• Laser Solutions
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• v.11 no.1
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• pp.19-24
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• 2008

It has been recognized that laser dicing of wafers results in low mechanical strength compared to the conventional sawing techniques. Thermal shock generated by rapid thermal loading is responsible for this problem. This work presents a two-dimensional ultra-short thermo elastic model for numerical simulation of femtosecond laser ablation of metals in the high-fluence regime where the phase explosion is dominant. Laser-induced thermoelastic stress is analyzed for Ni. The results show that the laser-induced thermal shock is large enough to induce mechanical damages.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.13 no.3
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• pp.119-125
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• 2004

Generally, it is used the compensation spring to compensate the inaccuracy of screen image induced by thermal deformation in CRT monitor. Its mechanism is bi-metallic system made of heterogeneous metals and these is bonded by laser welding. But laser welding induces the non-uniform temperature distribution and locally residual stress is yielded by these temperature deviation. This paper studies residual stress of laser weldment using FEA and hole drilling method. The results are followed. In the case of heterogeneous materials weldment, higher residual stress induced in the weldment region of SUS 304 which have larger CTE than Ni 36 and residual stress on the middle of specimen is higher by 10.9% than that of its surface Measured residual stress of SUS 304 yield 481MPa and that of Ni 36 is 140.5MPa in the vicinity of the welding region. And the residual distribution is very similar in comparison with FEA result.

• Current Optics and Photonics
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• v.3 no.6
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• pp.502-509
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• 2019

Based on the typical pixel structure and parameters of a polysilicon uncooled bolometer, the absorption rate of a polysilicon microbridge infrared detector for 10.6 ㎛ laser energy was calculated through the optical admittance method, and the thermal coupling model of a polysilicon microbridge component irradiated by far infrared laser was established based on theoretical formulas. Then a numerical simulation study was carried out by means of finite element analysis for the actual working environment. It was found that the maximum temperature and maximum stress of the microbridge component are approximately exponentially changing with the laser power of the irradiation respectively and that they increase monotonically. The highest temperature zone of the model is gradually spread by the two corners of the bridge surface that are not connected to the bridge legs, and the maximum stress acts on both sides of the junction of the microbridge legs and the substrate. The mechanism of laser-induced hard damage to polysilicon detectors is the melting damage caused by high temperature. This paper lays the foundation for the subsequent study of the interference mechanism of the laser on working state polysilicon detectors.

• Journal of Biomedical Engineering Research
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• v.44 no.1
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• pp.85-91
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• 2023

Stress urinary incontinence (SUI) occurs when abdominal pressure increases, such as sneezing, exercising, and laughing. Surgical and non-surgical treatments are the common methods of SUI treatment; however, the conventional treatments still require continuous and invasive treatment. Laser have been used to treat SUI, but excessive temperature increase often causes thermal burn on urethra tissue. Therefore, the optimal conditions must be considered to minimize the thermal damage for the laser treatment. The current study investigated the feasibility of the laser irradiation condition for SUI treatment using non-ablative 980 nm laser from a safety perspective through numerical simulations. COMSOL Multiphysics was used to analyze the numerical simulation model. The Pennes bioheat equation with the Beer's law was used to confirm spatio-temporal temperature distributions, and Arrhenius equation defined the thermal damage caused by the laser-induced heat. Ex vivo porcine urethral tissue was tested to validate the extent of both temperature distribution and thermal damage. The temperature distribution was symmetrical and uniformly observed in the urethra tissue. A muscle layer had a higher temperature (28.3 ℃) than mucosal (23.4 ℃) and submucosal layers (25.5 ℃). MT staining revealed no heat-induced collagen and muscle damage. Both control and treated groups showed the equivalent thickness and area of the urethral mucosal layer. Therefore, the proposed numerical simulation can predict the appropriate irradiation condition (20 W for 15 s) for the SUI treatment with minimal temperature-induced tissue.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.22-22
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• 2009

Laser forming is a promising technology in manufacturing, such as in the shipbuilding, automobile, microelectronics, aerospace and other manufacturing industries. This process forms the sheet metal by utilization of laser-induced thermal stresses. Laser forming process has been studied extensively for rectangular shape geometry. This basic study presents the change in deformation behavior of sheet metal during transition from linear to curved geometries and irradiations as well. A series of experiments have been conducted on a wide range of specimen geometries such as quarter-circular and half circular plate. The reasons for this behavior have been analyzed. Results are compared and analyzed by simulations using ABAQUS. Influence of developed stresses on the bending has been investigated. This study provides the more understanding of forming mechanism influenced by geometry effect.

