• Title/Summary/Keyword: ion beam lithography

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그래핀 표면처리를 통한 high-k dielectrics 증착

  • Kim, Gi-Seok;Kim, Gyeong-Nam;Yeom, Geun-Yeong
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2014.11a
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    • pp.11-11
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    • 2014
  • CVD 로 성장된 그래핀 표면위에 transfer 와 lithography 공정에서 잔류하게 되는 PMMA residue 는 mobility 의 감소와 high-k dielectrics 의 증착을 방해하는 결정적인 요인이다. 우리는 최적화 되어진 Ar ion beam 을 통해 PMMA residue 를 damage 없이 효과적으로 제거하였고, 손쉽게 high-k dielectrics 를 uniform 하게 증착할 수 있었다.

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A Study on the Fabrication of Periodic Holes on Metal Electrode for Electrodeionization System Application (전기탈이온시스템 응용을 위한 주기적 홀을 갖는 금속 전극 제작에 관한 연구)

  • Yeo, Jong-Bin;Sun, Sang-Wook;Lee, Hyun-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.3
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    • pp.227-231
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    • 2013
  • Electrodeionization is a hybrid separation process of electrodialysis and ion exchange to produce high purity water under electric field. This article provides a fabrication result of hole patterned metal electrode for elecrodeionization system. The hole patterns have been fabricated by nanosphere lithography (NSL). The technique utilizes the self-assembled nanospheres as lens-mask patterns and collimated laser beam source. The hole patterns have a periodic array structure. The images of hole pattern on metal electrode prepared were observed by SEM. We believe that the periodic hole patterned metal electrode structure is a useful device applicable for metal mat electrode in electrodeionization system.

Direct Synthesis of Width-tailored Graphene Nanoribbon on Insulating Substrate

  • Song, U-Seok;Kim, Su-Yeon;Kim, Yu-Seok;Kim, Seong-Hwan;Lee, Su-Il;Jeon, Cheol-Ho;Park, Jong-Yun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.564-564
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    • 2012
  • Graphene has been emerged as a fascinating material for future nanoelectronic applications due to its extraordinally electronic properties. However, their zero-bandgap semimetallic nature is a major problem for applications in high performance field-effect transistors (FETs). Graphene nanoribbons (GNRs) with narrow widths (${\geq}10nm$) exhibit semiconducting behavior, which can be used to overcome this problem. In previous reports, GNRs were produced by several approaches, such as electron beam lithography patterning, chemically derived GNRs, longitudinal unzipping of carbon nanotubes, and inorganic nanowire template. Using these methods, however, the width distribution of GNRs was a quiet broad and substantial defects were inevitably occurred. Here, we report a novel approach for fabricating width-tailored GNRs by focused ion beam-assisted chemical vapor deposition (FIB-CVD). Width-tailored phenanthrene ($C_{14}H_{10}$) templates for direct growth of GNRs were prepared on $SiO_2$/Si substrate by FIB-CVD. The GNRs on the templates were synthesized at $900-1,050^{\circ}C$ with introducing $CH_4$ $(20sccm)/H_2$ (10 sccm) mixture gas for 10-300 min. Structural characterizations of the GNRs were carried out using Raman spectroscopy, scanning electron microscopy, and atomic force microscopy.

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Silicon microstructure prepared by a dry etching (Dry Etching에 의해 제작된 실리콘 미세 구조물)

  • 홍석민;임창덕;조정희;안일신;김옥경
    • Journal of the Korean Vacuum Society
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    • v.6 no.3
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    • pp.242-248
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    • 1997
  • Porous silicons were prepared by dry etching as well as by chemical etching. The latter is a conventional method used by many researchers. Meanwhile, the former is a new method we developed. Also the porous silicon structure was made by E-beam lithography technique. However, due to the limit of this technique, minimum size we could produce was about 0.3 $\mu\textrm{m}$ in diameter on silicon wafer. In a new method, the porous silicon microstructure was fabricated by using Reactive Ion Etching method after covering with diamond powder on 4 inch wafer by using spin coater. In this method, diamond powder acted as a mask. The morphology of samples prepared under many different conditions were analysed be SEM and AFM. And we measured PL spectra for the samples. Based on these results, we observed the structure of a few hundreds $\AA$ in size from porous silicon which was made by dry etching with diamond powder. Also the PL peak for these samples lied around 590 nm compared to 760 nm for chemically etched porous silicon.

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Fabrication of UV imprint stamp using diamond-like carbon coating technology (Diamond-like carbon 코팅기술을 사용한 UV-임프린트 스탬프 제작)

  • JEONG JUN-HO;KIM KI-DON;SIM YOUNG-SUK;CHOI DAE-GEUN;CHOI JUNHYUK;LEE EUNG-SUG;LIM TAE-WOO;PARK SANG-HU;YANG DONG-YOL;CHA NAM-GOO;PARK JIN-GOO
    • Proceedings of the Korean Society for Technology of Plasticity Conference
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    • 2005.10a
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    • pp.167-170
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    • 2005
  • The two-dimensional (2D) and three-dimensional (3D) diamond-like carbon (DLC) stamps for ultraviolet nanoimprint lithography (UV-NIL) were fabricated using two kinds of methods, which were a DLC coating process followed by the focused ion beam (FIB) lithography and the two-photon polymerization (TPP) patterning followed by nano-scale thick DLC coating. We fabricated 70 nm deep lines with a width of 100 nm and 70 nm deep lines with a width of 150 nm on 100 nm thick DLC layers coated on quartz substrates using the FIB lithography. 200 nm wide lines, 3D rings with a diameter of $1.35\;{\mu}m$ and a height of $1.97\;{\mu}m$, and a 3D cone with a bottom diameter of $2.88\;{\mu}m$ and a height of $1.97\;{\mu}m$ were successfully fabricated using the TPP patterning and DLC coating process. The wafers were successfully printed on an UV-NIL using the DLC stamp. We could see the excellent correlation between the dimensions of features of stamp and the corresponding imprinted features.

