• The Journal of Asian Finance, Economics and Business
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• 제8권1호
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• pp.697-710
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• 2021

This paper attempts to study the impact of Financial Literacy on Youth Entrepreneurial Intent in Pakistan. A closed-ended self-administered structured questionnaire covering financial literacy, computer knowledge, financial attitude, and financial knowledge with Entrepreneurial Intent was collected from young entrepreneurs. The research tried to investigate the education level with computer skill to inspect the effect of financial literateness on young generation Entrepreneurial Intent in the context of Pakistan. The research model was tested using PLS-SEM and authenticating a measurement model through the advanced methodology and their association with Entrepreneurial Intent. Results revealed that financial literacy and its two parts (financial attitude and financial knowledge) have a positive impact on Entrepreneurial Intent. The size of the joint impact of financial literacy and its components on Entrepreneurial Intent was assessed to be adequate. Entrepreneurial Intent is essential for creating new firms to maintain economic development. Furthermore, it is determined in this research that if youth has better financial knowledge and financial attitude, the probability of Entrepreneurial Intent increases. This suggests that if the youth in Pakistan desire to attain a higher limit of Entrepreneurial Intent, they must implement financial literacy models for enhancing and promoting their current Entrepreneurial Intent.

• ETRI Journal
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• 제42권1호
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• pp.67-77
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• 2020

Image captioning has received significant interest in recent years, and notable results have been achieved. Most previous approaches have focused on generating visual descriptions from images, whereas a few approaches have exploited visual descriptions for image classification. This study demonstrates that a good performance can be achieved for both description generation and image classification through an end-to-end joint learning approach with a loss function, which encourages each task to reach a consensus. When given images and visual descriptions, the proposed model learns a multimodal intermediate embedding, which can represent both the textual and visual characteristics of an object. The performance can be improved for both tasks by sharing the multimodal embedding. Through a novel loss function based on class activation mapping, which localizes the discriminative image region of a model, we achieve a higher score when the captioning and classification model reaches a consensus on the key parts of the object. Using the proposed model, we established a substantially improved performance for each task on the UCSD Birds and Oxford Flowers datasets.

• 한국정밀공학회지
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• 제30권5호
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• pp.507-512
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• 2013

This paper proposes a new model to compensate for errors of a five-axis machine tool. A matrix with error components, that is, an error matrix, is separated from the error synthesis model of a five-axis machine tool. Based on the kinematics and inversion of the error matrix which can be obtained not by using a numerical method, an error compensation model is established and used to calculate compensation values of joint variables. The proposed compensation model does not need numerical methods to find the compensation values from the error compensation model, which includes nonlinear equations. An experiment using a double ball-bar is implemented to verify the proposed model.

• 로봇학회논문지
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• 제7권4호
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• pp.267-275
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• 2012

When using commercialized robot assisted laparoscopic, surgeon has met some problems to depend only on image of the surgical field. To solve it, there were various researches. The previous study showed that it is possible to estimate the operation force on the commercialized instrument inside patient without sensors. To apply the estimated force to a haptic master console for the laparoscopy surgical robot system, the light haptic master console should be designed. This paper suggests the design of lighter master console handle to reduce a weight of the console whose structure can match with the joint and DOF of an instrument. A cable-conduit mechanism is designed to make light structure to perform a delicate manipulation. The cable-conduit mechanism removes the weight and inertia of link caused by haptic actuator and encoder which is separated from handle link of a manipulator.

• International Journal of Aeronautical and Space Sciences
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• 제16권1호
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• pp.41-49
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• 2015

Analysis and test of hydrodynamic ram in welded metallic tanks containing water were performed to investigate the phenomena and to understand the effects on the resulting structural behavior. Arbitrary Lagrange-Euler coupling method was used for the analysis of the fluid-structure interaction occurring in the hydrodynamic ram, where the projectile, tank, and water are exchanging load, momentum, and energy during the traveling of the projectile through the water of the tank. For a better representation of the physical phenomena, modeling of the welded edges is added to the analysis to simulate the earlier weld line fracture and its influence on the resulting hydrodynamic ram behavior. Corresponding hydrodynamic tests were performed in a modified gas gun facility, and the following panel-based examinations of various parameters, such as displacement, velocity, stress, and energy, as well as hydrodynamic ram pressure show that the analysis and test are well correlated, and thus the results of the study reasonably explain the characteristics of the hydrodynamic ram. The methodology and procedures of the present study are applicable to the hydrodynamic ram assessment of airframe survivability design concepts.

