• 한국기계가공학회지
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• 제5권1호
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• pp.51-58
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• 2006

The objective of this research work is to investigate into heat transfer characteristics of the laser cutting of CSP 1N sheet using high power CW Nd:YAG laser. In order to investigate the heat transfer characteristics, three dimensional quasi stationary and steady-state heat transfer analysis has been carried out. The laser heat source is assumed as a volumetric heat source with a gaussian heat distribution in a plane. Through the comparison of the results of analyses with those of experiments, the proper finite element model has been obtained. In addition, characteristics of the three-dimensional heat transfer and temperature distribution have been estimated by the finite element model. Finally, the minimum temperature at the center for cutting of the material has been estimated.

• 한국세라믹학회지
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• 제35권1호
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• pp.41-47
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• 1998

Cutting and planarization of diamond films have been performed using copper vapor laser under air at-mosphere. Diamond films of about 350${\mu}{\textrm}{m}$ and 800 ${\mu}{\textrm}{m}$ thick have been synthesized with DC plasma assisted chemical vapor deposition. The position of a specimen has been controlled by computer-driven stage. With copper vapor laser beam of 7W cutting depth increases rapidly and saturates with increasing scan number and decreasing scan speed. 8 repetitive scans at scan speed 0.5 mm/sec produce the maximum cutting depth without focus shifting Rod-shape copper vapor laser beam can be made and used effectively in planar-ization of rough diamond surface.

• 반도체디스플레이기술학회지
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• 제19권2호
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• pp.37-44
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• 2020

In improving laser cutting of optical plastic films for mass production of optoelectronics display units, it is important to understand particle contamination over optical film surface due to fume particle generation and dispersion. This numerical study investigates the effects of downward and upward air flow motions on fume particle dispersion around laser cut line. The simulations employ random particle sampling of up to one million fume particles by probabilistic distributions of particle size, ejection velocity and angle, and fume particle dispersion and surface landing are predicted using Basset-Boussinesq-Oseen model of low Reynolds number flows. The numerical results show that downward air flow scatters fume particles of a certain size range farther away from laser cut line and aggravate surface contamination. However, upward air flow pushes fume particles of this size range back toward laser cut line or sucks them up with rising air motion, thus significantly alleviating surface contamination.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2013년도 춘계학술대회 논문집
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• pp.497-498
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• 2013

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2009년도 춘계학술대회 논문집
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• pp.117-118
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• 2009

• 반도체디스플레이기술학회지
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• 제5권3호
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• pp.5-10
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• 2006

This paper investigates cutting qualities after laser dicing and predicts the problems that can be generated by laser dicing. And through 3 point bending test, die strength is measured and the die strength after laser dicing is compared with the die strength after mechanical sawing. Laser dicing is chiefly considered as an alternative to overcome the defects of mechanical sawing such as chipping on the surface and crack on the back side. Laser micromachining is based on the thermal ablation and evaporation mechanism. As a result of laser dicing experiments, debris on the surface of wafer is observed. To eliminate the debris and protect the surface, an experiment is done using a water soluble coating material and ultrasonic. The consequence is that most of debris is removed. But there are some residues around the cutting line. Unlike mechanical sawing, chipping on the surface and crack on the back side is not observed. The cross section of cutting line by laser dicing is rough as compared with that by mechanical sawing. But micro crack can not be seen. Micro crack reduces die strength. To measure this, 3 point bending test is done. The die strength after laser dicing decreases to a half of the die strength after mechanical sawing. This means that die cracking during package assembly can occur.

• 한국정밀공학회지
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• 제19권9호
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• pp.90-97
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• 2002

Ceramics are being increasingly used in industry due to their outstanding physical and chemical properties. But these materials are difficult to machine by traditional machining processes, because they are hard and brittle. Recently, as one of various alternative processes, laser-beam machining is widely used in the cutting of ceramics. Although the use of lasers presents a number of advantages over other methods, one of the problems associated with this process is the uncertain formation of cracks that result from the thermal stresses. This paper presents a Bayesian probabilistic modeling of crack formation over thin alumina plates during laser cutting.

• 한국정밀공학회지
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• 제12권3호
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• pp.15-22
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• 1995

This paper presents the effects of assistant gas pressure on laser cutting. To investigate the effects of assistant gas pressure, pressure measuring system was constructed with good handling and precision at low price. The measured results discussed compare with that of laser cutting of STS304. The assistant gas pressure varied with the variation of distance between nozzle and workpiece. The peak pressure existed at some distance and could be known by using the deviced pressure measuring system. The higher assistant gas pressure helps to remove the dross and the exothermic energy out of the material. The quantity of dross beneath the workpiece decreases and the kerf width narrows at measured peak pressure.

• Journal of Welding and Joining
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• 제12권3호
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• pp.63-70
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• 1994

Laser processing workmen should select the working condition for laser cutting of new materials by the preparatory experiments for that material or from the past experiences in cutting of other similar materials. This paper proposes a criterion to determine how much a material is similar to other materials by using the Sugeno fuzzy integral. With the proposed criterion the laser processing workman can objectify the considered material for his decision. The expert system programmer can give the system a high flexibility by experimenting with some materials in a large range of similarity and can support the laser processing workman by offering the similarity between materials.

• 반도체디스플레이기술학회지
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• 제19권4호
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• pp.51-58
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• 2020

Many types of optical plastic films are essential in optoelectronics display unit fabrication and it is important to develop high precision laser cutting methods of optical films with extremely low level of film surface contamination by fume particles. This study investigates the effects of suction and blowing air motions with air flow misalignment in removing fume particles from laser cut line by employing random particle trajectory simulation and probabilistic particle generation model. The computational results show fume particle dispersion behaviors on optical film under suction and blowing air flow conditions. It is found that suction air flow motion is more advantageous to blowing air motion in reducing film surface contamination outside designated target margin from laser cut line. While air flow misalignment adversely affects particle dispersion in blowing air flows, its effects become much more complicated in suction air flows by showing different particle dispersion patterns around laser cut line. It is required to have more careful air flow alignment in fume particle removal under suction air flow conditions.