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Aluminum Oxide Photonic Crystals Fabricated on Compound Semiconductor (화합물 반도체 기판 위에 제작된 산화 알루미늄 광결정 특성)

  • Choi, Jae-Ho;Kim, Keun-Joo;Jung, Mi;Woo, Duk-Ha
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.77-78
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    • 2006
  • We fabricated photonic crystals on GaAs and GaN substrates. After anodizing the aluminium thin film in electrochemical embient, the porous alumina was implemented to the mask for reactive ion beam etching process of GaAs wafer. And photonic crystals in GaN wafer were also fabricated using electron beam nano-lithography process. The coated PMMA thin film with 200 nm-thickness on GaN surface was patterned with triangular lattice and etched out the GaN surface by the inductively coupled plasma source. The fabricated GaAs and GaN photonic crystals provide the enhanced intensities of light emission for the wavelengths of 858 and 450 nm, respectively. We will present the detailed dimensions of photonic crystals from SEM and AFM measurements.

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Fabrication of Plasmon Subwavelength Nanostructures for Nanoimprinting

  • Cho, Eun-Byurl;Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.247-247
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    • 2012
  • Plasmon subwavelength nanostructures enable the structurally modulated color due to the resonance conditions for the specific wavelength range of light with the nanoscale hole arrays on a metal layer. While the unique properties offered from a single layer of metal may open up the potential applications of integrated devices to displays and sensors, fabrication requirements in nanoscale, typically on the order of or smaller than the wavelength of light in a corresponding medium can limit the cost-effective implementation of the plasmonic nanostructures. Simpler nanoscale replication technologies based on the soft lithography or roll-to-roll nanoimprinting can introduce economically feasible manufacturing process for these devices. Such replication requires an optimal design of a master template to produce a stamp that can be applied for a roll-to-roll nanoimprinting. In this paper, a master mold with subwavelength nanostructures is fabricated and optimized using focused ion beam for the applications to nanoimprinting process. Au thin film layer is deposited by sputtering on a glass that serves as a dielectric substrate. Focused ion beam milling (FIB, JEOL JIB-4601F) is used to fabricate surface plasmon subwavelength nanostructures made of periodic hole arrays. The light spectrum of the fabricated nanostructures is characterized by using UV-Vis-NIR spectrophotometer (Agilent, Cary 5000) and the surface morphology is measured by using atomic force microscope (AFM, Park System XE-100) and scanning electron microscope (SEM, JEOL JSM-7100F). Relationship between the parameters of the hole arrays and the corresponding spectral characteristics and their potential applications are also discussed.

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Improved Contact Characteristics in a Single Tin-Oxide Nanowire Device by a Selective Reactive Ion Etching (RIE) Process (선택 건식에칭에 의한 단일 산화주석 나노와이어 소자의 접촉 특성 개선)

  • Lee, Jun-Min;Kim, Dae-Il;Ha, Jeong-Sook;Kim, Gyu-Tae
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.59 no.1
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    • pp.130-133
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    • 2010
  • Although many structures based on $SnO_2$ nanowires have been demonstrated, there is a limitation towards practical application due to the unwanted contact potential between the metal electrode and the $SnO_2$ nanowire. This is mostly due to the presence of the native oxide layer that acts as an insulator between the metal contact and the nanowire. In this study the contact properties between Ti/Au contacts and a single $SnO_2$ nanowire was compared to the electrical properties of a contact without the oxide layer. RIE(Reactive Ion Etching) is used to selectively remove the oxide layer from the contact area. The $SnO_2$ nanowires were synthesized by chemical vapor deposition (CVD) and dispersed on a $Si/Si_3N_4$ substrate. The Ti/Au (20nm/100nm) electrodes were formed bye-beam lithography, e-beam evaporation and a lift-off process.

Fabrication of Optically Active Nanostructures for Nanoimprinting

  • Jang, Suk-Jin;Cho, Eun-Byurl;Park, Ji-Yun;Yeo, Jong-Souk
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.08a
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    • pp.393-393
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    • 2012
  • Optically active nanostructures such as subwavelength moth-eye antireflective structures or surface enhanced Raman spectroscopy (SERS) active structures have been demonstrated to provide the effective suppression of unwanted reflections as in subwavelength structure (SWS) or effective enhancement of selective signals as in SERS. While various nanopatterning techniques such as photolithography, electron-beam lithography, wafer level nanoimprinting lithography, and interference lithography can be employed to fabricate these nanostructures, roll-to-roll (R2R) nanoimprinting is gaining interests due to its low cost, continuous, and scalable process. R2R nanoimprinting requires a master to produce a stamp that can be wrapped around a quartz roller for repeated nanoimprinting process. Among many possibilities, two different types of mask can be employed to fabricate optically active nanostructures. One is self-assembled Au nanoparticles on Si substrate by depositing Au film with sputtering followed by annealing process. The other is monolayer silica particles dissolved in ethanol spread on the wafer by spin-coating method. The process is optimized by considering the density of Au and silica nano particles, depth and shape of the patterns. The depth of the pattern can be controlled with dry etch process using reactive ion etching (RIE) with the mixture of SF6 and CHF3. The resultant nanostructures are characterized for their reflectance using UV-Vis-NIR spectrophotometer (Agilent technology, Cary 5000) and for surface morphology using scanning electron microscope (SEM, JEOL JSM-7100F). Once optimized, these optically active nanostructures can be used to replicate with roll-to-roll process or soft lithography for various applications including displays, solar cells, and biosensors.

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