• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.17 no.8
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• pp.764-771
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• 2005

A theoretical investigation for optimization of conduction-cooled Peltier current leads is undertaken. A Pottier current lead (PCL) is composed of a thermoelectric element (TE), a metallic lead and a high Tc superconductor (HTS) lead in the order of decreasing thermoelectric tempera ture. Mathematical expression for the minimum heat flow per unit current crossing the TE metal interface and that flowing from the metal lead to the joint of the metal and the HTS leads are obtained. It is shown that the temperature at the TE-metal interface possesses a unique optimal value that minimizes the heat flow to the joint and that this optimal value depends on the material properties of the 73 and the metallic lead but not the joint temperature nor electric current. It is also shown that there exists a unique optimal value for the joint temperature between the metal and the HTS leads that minimizes the sum of the power dissipated by ohmic heating in current leads and the refrigerator power consumed to cool the lead, for a given length of the HTS.

• Journal of Ocean Engineering and Technology
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• v.22 no.3
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• pp.96-102
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• 2008

As LNG tank is operated around $-162^{\circ}C$, an experimental approach on the cryogenic temperature tensile and fatigue strengths of SUS304L lap joint weld is very important at the design stage of membrane type LNG tank. In this study, in order to estimate the tensile and fatigue strengths of SUS304L lap joint weld at cryogenic temperature condition, tensile and fatigue tests were conducted. Also, S-N curves are presented with statistical testing method recommended by JSME. As a result of the experimental approach, the d￡sign guide of fatigue strength is proposed and that is expected to be useful for membrane type LNG tank design.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.32 no.11
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• pp.1028-1034
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• 2008

The exhaust systems are usually subjected to vibration or shock at high temperatures. The high temperature fatigue tests of the exhaust systems are rarely performed in domestic industries due to limited number of test facility and high test costs. In this paper, the high temperature fatigue test of some part of the exhaust system, not the whole system, is carried out. The resonator located at the central range is heated in the cylindrical electric furnace and the alternating load is applied on the end of the pipe welded to the resonator. The high temperature fatigue strength of the welded joint is obtained. The location of the fatigue crack is different to that in room temperature.

• Journal of the Semiconductor & Display Technology
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• v.17 no.1
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• pp.35-39
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• 2018

This paper deals with the relaxation of singular stresses developed in an epoxy adhesive at high temperature. The interface stresses are analyzed using BEM. The adhesive employed in this study is an epoxy which can be cured at room temperature. The adhesive is assumed to be linearly viscoelastic. First, the distribution of the interface stresses developed in the adhesive layer under the uniform tensile stress has been calculated. The singular stress has been observed near the interface corner. Such singular stresses near the interface corner may cause epoxy layer separated from adherent. Second, the interfacial thermal stress has been investigated. The uniform temperature rise can relieve the stress level developed in the adhesive layer under the external loading, which can be viewed as an advantage of thermal loading. It is also obvious that temperature rise reduces the bonding strength of the adhesive layer. Experimental evaluation is required to assess a trade-off between the advantageous and deleterious effects of temperature.

• Journal of Acupuncture Research
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• v.32 no.4
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• pp.37-45
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• 2015

Objectives : The main aim of this study is to evaluate changes in the microbiological safety of pharmacopuncture exposed to room temperature for an elapsed period of time. Methods : The four most frequently used pharmacopuncture products were stored in syringes at room temperature at three different hospitals for 24 hours and 48 hours respectively, and they were compared with pharmacopuncture products stored in vials through a sterility and microbial limited test. Results : Storage forms and duration of exposure to room temperature did not show significant difference in bacterial or fungal contamination, which was confirmed by the sterility and microbial limited test. Conclusions : Pharmacopuncture products stored in syringes at room temperature for 24 hours and 48 hours demonstrated their safety in terms of lack of microbiological contamination.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.21 no.10
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• pp.1541-1550
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• 1997

