• 제목/요약/키워드: joint technology development

검색결과 534건 처리시간 0.036초

성조 분석과 음조 기술에서 청각음성학의 일차성;반자동 음조 청취 등급 분석기 개발과 관련하여 (On the primacy of auditory phonetics In tonological analysis and pitch description;In connection with the development of a new pitch scale)

  • 김차균
    • 대한음성학회:학술대회논문집
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    • 대한음성학회 2007년도 한국음성과학회 공동학술대회 발표논문집
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    • pp.3-23
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    • 2007
  • King Sejong the Great, his students in Jip-hyeun-jeon school and Choe Sejin, their successor of the sixteenth century, indicated Middle Korean had three distinctive pitches, low, high, and rising (phyeong-, geo-, sang-sheong). Thanks to $Hun-min-jeng-{\emptyset}eum$ as well as its Annotation and side-dots literatures in fifteenth and sixteenth centuries, we can compare Middle Korean with Hamgyeong dialect, Gyeongsang dialect, and extant tone dialects with joint preservers of what was probably the tonal system of unitary mother Korean language. What is most remarkable about middle Korean phonetic work is its manifest superiority in conception and execution as anything produced in the present day linguistic scholarship. But at this stage in linguistics, prior to the technology and equipment needed for the scientific analysis of sound waves, auditory description was the only possible frame for an accurate and systematic classification. And auditory phonetics still remains fundamental in pitch description, even though modern acoustic categories may supplement and supersede auditory ones in tonological analysis. Auditory phonetics, however, has serious shortcoming that its theory and practice are too subject to be developed into the present century science. With joint researchers, I am developping a new pitch scale. It is a semiautomatic auditory grade pitch analysis program. The result of our labor will give a significant breakthrough to upgrade our component in linguistics.

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초음파 모터를 이용한 다지 로봇 손 및 제어시스템 개발 (Development of a New Multi-Fingered Robot Hand Using Ultrasonic Motors and Its Control System)

  • 김병호;오상록;유범재;서일홍;최혁렬
    • 제어로봇시스템학회논문지
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    • 제6권4호
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    • pp.327-332
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    • 2000
  • In this paper, a new multi-fingered robot hand using ultrasonic motors and its control system are developed. The developed robot hand has four fingers and fifteen articulated joints. The distal joint of each finger is directly driven by ultrasonic motor and all joints except the distal joint has low transmission gear mechanism with the motor. The developed robot hand has several advantages in size compared to a hand using conventional DC motors, and in performance compared to a hand using tendons to drive joints. A VME-bus based hand control system and ultrasonic motor driver are also developed. The performance of the hand is confirmed by using the developed control system in real-time.

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이차전지용 니켈 다층 박판의 레이저 용접 보호가스의 영향 (Effects of Different Shielding Gases in Laser Welding of Secondary Ni battery with Multi-thin Plates)

  • 유영태;이가람;김진우
    • 한국생산제조학회지
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    • 제25권5호
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    • pp.329-337
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    • 2016
  • The demand for the eco-friendly vehicles is skyrocketing because of the increasing $CO_2$ emissions and global warming. In the industrial field, the battery process, a core part of an eco-friendly vehicle, is drawing increased attention; its weight lightening as well as high energy density are becoming increasingly important. In this study, pure Ni plates that were used as the battery pole plate were welded using the laser. The lab joint welding was conducted on ten pure Ni plates at a laser power of 1900 W and a feed speed of 2.8-3.4 m/min. As observed in the experiment, a faster feed speed reduced the bead width, but the laser did not penetrate all ten specimen plates. In addition, pores were trapped when protective gas was used, but they were not trapped when the welding was conducted in atmospheric condition.

전자기 펄스 용접시 누수압력을 예측하기 위한 실험모델의 개발 (A Development of Experimental Model Prediction of Leakage Pressure in MPW)

  • 심지연;김일수;김인주;강봉용
    • 한국생산제조학회지
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    • 제18권6호
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    • pp.652-657
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    • 2009
  • MPW(Magnetic Pulse Welding) is a technologies for welding of metals by means of repulsive force on account of the interaction between electro-magnetic field of coil and current induced in outer pipe. These MPW is one of the most useful welding process of welding ability of the dissimilar metal in which cylindrical materials, such as pipe, tube. As the quality of a weld joint is strongly influenced by process parameters during the welding process and the success of the welding to evaluated according to the leakage pressure. Generally, the process parameters is magnetic pressure, the gap between outer pipe and inner pipe, and the ratio of thickness to diameter of pipe(D/T) in MPW. Therefore, the goal of this study was to explain the effect of parameters on the weld joint leakage pressure. For these purposes, FFD(Fractional Factorial Design) were used for the experiment. The measured data were analyzed by regression analysis and verification experiments with random condition were conducted to confirm the suggested experimental model.

