• 제목/요약/키워드: laser etching

검색결과 256건 처리시간 0.041초

휴대폰용 도광판의 도트패턴 가공방법에 따른 금형 및 성형품의 표면특성연구 : 레이저가공, 부식, LiGA-reflow방법 (A Study on the surface characteristics of mold and injection molded part depending on mold fabrication methods of dot pattern of LGP of cellular phone : Laser Ablation, Chemical Etching, LiGA-Reflow method)

  • 도영수;김종선;고영배;김종덕;윤경환;황철진
    • 한국광학회:학술대회논문집
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    • 한국광학회 2007년도 하계학술발표회 논문집
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    • pp.361-362
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    • 2007
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고온초전도 박막을 이용한 마이크로스트립 대역통과 필터의 제작 (Fabrication of Microstrip Band-Pass Filter using HTS Thin Film)

  • 허원일;정동철;김민기;임성훈;한병성
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 1996년도 추계학술대회 논문집
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    • pp.389-392
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    • 1996
  • The recent development of high temperature superconducting epitaxial thin film offer great potential for planar passive microwave application such as ring resonator, filters, transmission lines, and antennas. This paper describes the fundamental properties of Microstrip Band-Pass Filter using HTS Thin Film and its application to microwave devices. In order to fabricate HTS microstrip multiple filters, We have grown laser ablated HTS thin films, patterned by photolithographic process and wet etching processes intro HTS microwave devices.

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미세금형 가공을 위한 전기화학식각공정의 유한요소 해석 및 실험 결과 비교

  • 류헌열;임현승;조시형;황병준;이성호;박진구
    • 한국재료학회:학술대회논문집
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    • 한국재료학회 2012년도 춘계학술발표대회
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    • pp.81.2-81.2
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    • 2012
  • To fabricate a metal mold for injection molding, hot-embossing and imprinting process, mechanical machining, electro discharge machining (EDM), electrochemical machining (ECM), laser process and wet etching ($FeCl_3$ process) have been widely used. However it is hard to get precise structure with these processes. Electrochemical etching has been also employed to fabricate a micro structure in metal mold. A through mask electrochemical micro machining (TMEMM) is one of the electrochemical etching processes which can obtain finely precise structure. In this process, many parameters such as current density, process time, temperature of electrolyte and distance between electrodes should be controlled. Therefore, it is difficult to predict the result because it has low reliability and reproducibility. To improve it, we investigated this process numerically and experimentally. To search the relation between processing parameters and the results, we used finite element simulation and the commercial finite element method (FEM) software ANSYS was used to analyze the electric field. In this study, it was supposed that the anodic dissolution process is predicted depending on the current density which is one of major parameters with finite element method. In experiment, we used stainless steel (SS304) substrate with various sized square and circular array patterns as an anode and copper (Cu) plate as a cathode. A mixture of $H_2SO_4$, $H_3PO_4$ and DIW was used as an electrolyte. After electrochemical etching process, we compared the results of experiment and simulation. As a result, we got the current distribution in the electrolyte and line profile of current density of the patterns from simulation. And etching profile and surface morphologies were characterized by 3D-profiler(${\mu}$-surf, Nanofocus, Germany) and FE-SEM(S-4800, Hitachi, Japan) measurement. From comparison of these data, it was confirmed that current distribution and line profile of the patterns from simulation are similar to surface morphology and etching profile of the sample from the process, respectively. Then we concluded that current density is more concentrated at the edge of pattern and the depth of etched area is proportional to current density.

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2단계 접착제의 상아질 결합강도에 대한 Er:YAG 레이저 조사 영향 (Effect of Er:YAG lasing on the dentin bonding strength of two-step adhesives)

  • 송병춘;조영곤;이명선
    • Restorative Dentistry and Endodontics
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    • 제36권5호
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    • pp.409-418
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    • 2011
  • 연구목적: 이 연구는 상아질 표면에 Er:YAG 레이저를 조사하지 않는 군, 레이저를 조사한 군, 레이저를 조사한 후 부가적인 산처리를 한 군으로 분류하여 2단계 단일병 전부식 접착시스템과 자가부식 프라이머 접착시스템을 이용하여 복합레진을 접착하였을 때 이러한 표면처리가 복합레진의 미세전단 결합강도와 결합계면에 미치는 영향을 비교하기 위하여 시행하였다. 연구 재료 및 방법: 32개의 발거된 대구치의 교합면측 상아질을 이용하였고, 상아질의 표면처리는 1군과 4군에서 각각 인산과 자가부식 프라이머로 하였으며, 2군과 5군은 Er:YAG 레이저로 에칭처리하였고, 3군과 6군은 레이저로 에칭한 후 다시 각각 인산과 자가부식 프라이머로 하였다. 1군, 2군, 3군은 Single Bond 2와 Z 250 (3M ESPE)을 이용하였고, 4군, 5군, 6군은 Clearfil SE Bond와 Clearfil AP-Z (Kuraray)을 이용하여 상아질 면에 Tygon tube를 접착하였다. 각 군의 미세전단 결합강도를 측정한 후 통계 처리하였고, 또한 6개의 시편에서 복합레진과 상아질 계면을 주사전자현미경하에서 관찰하였다. 결과: Single Bond 2를 사용한 군에서 2군의 결합강도는 1군과 3군보다 통계학적으로 낮게 나타났으며, Clearfil SE Bond를 사용한 군에서 4군, 5군, 6군의 결합강도는 각각 통계학적으로 유의한 차이를 나타내었다(p < 0.05). 2군과 5군은 아주 짧고 가는 레진테그가 관찰되었고, 3군과 6군은 길고 가는 레진테그와 레진테그의 측지가 관찰되었다. 결론: 레이저로 에칭 처리한 상아질에 대한 부가적인 산 처리나 자가부식 프라이머의 처리는 상아질의 접착력을 향상시켰다.