• Computers and Concrete
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• v.19 no.6
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• pp.701-710
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• 2017

In this study, the thermoelastic beam in modified couple stress theory due to laser source and heat flux is investigated. The beam are heated by a non-Guassian laser pulse and heat flux. The Euler Bernoulli beam theory and the Laplace transform technique are applied to solve the basic equations for coupled thermoelasticity. The simply-supported and isothermal boundary conditions are assumed for both ends of the beam. A general algorithm of the inverse Laplace transform is developed. The analytical results have been numerically analyzed with the help of MATLAB software. The numerically computed results for lateral deflection, thermal moment and axial stress due to laser source and heat flux have been presented graphically. Some comparisons have been shown in figures to estimate the effects of couple stress on the physical quantities. A particular case of interest is also derived. The study of laser-pulse find many applications in the field of biomedical, imaging processing, material processing and medicine with regard to diagnostics and therapy.

• Korean Journal of Materials Research
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• v.12 no.10
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• pp.820-824
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• 2002

It is of importance to know that the bonding strength and interfacial stress of SOI wafer pairs to meet with mechanical and thermal stresses during process. We fabricated Si/2000$\AA$-SiO$_2$ ∥ 2000$\AA$-SiO$_2$/Si SOI wafer pairs with electric furnace annealing, rapid thermal annealing (RTA), and fast linear annealing (FLA), respectively, by varying the annealing temperatures at a given annealing process. Bonding strength and interfacial stress were measured by a razor blade crack opening method and a laser curvature characterization method, respectively. All the annealing process induced the tensile thermal stresses. Electrical furnace annealing achieved the maximum bonding strength at $1000^{\circ}C$-2 hr anneal, while it produced constant thermal tensile stress by $1000^{\circ}C$. RTA showed very small bonding strength due to premating failure during annealing. FLA showed enough bonding strength at $500^{\circ}C$, however large thermal tensile stress were induced. We confirmed that premated wafer pairs should have appropriate compressive interfacial stress to compensate the thermal tensile stress during a given annealing process.

• Journal of Welding and Joining
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• v.22 no.3
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• pp.45-49
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• 2004

Generally, it is used the compensation spring to compensate the inaccuracy of screen image induced by thermal deformation in CRT monitor. Its mechanism is hi-metallic system made of heterogeneous metals and these springs are bonded by laser welding. But laser welding induces a non-uniform temperature distribution, and residual stress is yielded locally by these temperature deviation. Therefore, this study measures the curvature constant to assess functions of the compensation spring of shadow mask with respect to increment temperature and estimates the effect of residual stress on the performance of tri-metal used to compensation spring.

• Journal of Aerospace System Engineering
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• v.17 no.4
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• pp.18-27
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• 2023

In this paper, the structural-thermal-optical performance analysis of the mirror was performed by setting the laser heat source as the boundary condition of the thermal analysis. For the laser heat source model, the Beer-Lambert model considering semi-transparent optical material based on Gaussian beam was selected as the boundary condition, and the mechanical part was not considered, to analyze the performance of only the mirror. As a result of the thermal analysis, thermal stress and thermal deformation data due to temperature change on the surface of the mirror were obtained. The displacement data of the surface due to thermal deformation was fitted to a Zernike polynomial to calculate the optical performance, through which the performance of the mirror when a high-energy laser was incident on the mirror could be predicted.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.157-157
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• 2010

Vertical-structure light-emitting diodes (V-LEDs) by laser lift-off (LLO) have been exploited for high-efficiency GaN-based LEDs of solid-state lightings. In V-LEDs, emitted light from active regions is reflected-up from reflective ohmic contacts on p-GaN. Therefore, silver (Ag) is very suitable for reflective contacts due to its high reflectance (>95%) and surface plasmon coupling to visible light emissions. In addition, low contact resistivity has been obtained from Ag-based ohmic contacts annealed in oxygen ambient. However, annealing in oxygen ambient causes Ag to be oxidized and/or agglomerated, leading to degradation in both electrical and optical properties. Therefore, preventing Ag from oxidation and/or agglomeration is a key aspect for high-performance V-LEDs. In this work, we demonstrate the enhanced thermal stability of Ag-based Ohmic contact to p-GaN by reducing the thermal compressive stress. The thermal compressive stress due to the large difference in CTE between GaN ($5.6{\times}10^{-6}/^{\circ}C$) and Ag ($18.9{\times}10^{-6}/^{\circ}C$) accelerate the diffusion of Ag atoms, leading to Ag agglomeration. Therefore, by increasing the additional residual tensile stress in Ag film, the thermal compressive stress could be reduced, resulting in the enhancement of Ag agglomeration resistance. We employ the thin Ni layer in Ag film to form Ni/Ag mutli-layer structure, because the lattice constant of NiO ($4.176\;{\AA}$ is larger than that of Ag ($4.086\;{\AA}$). High-resolution symmetric and asymmetric X-ray diffraction was used to measure the in-plane strain of Ag films. Due to the expansion of lattice constant by oxidation of Ni into NiO layer, Ag layer in Ni/Ag multi-layer structure was tensilely strained after annealing. Based on experimental results, it could be concluded that the reduction of thermal compressive stress by additional tensile stress in Ag film plays a critical role to enhance the thermal stability of Ag-based Ohmic contact to p-GaN.