선형적으로 증가함을 알 수 있었다. 본 연구를 통해 인산용액을 전해액으로 사용하였을 경우 150 V의 양극 산화 전압 하에서 다공성 알루미나 막의 성장률은 22.5 nm/min임을 확인 할 수 있었다.

• 환경위생공학
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• 제15권3호
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• pp.37-43
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• 2000

The purpose of this experimental study examine characteristics of blood pigments removal of butchery wastewater by heat processed eggshell, compare activated carbon with its efficiency. Calcined eggshell were classified into four kinds of mesh as HPES-32(Heat Processed Eggshell 32 $mesh=500{\mu}m$), HPES-48($300{\mu}m$), HPES-150($180{\mu}m$) and HPES-150($106{\mu}m$). And two contacting process of CMFA(Complete Mixing Float Adsorption) and FLFA(Fixing layer Flow Adsorption) Were used for getting removal efficiency of blood pigments. In case of using CMFA process, the removal efficiency of blood pigments was occurred as HPES-80>HPES-150>HPES-32, but in case of using FLFA process was occurred as HPES-150>HPES-80>HPES-48>HPES-32. The two results between CMFA and FLFA were differ in strength of removal efficiency of blood pigments.

• 한국환경복원기술학회지
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• 제6권6호
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• pp.49-55
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• 2003

Total phosphorous removal rate was examined of a subsurface-flow treatment wetland system which was constructed on floodplain in the down reach of the Kwangju Stream in Korea from May to June 2001. Its dimensions were 29 meter in length, 9 meter in width and 0.65 meter in depth. A bottom layer of 45 cm in depth was filled with crushed granite with about 15~30 mm in diameter and a middle layer of 10 cm in depth had pea pebbles with about 10 mm in diameter. An upper layer of 5 cm in depth contained course sand. Reeds(Phragmites australis) were transplanted on the surface of the system. They were dug out of natural wetlands and stems were cut at about 40 cm height from their bottom ends. Water of the Kwangju Stream flowed from a submerged dam into it via a pipe by gravity flow and treated effluent was funneled back into the Stream. The number of reed stems increased from 80 stems/$m^2$ in July 2001 to 136 stems/$m^2$ in September 2001. The hight of stems was 44.2 cm in July 2001 and 75.3 cm in September 2001. The establishment of reeds at early operating stage of the system was good. Volume and water quality of inflow and outflow were investigated from July 2001 through December 2001. The average inflow was 40 $m^3$/day and hydraulic detention time was about 1.5 days. The concentration of total phosphorous n influent and effluent was 0.83 and 0.33 mg/L, respectively. The removal rate of total phosphorous averaged about 60%. The removal efficiency was slightly higher, compared with that of subsurface-flow wetlands operating in North America, whose retention rate of total phosphorous was reported to be about 56%. The good abatement rate could be attributed to sedimentation of particle phosphorous in pores of the media and adsorption of phosphorous to the biofilm developed on the surface of them. Increase of standing density of reeds within a few years will develop root zones which may lead to increment in the phosphorous retention rate.

• 상하수도학회지
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• 제22권1호
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• pp.131-140
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• 2008

The application of magnetic ion exchange resin($MIEX^{(R)}$) is effective for natural organic matter(NOM) removal and for control of the formation of disinfection byproducts(DBPs). NOM removal is also enhanced by adding $MIEX^{(R)}$ with coagulant such as polyaluminium chloride(PACl) in conventional drinking water treatment systems. In the application of $MIEX^{(R)}$, it is important to understand changes of NOM characteristics such as hydrophobicity and molecular weight distributions with $MIEX^{(R)}$ or $MIEX^{(R)}$+coagulant treatment.To observe characteristics of NOM by treatment with $MIEX^{(R)}$ or $MIEX^{(R)}$+coagulant, four major drinking water sources were employed. Results showed that the addition of $MIEX^{(R)}$ to coagulation significantly reduced the amount of coagulant required for the optimum removal of dissolved organic matter(DOC) and turbidity in the all four waters. The DOC removal was also increased approximately 20%, compared to coagulant treatment alone. The process with $MIEX^{(R)}$ and coagulant showed that complementary removal of hydrophobic and hydrophilic fraction of DOC. The combined processes preferentially removed the fractions of intermediate (3,000-10,000 Da) and low (< 500 Da) molecular weight. The microfiltration test showed that membrane cake resistance was decreased for waters with flocs from $MIEX^{(R)}$+coagulant. A porous layer was formed to $MIEX^{(R)}$ on the membrane surface and the layer consequently inhibited settling of coagulant flocs, which could act on a foulant.

• 상하수도학회지
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• 제22권4호
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• pp.467-473
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• 2008

Natural organic matter (NOM) removal by physico-chemical adsorption and biological oxidation was investigated in five slow sand filters with different media depths. Non-purgeable dissolved organic carbon(NPDOC) and $UV_{254}$ absorbance were measured to evaluate the characteristics of NOM removal at different filter depths. Removal efficiency of NOM was in the range of 10-40% throughout the operation time. At start-up of the filters packed with clean sand media, NOM was probably removed by physico-chemical adsorption on the surface of sand through the overall layer of filter bed. However, when Schumutzdecke layer was built up after 30 days operation, the major portion of NPDOC was removed by biological oxidation and/or bio-sorption in lower depth above 50 mm. NOM removal rate in the upper 50 mm filter bed was $0.82hr^{-1}$. It was about 20 times of the rate($0.04hr^{-1}$) in the deeper filter bed. Small portion of NPDOC could be removed in the deeper filter bed by both bio-sorption and biodegradation. SEM analysis and VSS measurement clearly showed the growth of biofilm in the deeper filter bed below 500 mm, which possibly played an important role in the NOM removal by biological activity besides the physco-chemical adsorption mechanism

