• Title/Summary/Keyword: intermetallic

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Effects of Melt Super-heating on the Shape Modification of ${\beta}-AlFeSi$ Intermetallic compound in AC2B Aluminum Alloy (AC2B 알루미늄합금의 고온용해에 의한 금속간화합물 ${\beta}-AlFeSi$상 형상계량 효과)

  • Kim, Heon-Joo
    • Journal of Korea Foundry Society
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    • v.21 no.3
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    • pp.179-186
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    • 2001
  • Melt super-heating which promotes shape modification of ${\beta}$ intermetallic compounds was conducted to improve mechanical properties of recycled AC2B aluminum alloy. Modification of needle-shape ${\beta}$ intermetallic compounds was effective for the specimens of AC2B aluminum alloys containing 0.85wt.% Fe by melt super-heating, in which the melts had been held at $850^{\circ}C$ or $950^{\circ}C$ for 30 minutes respectively. Owing to the modification of needle-shape of ${\beta}$ intermetallic compounds by melt superheating of the alloy with containing 0.85wt.% Fe to $950^{\circ}C$, increases in elongation and tensile strength were prominent to be more than double and 55% respectively in comparison with the melt heated to $740^{\circ}C$. Moreover, modification of needle-shape ${\beta}$ intermetallic compounds in the alloy containing O.85wt.% Fe by $950^{\circ}C$ melt super-heating led to 48% improvement of the value of impact absorbed energy as compared with the melt heated to $740^{\circ}C$.

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WETTING PROPERTIES AND INTERFACIAL REACTIONS OF INDIUM SOLDER

  • Kim, Dae-Gon;Lee, Chang-Youl;Hong, Tae-Whan;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.475-480
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    • 2002
  • The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

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Mechanical Properties of Intermetallic/Metal Laminated Composite by SHS Reaction (자전고온반응에 의한 금속간화합물/금속 적층복합재료의 기계적 특성)

  • ;;Manabu Enoki
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2002.10a
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    • pp.60-63
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    • 2002
  • Metal/intermetallic laminated composites have been manufactured by SHS reactions between Ni and Al elemental metal foils. Microstructure showed that the intermetallic volume fraction was 55%, 45%, 35% in the 1:1, 2:1, 4:1 thickness ratio(Ni:Al) specimen and the main phases of the intermetallic were transformed from $Ni_2Al_3$ to NiAl when the thickness ratio was increased. Tensile strength and elongation were increased when the volume fraction of Ni metallic phase was increased. Under assumptions of isostrain condition, the tensile strength of metal/intermetallic laminated composites didn't obey the ROM due to the thermal residual stress and this was confirmed by X-ray residual stress analysis. Fracture toughness results by the SENB test showed R-curves with upward curvature based on LSB condition. Bridging stress based on LSB condition was determined by the curve fitting analysis, In-situ observed microstructure during fracture test showed that the various bridging mechanism such as crack bridging, crack branching and ductile failure of metallic layer were occurred

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Weldability of SUS304 and Ti Dissimilar Welds with Various Welding Speed using Single Mode Fiber Laser (싱글모드 파이버 레이저를 이용한 SUS304와 Ti 이종재료의 용접속도에 따른 용접특성)

  • Lee, Su-Jin;Katayama, Seiji;Kim, Jong-Do
    • Journal of Welding and Joining
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    • v.31 no.5
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    • pp.64-70
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    • 2013
  • The joining of Ti and SUS304 dissimilar metals is one of the effective measures to save rare metal. But Ti and SUS304 have differences in materials properties, and Ti and Fe intermetallic compounds such as TiFe and $TiFe_2$ are easily formed in weld fusion zone between Ti and SUS304. Nevertheless, in this study, full penetration lap dissimilar welding of Ti and SUS304 using single-mode fiber laser with ultra-high welding speed was tried, and it was found out that ultra-high welding speed could control the generation of intermetallic compound. To recognize the formation of intermetallic phase in the weld fusion zone and the compound zone of interface weld area were observed and analyzed using energy dispersive X-ray spectroscopy (EDX). And it was confirmed that the ultra-high welding speed could reduce amount of intermetallic compounds, but the intermetallic compounds were existed in the weld fusion zone under the all conditions.