Since the ceramic/metal joint material is made at a high temperature, the residual stress develops when it is cooled from bonding temperature to room temperature due to remarkable difference of thermal expansion coefficient between ceramic and metal. As residual stress at ceramic/metal joints influences the strength of joints, it is important to estimate residual stress quantitatively. In this study, it is attempted to estimate joint residual stress of Si$_3$N$_4$STS304 joints quantitatively and to compare the strength of joints. The difference of residual stress is measured when repeated thermal cycl is loaded, under the conditions of the practical use of the ceramic/metal joint. The residual stress increases at 1 cycle of thermal load but decreases in 3 cycles to 10 cycles of thermal load. And 4-point bending test is performed to examine the influence of residual stress on fracture strength. As a result, it is known that the stress of joint decreases as the number of thermal cycle increases.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.12 no.12
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• pp.5838-5842
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• 2011

The study mainly aims to explore how deterioration of motor control center, namely MCC, and vibration put impact on temperature of bus bar as well as temperature change of bolt-nut joint. The motor control center consists of three internal parts (i.e. R, S, T) which are for motor operation of high capacity. Two dimensional mechanism for measuring temperature was designed and manufactured with infrared temperature sensor. Installing it in inner motor control center enabled researcher to monitor temperature of bus bar as well as amount of change of current regularly. Temperature change of bus bar according to load was primarily examined based on a bolted joint in the experiment. It was clearly verified that temperature change of bus bar was proportional to current consumption. Therefore, installing non-contact two dimensional mechanism for measuring temperature in motor control center would be expected to prevent temperature rise owing to overload current and power outage as well as fire accident which can be triggered by poor electrical contact.

• Advances in materials Research
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• v.1 no.1
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• pp.83-92
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• 2012

The effect of under-bump-metallization (UBM) on electromigration was investigated at temperatures ranging from $135^{\circ}C$ to $165^{\circ}C$. The UBM structures were examined: 5-${\mu}m$-Cu/3-${\mu}m$-Ni and $5{\mu}m$ Cu. Experimental results show that the solder joint with the Cu/Ni UBM has a longer electromigration lifetime than the solder joint with the Cu UBM. Three important parameters were analyzed to explain the difference in failure time, including maximum current density, hot-spot temperature, and electromigration activation energy. The simulation and experimental results illustrate that the addition 3-${\mu}m$-Ni layer is able to reduce the maximum current density and hot-spot temperature in solder, resulting in a longer electromigration lifetime. In addition, the Ni layer changes the electromigration failure mode. With the $5{\mu}m$ Cu UBM, dissolution of Cu layer and formation of $Cu_6Sn_5$ intermetallic compounds are responsible for the electromigration failure in the joint. Yet, the failure mode changes to void formation in the interface of $Ni_3Sn_4$ and the solder for the joint with the Cu/Ni UBM. The measured activation energy is 0.85 eV and 1.06 eV for the joint with the Cu/Ni and the Cu UBM, respectively.

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.285-287
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• 2002

This study is investigated in variations of micro-structures and mechanical properties of Ti/SUS321L joint with bonding temperature and time using brazing method. According to increasing bonding temperature and time, it was observed the thickness of their reaction layer increased. In tensile test, it was examined that the tensile strength had maximum value at the bonding time of 5min and decreased after bonding time over 5min because of increasing their oxides and intermetallic compounds.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.26 no.4D
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• pp.593-600
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• 2006

Joint opening of jointed concrete pavement is caused by change in temperature and humidity of adjoined slab. The magnitude of joint opening influences on the load-transfer-efficiency and the behavior of sealant. If temperature or humidity decreases, joint opening increases. Generally maximum joint opening of a given joint is predicted by using AASHTO equation. While different magnitudes of joint opening at the individual joints have been observed in a given pavement section, AASHTO equation is limited to predict average joint opening in a given pavement section. Therefore the AASHTO equation may underestimate maximum joint for the half of joint in a given pavement section. Joints showing larger opening than the designed may experience early joint sealant failure, early faulting. Also unexpected spalling may be followed due to invasion of fine aggregate into the joints after sealant pop-off. In this study, the variation of the joint opening in a given pavement section was investigated based on the LTPP SMP data. Factors affecting on the variation are explored. Finally a probabilistic joint opening model is developed. This model can account for the reliability of the magnitude of joint opening so that the designer can select the ratio of underestimated joint opening.