광디스크용 마이크로미러의 설계 및 제작에 관한 연구 (A Study on the Design and Fabrication for the Micro-Mirror of Optical Disk System)

  • 손덕수;김종완;임경화;서화일;이우영
    • 한국정밀공학회지
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    • 제19권11호
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    • pp.211-220
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    • 2002
  • Optical disk drives read information by replacing a laser beam on the disk track. As information has become larger, the more accurate position control of a laser beam is necessary. In this paper, we report the analysis and fabrication of the micro mirror for optical disk drivers. A coupled simulation of gas flow and structural displacement of the micro mirror using the Finite-Element-Method is applied to this. The mirror was fabricated by using MEMS technology. Especially, the process using the lapping and polishing step after the bonding of the mirror and electrode plates was employed for the Process reliability. The mirror size was 2.5mm${\times}$3mm and it needed about 35V for displacement of 3.2 ${\mu}$.

MLA(Micro Lens Array) 제작을 위한 광학 시뮬레이션 (The beam property simulation for the fabrication of a MLA(Micro Lens Array))

  • 오해관;서현우;김근영;위창현;송요탁;이기근;양상식
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2009년도 제40회 하계학술대회
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    • pp.1497_1498
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    • 2009
  • This paper presents the simulation of micro-lens arrays based on dry and wet etching technique. Code V (Optical Research Associates Ltd) simulation was performed to extract optimal design parameters of a Micro-Lens Array(MLA). Thickness of UV adhesive, wavelength of laser source, curvature, and shape of lens surface were chosen for the design parameters. The simulation results showed that focal length of a MLA decreased with the increase of UV adhesive thickness. And the focal length depended on shape of lens surface and length of laser source.

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Fabrication of 14 GHz Hairpin Type YBCO Filters

  • 송석천;김철수;이상렬;윤형국;윤영중
    • 한국초전도학회:학술대회논문집
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    • 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
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    • pp.138-141
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    • 1999
  • For the enhancement of communication system performance, high quality filters are required. Conventional metal filters made of copper can be substituted by high quality high temperature superconductivity(HIS) flms for better performance. In order to reduce the size of the filter for the integration of device in the limited area, we have fabricated hairpin type filters using pulsed laser deposition(PLD) technique. The superconducting YBCO thin films have been grown on MgO substrates by PLD with Nd:YAC laser. The YBCO films were patterned by conventional wet-etching process. We have compared YBCO filters and copper filters which were made with the same spec. Simulated and measured frequency responses reveal that HIS YBCO hairpin type bandpass filters show better performance than copper filters.

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펄스 레이저 증착법에 의한 YBCO 박막증착과 이중모드 공진기의 제작 (Fabrication of Novel Dual Mode Resonator Using Superconducting Thin Film Grown by Pulsed Laser Deposition)

  • 박주형;이상렬;안달
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 D
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    • pp.1546-1548
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    • 1998
  • Dual mode ring resonators(DMRR) have been fabricated using laser ablated $YBa_2Cu_3O_{7-x}$ superconducting thin films. The transition temperature of YBCO thin films were 85 - 88 K and the film thicknesses were about 5,000 $\AA$. Dual mode ring resonators were patterned by standard photolithography process and wet-etching. Then two-layer metal thin films (Ti/Ag) have been deposited for the ground plane on the back side of substrate by e-beam and thermal evaporation. The input/output feedline angles of each resonator were $60^{\circ}$, $100^{\circ}$, $180^{\circ}$. A network analyzer was used for testing the performance of the resonators in the frequency range of 6-13 GHz at 77 K.

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글라스 주형을 이용한 폴리머 미세 형상 핫-엠보싱 공정 연구 (Development of a Hot-Embossing Process using Ceramic Glass Molds for Polymer Micro Structures)

  • 김주한;신기훈
    • 한국공작기계학회논문집
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    • 제16권6호
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    • pp.168-174
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    • 2007
  • A ceramic glass mold was developed for micro hot-embossing and replicated polymer parts are fabricated. The glass-ceramic micro mold could be fabricated with a laser process and a wet etching process and the fabrication time could be saved a lot. Various polymer micro structures can be obtained by hot-embossing. The process parameters such as ho-embossing temperatures or pressures were investigated and optimized. This process can be applied for fabrication of micro structures for flip-chips or micro fluidic channels for bio-engineering. The advantages and disadvantages of this process are discussed, too.