• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.25.2-25.2
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• 2006

• Proceedings of the Materials Research Society of Korea Conference
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• 2006.05a
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• pp.26.2-26.2
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• 2006

• Journal of Welding and Joining
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• v.34 no.3
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• pp.17-22
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• 2016

In terms of mechanical and metallurgical characteristics, the effect of tool plunge depths(0.2, 0.5, 0.7, 1.0, 1.5mm) on weldability in dissimilar Al5083-O/DP590 friction spot joint has been clarified. From the results, it is found that the stirred nugget was stably formed at a plunge depth of more than 0.7mm, which is caused by improved stirring action against each other material. With increasing a plunge depth, the thickness of intermetallic compound(IMC) layer in Al5083-O/DP590 joint has a tendency to increase. The tensile shear strength reaches to the maximum failure load of 6.5kN at a plunge depth of 0.7mm due to relatively small decrease in the thickness of Al5083-O sheet and relatively minute thickness of IMC layer, compared with those of other plunge depth conditions.

• Journal of the Korean Society for Heat Treatment
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• v.22 no.1
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• pp.8-15
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• 2009

Structural studies have been performed on precipitation hardening found in $Ni_{3}Al$ based ordered alloys using transmission electron microscopy (TEM). Tilt experiments by the weak-beam method were made to obtain some information concerning the cross slip mechanism of the superlattice dislocation. The strength of ${\gamma}'-Ni_3$(Al,Ti) increases over the temperature range of experiment by the precipitation of fine $\gamma$ particles. The peak temperature where a maximum strength was obtained shifted to higher temperature. Over the whole temperature range, the interaction between dislocation and $\gamma$ precipitates is attractive. On the temperature range of 773 K to 973 K, the dislocations in ${\gamma}'$ matrix move on (111) primary slip plane. When the applied stress is removed, the dislocations make cross slip into (010) plane, while those in $\gamma$ precipitates remain on the (111) primary slip plane. The increase of high temperature strength in ${\gamma}'-Ni_3$(Al,Ti) containing $\gamma$ precipitates is due to the restraint of cross slip of dislocations from (111) to (010) by the dispersion of disordered $\gamma$ particles.

• Journal of Surface Science and Engineering
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• v.31 no.6
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• pp.359-370
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• 1998

TiAl-based intermetallic compounds were electro-bornizel in the mixture of $Na_2B_4O_7$, KCL and LiCl in the termetature rage between 850 and $1000^{\circ}C$for various times (1-5 hours)under the fixed current density of 0.5 A/$cm^2$. The optimized composition of electrolyte in this work was decided to be 76.9 wt% $Na_2B_4O_7$-19.2 wt.%(0.7KCl-0.3LiCl) -3.9 wt.% al. The samples with boronized layer were investigated by SEM, XRD and EDS. The surface micro-hardness of boronized TiAl was also evaluated using Micro Vickers Hardness Tester. The sample, boronized at $900^{\circ}C$ for 4 hours in the above composition of electrolyte under the current density of 0.5 A/$\textrm{cm}^2$, has about 36$\mu\textrm{m}$ think layer on the surface, and its surface micro-hardness was measured to be 1263 Hv. From the results of SEM, XRD and EDS, the layer consisted of $TiB_2$ sublayer and Al-oxide sub layer. Al-depleted layer below the Al-oxide sudlayer was also detected. The activation energy for formation of boronized layer in this study was calculated as 178 Kcal/moleK.

• Journal of Welding and Joining
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• v.21 no.7
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• pp.59-64
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• 2003

Microstructure and shear strength of Sn-Zn lead-free solders and Au/Ni/Cu UBM joint under thermal aging conditions was investigated. The samples were aged isothermally at 10$0^{\circ}C$ and 15$0^{\circ}C$ for 300, 600, and 900 hours. The IMCs(Intermetallic Compound) at the interface between solder and UBM were examined by FESEM and TEM. The results showed that the shear strength was decreased with aging time and temperature. The solder ball with high activated RA flux had about 8.2% higher shear strength than that of RMA flux. Poor wetting and many voids were observed in the fractured solder joint with of RMA flux. The decreased shear strengths were caused by IMC growth and Zn grain coarsening. Zn reacted with Au and then was transformed to the $\beta$ -AuZn compound. Although AuZn grew first, $r-Ni_5Zn_{21}$ compounds were formed with aging time. The layers indicated by $Ni_5Zn_{21}(1)$, (2), and (3) were formed with the thickness of ∼0.7 ${\mu}{\textrm}{m}$, ∼4 ${\mu}{\textrm}{m}$, and ∼2 ${\mu}{\textrm}{m}$, respectively.

