• Polymer(Korea)
• /
• v.33 no.1
• /
• pp.39-44
• /
• 2009

Polymer substrates were fabricated by using poly (phenylene ether) as a base resin, N,N'-m-phenylenedimaleimide (PDMI) as a crosslinking agent and decabromodiphenylethane as a flame retardant. The effects of crosslinking agent and flame retardant on physical properties such as dielectric property of the substrate were investigated. Thermal curing feature of PDMI with or without an initiator was analyzed by DSC, and then, PPE-PDMI test compositions were designed based on this result. Composite sheets were cast by film coater, laminated under vacuum and pressure, and then, the changes of dielectric constant, dielectric loss, peel strength, solder heat resistance and inflammability according to increasing amount of PDMI and flame retardant were evaluated, Dielectric constant and dielectric loss showed increasing trend with increasing amount of PDMI and flame retardant, but solder heat resistance and inflammability were improved. Peel strength was obtained higher than 1 kN/m when PDMI above 10 wt% was added, but slightly decreased as the amount of flame retardant increased. From the measured gel contents, the reaction mechanism of PPE-PDMI system was deduced to the formation of network structure by crosslinking PDMI with PPE rather than the formation of semi-IPN structure. In conclusion, the polymer composite substrate materials with dielectric constant of 2.52$\sim$2.65 and dielectric loss below 0.002 at 1 GHz were obtained and they will be proper for high frequency applications.

• Polymer(Korea)
• /
• v.36 no.4
• /
• pp.413-419
• /
• 2012

Multi-functional urethane acrylate monomers as the curing agent of poly(phenylene ether) (PPE) were synthesized and then the urethane bond formation was checked by FTIR spectrometry and NMR analysis. The synthesized monomers were mixed with PPE and fabricated to dielectric substrates. After forming PPE/monomer composite sheets by a film coater, several sheets were laminated to a test substrate in a vacuum laminator and then its properties depending on the type and the amount of monomers, such as dielectric constant, dielectric loss, and peel strength, were measured. Between the two different hydroxyl acrylates, when the monomer synthesized with 2-hydroxy-3-phenoxypropyl acrylate containing a phenyl group was used as a curing agent, a smaller dielectric loss was obtained and the dielectric constant and loss decreased with a decrease in the amount of the monomer. The peel strength values of the test substrates, however, did not show any specific difference between the cases of two synthesized monomers. As a result, it was obtained the polymer substrate for high frequency application having peel strength of about 10 N, low dielectric constant of 2.54, and low dielectric loss of 0.0027 at 1 GHz.