• 정보학연구
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• 제3권3호
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• pp.39-55
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• 2000

인터넷 무역은 새로운 형태의 거래로서, 인터넷을 이용하여 제품과 서비스의 판매와 광고가 이루어지며 급속하게 확장되어 가고 있다. 이러한 상황속에서 우리나라는 세계무역시장의 중심적인 역할과 위치로 자리잡아야 할 것이며, 새로운 무역환경 변화에 우리는 직면하고 있는 것이다. 그래서, 첫째로 제도와 법률적인 면, 둘째, 인터넷 무역의 대금결제 부분, 셋째 인터넷 무역의 활성화에 대한 물리적인 부분인 소위 인프라 구축에 관해서 정부의 초고속 정보통신 네트워크 수립계획이 분명하게 있어야 할 것 이다. 끝으로 정부와 산업체간의 공동 협력과 참가는 급속하게 변화하는 새로운 무역 경항속에서 인터넷 무역은 세계무역시장에서 우리의 지위를 상당히 높힐 것으로 기대되어 진다.

• 품질경영학회지
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• 제42권1호
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• pp.111-127
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• 2014

Purpose: Simple part or equipment is necessary TRA(Technology Readiness Assessment) or MRA(Manufacturing Readiness Assessment). But sole maturity like TRA, MRA has limit complex systems or SoS(System of System). Especially complex weapon system need from the System Maturity Point of view. This research shows necessity of SRA(System Readiness Assessment). Methods: In case of complex systems, it is essential to SRA(System Readiness Assessment). For the purpose of calculating SRL(System Readiness Level), TRL and IRL must be calculated. And then SRL can obtain know from equation of TRL and IRL. To prove SRA effectiveness, it is calculated SRL of JTDLS(Joint Tactical DataLink System) programs. Results: SRA procedure is proposed and case study shows as examples of JTDLS programs. Although result of TRA is TRL6, result of SRA is not 0.6. From this research, we can know necessity of SRA. Especially complex systems or SoS(System of System) is essential to SRA. Conclusion: SRA(System Readiness Assessment) is required to overcome limitation of sole maturity and to achieve a successful acquisition of high quality weapon system. This research intended to suggest SRA procedure and case study in complex defense system.

• Journal of Welding and Joining
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• 제29권6호
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• pp.49-55
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• 2011

With the development of pre-painted steel sheets for automotive body application, a new joining method is required such as hybrid joining with combination of adhesive bonding and mechanical joining. The objective of this study is to investigate the effect of pre- and post-baking of adhesive bonding on failure mode and strength of hybrid joining of automotive steel sheets. Experiments show that the hybrid joining exhibits better bonding strength and displacement than conventional adhesive joining and mechanical fastening each. Comparison of pre- and post-baked hybrid joining results suggested that baking at $160^{\circ}C$ after mechanical joining was found to have higher joining properties than pre-baking condition. The prebaking condition changed its fracture mode from interfacial to button fracture. The changes in fracture mode with post-baking of hybrid joining was attributed to variation in neck thickness and undercut of joint.

• 한국기계기술학회지
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• 제13권3호
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• pp.7-16
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• 2011

This study proposes the compensation method for the mechanical deflection error of a SCARA robot. While most studies on the related subject have dealt with the development of a control algorithm for improvement of robot accuracy, this study presents the control method reflecting the mechanical deflection error which is predicted in advance. The deflection at the end of the gripper of SCARA robot is caused by the self-weights and payloads of Arm 1, Arm 2 and quill. If the deflection is constant even though robot's posture and payload vary, there may not be a big problem on robot accuracy because repetitive accuracy, that is relative accuracy, is more important than absolute accuracy in robot. The deflection in the end of the gripper varies as robot's posture and payload change. That's why the moments $M_x$, $M_y$ and $M_z$ working on every joint of a robot vary with robot's posture and payload size. This study suggests the compensation method which predicts the deflection in advance with the variations in robot's posture and payload using neural network. To do this, I chose the posture of robot and the payloads at random, found the deflections by the FEM analysis, and then on the basis of this data, made compensation possible by predicting deflections in advance successively with the variations in robot's posture and payload through neural network learning.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.219-225
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• 2002

This paper presents a novel "bumpless flip chip package"for cost! performance driven devices. Using the conventional electroplating and etching processes, this package enables the production of fine pitch BGA up to 256 I/O with single layer routing. An array of circuitry down to $25-50{\mu}{\textrm}{m}$ line/space is fabricated to fan-in and fan-out of the bond pads without using bumps or substrate. Various types of joint methods can be applied to connect the fine trace and the bond pad directly. The resin-filled terminal provides excellent compliancy between package and the assembled board. More interestingly, the thin film routing is similar to wafer level packaging whereas the fan-out feature enables high lead count devices to be accommodated in the BGA format. Details of the design concepts and processing technology for this novel package are discussed. Trade offs to meet various cost or performance goals for selected applications are suggested. Finally, the importance of design integration early in the technology development cycle with die-level and system-level design teams is highlighted as critical to an optimal design for performance and cost.