• Journal of Korea Foundry Society
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• v.30 no.3
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• pp.100-110
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• 2010

The solidification sequence and formation of intermetallic phase of Fe-rich Al-Si-Cu alloy were investigated by using real-time imaging of synchrotron X-ray radiation. Effects of cooling rate during uni-directional solidification on the resultant solidification behavior was also studied in a specially constructed vacuum chamber in the SPring-8 facility. The series of radiographic images were complementarily analyzed with conventional analysis of OM and SEM/EDX for phase identification. Detailed solidification sequence and formation mechanisms of various phases were discussed based on real-time image analysis. The growth rates of $\alpha$-AlFeMnSi and ${\beta}-Al_5FeSi$ were measured in order to understand the growth behavior of each phase. It is suggested that real-time imaging technique can be a powerful tool for the precise understanding of solidification behavior of various industrial materials.

• Corrosion Science and Technology
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• v.6 no.6
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• pp.311-315
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• 2007

The anodic polarization behavior of equiatomic TiNi shape memory alloy with pure titanium as a reference material was investigated by means of open circuit potential measurement and potentiodynamic polarization technique. And the structure of passive films on TiNi intermetallic compounds was also conducted using AES and ESCA. While the dissolved Ni(II) ion did not affect the dissolution rate and passivation of TiNi alloy, the dissolved Ti(III) ion was oxidated to Ti(IV) ion on passivated TiNi surface at passivation potential. It has also been found that the Ti(IV) ion increases the steady state potential, and passivates TiNi alloy at a limited concentration of Ti(IV) ion. The analysis by AES showed that passive film of TiNi alloy was composed of titanium oxide and nickel oxide, and the content of titanium was three times higher than that of nickel in outer side of passive film. According to the ESCA analysis, the passive film was composed of $TiO_2$ and NiO. It seems reasonable to suppose that NiO could act as unstabilizer to the oxide film and could be dissolved preferentially. Therefore, nickel oxide contained in the passive film may promote the dissolution of the film, and it could be explained the reason of higher pitting susceptibility of TiNi alloy than pure Ti.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.11-20
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• 2010

The effects of heat treatment on matte pure tin-plated Cu leadframes at high temperature and humidity conditions were investigated. After 1800 hrs of storage at $55^{\circ}C/85%$ RH, approximately 14.5 ${\mu}m$ long striation-shaped whiskers were observed on the surface of the without postbake treatment (WOPB) samples, while no whiskers were found in with postbake treatment (WPB) samples. The preferred orientations of Sn grains in WOPB and WPB sample did not change after the postbake treatment at $125^{\circ}C$ for 1 hr. However, both changed from (112) to (321) and (101), respectively, after 1800 hrs of storage at $55^{\circ}C/85%$ RH. The tensile stress of 8 MPa generated in as-plated sample was changed to a compression stress of 17 MPa after 2 days in room temperature storage. Due to the grain growth during postbake treatment, the WPB samples have more regular grains than the WOPB samples. In the as-plated sample, 0.32 ${\mu}m$ thickness of planar intermetallic compound (IMC) was observed. The IMCs in the WOPB and WPB samples had two distinct layers with large grains of $Cu_6Sn_5$ and with small grains of ${\eta}-Cu_{6.26}Sn_5$.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.162-169
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• 2004

High temperature uniaxial compression tests in the alpha single phase region were carried out on the Ti -43mo1%Al intermetallic compound, in order to obtain oriented lamellar microstructure. The compression deformation temperatures and strain rates are from 1573k to 1623k and 1.0x10$^{-4}$ s to 5.0x10$^{-3}$ s, respectively. Fully lamellar microstructure was observed after the uniaxial compression deformation in a single phase region followed by cooling to room temperature. Lamellar colony diameter depended on strain rates and test temperatures. The diameter varied between 8601m and 300fm. Stress-strain curve showed a work softening and the size of lamellar colony diameter varied depending on peak stresses. This shows the occurrence of dynamic recrystallization. Texture measurements after the uniaxial compression deformation, showed the development of fiber during dynamic recrystallization. It is seen that the area for the maximum pole density existed in 35 degrees away from the compression plane. The texture sharpens with a decrease in strain rate