• 한국산학기술학회논문지
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• 제10권9호
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• pp.2202-2209
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• 2009

모관과 지관의 다양한 접합형상에 대하여 접합궤적을 수학적으로 유도하였다. 이 접합궤적에 용접부의 루트갭 및 절단폭 등을 보정하여 실제적으로 절단궤적을 결정하여 NC 코드를 생성하고 그 경로를 확인하기 위하여 ghost 기능을 구현하였다. 척회전인 C축의 8개 구간별로 A, B축의 Tilting을 사용하여 개선 기능을 구현하였으며, 이는 절단궤적을 따라서 절단하면서 동시에 개선이 가능하도록 6축 CNC 파이프 코스터 전용 CAM 프로그램을 개발하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 춘계학술발표대회 개요집
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• pp.36-38
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• 2002

This paper is a study on the effect of the cutting speed, length of tip-specimen and cutting thickness in CNC gas cutting of the high-tensile steel plate(AH36). Experiments were performed to investigate the variations of cutting surface, surface roughness and kerf width under various cutting conditions.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.186-191
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• 2002

In the CNC gas cutting of steel plate, the cutting quality are strongly dependent on the various cutting conditions. The cutting tests of high tensile steel plate(AH36) were carried out using CNC gas cutting machine at various cutting conditions such as cutting speed, steel plate thickness, distance between tip and specimen etc. The kerf width and the surface roughness of cutting surfaces are examined. The photographs of cutting surface and cutting section are also analyzed.

• Journal of the Korean Wood Science and Technology
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• 제39권2호
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• pp.132-139
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• 2011

This study examined the characteristics of radio-frequency/vacuum dried Korean red pine ($Pinus$ $densoflora$) heavy timbers with 250 ${\times}$ 250 mm (S), 300 ${\times}$ 300 mm (L) in cross section and 300 mm in diameter, and 3,600 mm in length, which were subjected to compressive loading after a kerf pretreatment. The following results were obtained : The drying time was short and the drying rate was high in spite of the large cross section of specimens. The moisture gradient inall specimens was gentle in both longitudinal and transverse directions owing to dielectric heating. The shrinkage of the width in the direction perpendicular to was 21 percent ~ 76 percent of that of the thickness of square timbers in the direction parallel to the mechanical pressure. The casehardening for all specimens was very slight because of significantly reduced ratio of the tangential to radial shrinkage of specimens and kerfing. The surface checks somewhat severely occurred although the occurrence extent of the surface checks on the kerfed specimens was slight compared withthat on the control specimen.

• KIEE International Transactions on Electrophysics and Applications
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• 제2C권6호
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• pp.309-313
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• 2002

In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

• International Journal of Precision Engineering and Manufacturing
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• 제4권1호
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• pp.23-29
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• 2003

Stencil is used normally as a mask for solder pasting on pad of a printed circuit board (PCB). The objective of this study is to develop a stencil cutting system and determine the optimal conditions to make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse duration on the cut edge quality were investigated. In order to analyze the cut surface characteristics (roughness, kerfwidth, dross) optical microscopy, SEM microscopy and roughness measurements were used. As a result, the optimal conditions of cutting process parameters were determined, and the practical feasibility of the proposed system was also examined by using a commercial Gerber file for PCB stencil manufacturing.

• 대한기계학회논문집
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• 제17권2호
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• pp.380-384
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• 1993

In precision wire electrode discharge machining by CAD/CAM, it is the most important problem on machining method to determine the wire electrode offset amout from the accurate calculation of discharge gap in order to increase the machining accuracy, after fixing the main machining conditions such as machining speed, wire tension, coolant conductivity, gap vlotage. The present study shows the relationships between discharge gap and main machining conditions by means of a series of experiment concerned with the gap using the workpiece of STD 11, and suggests the experimental eguation to calculate the accurate wire electrode offset amount under the given machining conditions for spot workers.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1994년도 추계학술대회 논문집
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• pp.156-160
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• 1994

Use of engineering ceramics has been increasing due to the outstanding physical and chemical properties. Conventional machining processes, however, are not applicable due to their hardness and brittleness. Laser cutting is a promising alternative for these ceramics. In this study, experimental data of CO $_{2}$ laser cutting of $Al_{2}$ $O_{3}$ and Si $_{3}$ N $_{4}$ are obtained to give a guide in the industry. Results of $Al_{2}$ $O_{3}$ cutting showed extreme weakness to thermal crack and it was found that pulsed beam has to be used for thick $Al_{2}$ $O_{3}$ specimen. Si $_{3}$ N $_{4}$ showed good results for both CW and pulsed beams. Using pulsed beam resulted narrower kerf width with increased surface roughness a nd reduced cutting speed. It was also found that a parameter call path energy is useful for representing minimum threshold value for possible cutting range with pulsed beam.

• Journal of Welding and Joining
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• 제9권4호
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• pp.69-74
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• 1991

The Plasma Arc Cutting Method using high density and hight temperature beam is well applicable to the cutting of the nonferrous metal (Al alloy ) and stainless steel which are unable to be cut by the use of the oxy-fuel gas. This study focalizes on the cutting phenomena of the plate of (mm) thickness, since the cutting phenomena of thick plates have been rather thoroughly studied. In this study the cutting groove, adhesive phenomena of dross, surface roughness were measured according to the variation of cutting speed and compared with the case of mild steel plates. The result showed that the kerf width variation of Al alloy was similar to the case of mild steel, while that of the stainless steel differed from the mild steel. In the adhesive phenomena of dross, 6(mm) thick plates of Al alloy showed a difference from those of thick plates, but the stainless steel was similar to thick plates. The surface roughness variation of Al alloy wias minimum at 67 cm/min, while that of stainless steel was at 30cm/min.

• Current Optics and Photonics
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• 제3권5호
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• pp.451-457
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• 2019

Laser processing using holograms can greatly improve processing speed, by spatially distributing the laser energy on the target material. However, it is difficult to reconstruct an image with arrays of closely spaced spots for laser processing, because the specklelike interference pattern prevents the spots from getting close to each other. To resolve this problem, a line target was divided in two, reconstructed with orthogonally polarized beams, and then superposed. Their optical reconstruction was performed by computer-generated holograms and a pulsed laser. With this method, we performed two-dimensional (2D) laser drilling of polyimide film, with a kerf width of $20{\mu}m$ and a total processing length of 20 mm.