• 한국농공학회논문집
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• 제56권6호
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• pp.85-91
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• 2014

In this study, the water quality purification of new medias which were NPS media, hyugato, mineral stone, charcoal for applying soil media of Integrated Management Practices (IMPs) of Low Impact Development (LID) were evaluated. The influent concentrations of COD, T-N, and T-P were 117.8 mg/L, 17.1 mg/L, and 2.062 mg/L, respectively. The infiltration capacities of NPS media, hyugoto, mineral stone, charcoal, and gravel were $7.1{\times}10m/s$, $7.3{\times}10^{-5}m/s$, $7.9{\times}10^{-5}m/s$, $6.0{\times}10^{-5}m/s$, respectively. All media meet criteria of infiltration capacity as surface soil layer at IMPs which is over $1.0{\times}10^{-5}m/s$. Maximum removal rates of COD, T-N, and T-P occurred at Charcoal with 98 % of COD removal rate, NPS with 78 % of T-N removal rate, and hyugato with 75 % fo T-P removal rate, respectively. For more high removal efficiency of all water quality item, the mixed media which is 4.5(NPS media): 1(charcoal) : 4.5 (hyugato) as volume ratio was evaluated. The infiltration capacity of mixed media was $7.9{\times}10^{-5}m/s$ and met the criteria of infiltration as surface soil layer. The water quality removal efficiencies of mixed media were very high with showing 70 % for COD, 85 % for T-N, and 71 % for T-P. The mixed media could purify the water quality of surface runoff and was recommended to used at the LID site of ground water quality problem.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
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• pp.370-373
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• 2003

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing (CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical Planarization(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commerical slurries pads, and post-CMP cleaning alternatives are discuess, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper depostion is a mature process from a historical point of view, but a very young process from a CMP persperspective. While copper electrodepostion has been used and stuidied for dacades, its application to Cu damascene wafer processing is only now ganing complete accptance in the semiconductor industry. The polishing mechanism of Cu CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper pasivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제53권7호
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• pp.377-381
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• 2004

A discharge plasma reactor using a ferroelectric pellet packed bed is now used as a removal means of pollutant gases, such as NOx, SOx and VOCs. When an ac voltage is applied to this plasma reactor, then the pellets are polarized, and great electric fields are formed at each top and bottom contact points of the ferroelectric pellets. Thus the points of each pellet become covered with intense corona discharges, where an electrophysicochemical reaction is taking place strongly However these strong discharges also elevate the temperature of the pellets greatly and concurrently decrease the output ozone generation, as a result, the overall removal efficiency of gas becomes decreased greatly A new configuration of discharge plasma reactor using a ferroelectric pellet layer and a wire-to-wire electrode has been proposed and investigated experimentally. It is found that an intensive microdischarge is taking place on the surface of ac corona-charged ferroelectric pellet layer of the proposed reactor, which concurrently enhances the efficiency of plasma generation greatly And, this type of configuration of plasma reactor utilizing a wire-to-wire electrode and a ferroelectric pellet layer could be used as one of effective plasma reactors to remove pollutant gas.

• Membrane and Water Treatment
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• 제3권2호
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• pp.113-121
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• 2012

Up-flow multi-layer bioreactor (UMBR) is a hybrid system using dual sludge that consists of an up-flow multi-layer bioreactor as anaerobic/anoxic suspended growth microorganisms followed by an aeration tank. The UMBR acts as a primary settling tank, anaerobic/anoxic reactor, thickener which requires low energy due to mixing by up-flow stream. This study focused on using a pilot UMBR plant with capacity of 20-30 $m^3$/day for domestic wastewater in HCMC. HRTs of UMBR and aeration tank were 4.8 h and 7.2 h, respectively. The average MLSS of UMBR ranged from 10,000-13,600 mg/l SS. Internal recycle rate and sludge return were 200-300% and 150-200%, respectively. The results obtained from this study at flow rate of 20 $m^3$/day showed that removal of COD, SS, TKN, N-$NH_4$, T-N, and color were 91%, 87%, 86%, 80%, 91% and 91%, respectively.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 하계학술대회 논문집 Vol.5 No.1
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• pp.20-23
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• 2004

As the integrated circuit device shrinks to the smaller dimension, the chemical mechanical polishing(CMP) process was required for the global planarization of inter-metal dielectric(IMD) layer with free-defect. However, as the IMD layer gets thinner, micro-scratches are becoming as major defects. Chemical-Mechanical polishing(CMP) of conductors is a key process in Damascene patterning of advanced interconnect structure. The effect of alternative commercial slurries pads, and post-CMP cleaning alternatives are discuss, with removal rate, scratch dentisty, surface roughness, dishing, erosion and particulate density used as performance metrics. Electroplated copper deposition is a mature process from a historical point of view, but a very young process from a CMP perspective. While copper electro deposition has been used and studied for decades, its application to Cu damascene wafer processing is only now gaining complete acceptance in the semiconductor industry. The polishing mechanism of Cu-CMP process has been reported as the repeated process of passive layer formation by oxidizer and abrasion action by slurry abrasives. however it is important to understand the effect of oxidizer on copper passivation layer in order to obtain higher removal rate and non-uniformity during Cu-CMP process. In this paper, we investigated the effects of oxidizer on Cu-CMP process regarding the additional volume of oxidizer.