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JHPS-KARP-ARPS Joint Program for Commemoration of 2021 Bo Lindell Medal to Discuss the Future of Radiation Protection among Young Scientists and the Award Recipient, Dr. Ogino

  • Fujibuchi, Toshioh;Ogino, Haruyuki;Taek, Han Ki;Tani, Kotaro;Emes, Daniel
    • Journal of Radiation Protection and Research
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    • 제46권2호
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    • pp.80-82
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    • 2021
  • Dr. Haruyuki Ogino, a member of the Japan Health Physics Society (JHPS), was awarded the 2021 Bo Lindell Medal by the International Commission on Radiological Protection (ICRP). To commemorate this, the "Joint JHPS-KARP-ARPS program for young radiation protection (RP) scientists to discuss the future of RP" was organized via a web meeting system. First, Dr. Ogino gave a lecture, and then young researchers selected from each academic society made presentations on the future of RP. After the presentations by the three researchers, a free talk was held-young researcher groups of each country being active is a great opportunity to collaborate and exchange information. It was emphasized that the low awareness of knowledge related to radiation has been common to all of the participating countries. Thus, it is necessary to utilize communication via web technology, as done for this program, effectively. One of the biggest advantages for Asia and Oceania is that we do not have a significant time difference. The round-table discussion was concluded by expressing the hope of active exchange and development of young researchers in the future.

A Study on the Factors Influencing the Satisfaction of Online Service System on the International Research Cooperation

  • Noh, Younghee;Chang, Rosa
    • International Journal of Knowledge Content Development & Technology
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    • 제10권2호
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    • pp.71-90
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    • 2020
  • Recently, as the pandemic COVID-19 has been spread worldwide, international research cooperation has come to the fore to overcome the crisis and develop treatments. Currently, in Korea, with the support from the Ministry of Education and the Korea Research Foundation, the International Research Cooperation Information Center operates an online service system for international research cooperation as a venue for sharing results among international research cooperation researchers and invigorating such research. However, since Korea's performance in international research cooperation is still poor, actively pursuing measures to improve professionalism and diversity based on international cooperation is deemed necessary. Therefore, in this study, factors influencing the level of satisfaction with international research cooperation online service systems were identified, and measures to increase the satisfaction of international research cooperation online service were proposed based on the analysis results. Design of the system quality factors, accuracy and consistency of the information quality factors, and professionalism of the service quality factors were verified to have a significant effect on the satisfaction with international research cooperation online service systems. Accordingly, further strengthening the aspects of design, accuracy, consistency, and professionalism was proposed as a way to increase the satisfaction of international research cooperation online service systems.

Development of New COG Technique Using Eutectic Bi-Sn and In-Ag Solder Bumps for Flat Panel Display

  • Kang, Un-Byoung;Kim, Young-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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    • pp.270-274
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    • 2002
  • We have developed a new COG technique using flip chip solder joining technology for excellent resolution and high quality LCD panels. Using the eutectic Bi-Sn and the eutectic In-Ag solder bumps of 50-80 ${\mu}m$ pitch sizes, a ultrafine interconnection between IC and glass substrate was successfully made at or below $160^{\circ}C$. The contact resistance and reliability of Bi-Sn solder joint showed the superiority over the conventional ACF bonding.

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고Mn강의 이종 레이저용접 특성 (Characteristics of dissimilar laser welding of high Mn steel)

  • 정보영;한태교;이종봉
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2007년 추계학술발표대회 개요집
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    • pp.190-192
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    • 2007
  • High Mn steel has been developed for automotive applications since the steel has an excellent combination of strength and ductility. However, from the viewpoint of welding, high Mn steel has a few problems related to its chemical composition. In this study, development of dissimilar laser welding technology has been investigated for expanding application of high Mn steel. The results have shown that dissimilar weld joint between high Mn steel and carbon steel has poor erichsen property using STS309L filler wire or not.

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미세 부품의 초음파 접합공정 개발 (Development of Ultrasonic Bonding Process for Micro Components)

  • 김정호;이지혜;유중돈;최두선
    • 소성∙가공
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    • 제11권7호
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    • pp.596-600
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    • 2002
  • The ultrasonic bonding method and its feasibility are investigated in this work for joining the micro components and MEMS packaging. The ultrasonic bonding process is analyzed using a lumped mode, and preliminary experiments using the eutectic solder and copper pin were carried out to verify possibility to MEMS packaging. The ultrasonic bonding process appears to be adequate for MEMS packaging by providing localized heating at the selected area. Microscopic behavior of the bond joint through ultrasonic vibration needs further investigation.