Microstructural Characterization of $Al_3$(${Nb_{1-x}}{Zn_x}$) Alloy Prepared by Elemental Powder and Intermetallic Powder (원료분말과 금속간화합물 분말로 기계적 합금화한 $Al_3$(${Nb_{1-x}}{Zn_x}$) 합금의 미세구조특성)

  • Lee, Gwang-Min;Lee, Ji-Seong;An, In-Seop
    • Korean Journal of Materials Research
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    • v.11 no.5
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    • pp.345-353
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    • 2001
  • The present study was carried out to investigate the effect of zirconium addition to $Al_3$Nb intermetallic on the crystal structural modification and microstructural characterization of $Al_3$Nb intermetallic. Elemental Al, Nb, Zr powders and arc melted $Al_3$Nb and $Al_3$Zr intermetallic mixed powders were used as starting materials. MA was carried out in an attritor rotated with 300 rpm for 20 hours. The behavior of MA between two starting materials was some-what different in which the value of internal strain of the elemental powders was higher than that of the intermetallic powder. The intermetallic powder was much more disintegrated during the MA processing. In the case of the elemental powders, AlNb$_2$ phase were transformed to Al(Nb.Zr)$_2$ as a result of ternary addition of Zr element. With the successive heat treatment at 873K for 2 hours, the Al(Nb.Zr)$_2$ phase was transformed to more stable $Al_3$(Nb.Zr) phase. This transformation was clearly confirmed by the identification of X-ray peak position shift. On the other hand, in the carte of the intermetallic powder, there was no evidence of phase transformation to other ternary intermetallic compounds or amorphous phases, even in the case of additional heat treatment. However, nano-sized intermetallic with $Al_3$Nb and $Al_3$Zr were just well distributed instead of phase transformation.

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Behavior of Graphite and Formation of Intermetallic Compound Layer in Hot Dip Aluminizing of Cast Iron (주철 - 알루미늄 합금의 Hot Dip Aluminizing시 흑연 및 금속간화합물 층의 형성 거동)

  • Han, Kwang-Sic;Kang, Yong-Joo;Kang, Mun-Seok;Kang, Sung-Min;Kim, Jin-Su;Son, Kwang-Suk;Kim, Dong-Gyu
    • Journal of Korea Foundry Society
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    • v.31 no.2
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    • pp.66-70
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    • 2011
  • Hot dip aluminizing (HDA) is widely used in industry for improving corrosion resistance of material. The formation of intermetallic compound layers during the contact between dissimilar materials at high temperature is common phenomenon. Generally, intermetallic compound layers of $Fe_2Al_5$ and $FeAl_3$ are formed at the Al alloy and Fe substrate interface. In case of cast iron, high contact angle of graphite existed in the matrix inhibits the formation of intermetallic compound layer, which carry with it the disadvantage of a reduced reaction area and mechanical properties. In present work, the process for the removal of graphite existed on the surface of specimen has been investigated. And also HDA was proceeded at $800^{\circ}C$ for 3 minutes in aluminum alloy melt. The efficiency of graphite removal was increased with the reduction of particle size in sanding process. Graphite appears to be present both in the region of melting followed by re-solidification and in the intermetallic compound layer, which could be attributed to the fact that the surface of cast iron is melted down by the formation of low melting point phase with the diffusion of Al and Si to the cast iron. Intermetallic compound layer consisted of $Fe(Al,Si)_3$ and $Fe_2Al_5Si$, the layer formed at cast iron side contained lower amount of Si.

Formation of Fe Aluminide Multilayered Sheet by Self-Propagating High-Temperature Synthesis and Diffusion Annealing (고온자전반응합성과 확산 열처리를 이용한 FeAl계 금속간화합물 복합판재의 제조)

  • Kim, Yeon-Wook;Yun, Young-Mok
    • Korean Journal of Materials Research
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    • v.18 no.3
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    • pp.153-158
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    • 2008
  • Fe-aluminides have the potential to replace many types of stainless steels that are currently used in structural applications. Once commercialized, it is expected that they will be twice as strong as stainless steels with higher corrosion resistance at high temperatures, while their average production cost will be approximately 10% of that of stainless steels. Self-propagating, high-temperature Synthesis (SHS) has been used to produce intermetallic and ceramic compounds from reactions between elemental constituents. The driving force for the SHS is the high thermodynamic stability during the formation of the intermetallic compound. Therefore, the advantages of the SHS method include a higher purity of the products, low energy requirements and the relative simplicity of the process. In this work, a Fe-aluminide intermetallic compound was formed from high-purity elemental Fe and Al foils via a SHS reaction in a hot press. The formation of iron aluminides at the interface between the Fe and Al foil was observed to be controlled by the temperature, pressure and heating rate. Particularly, the heating rate plays the most important role in the formation of the intermetallic compound during the SHS reaction. According to a DSC analysis, a SHS reaction appeared at two different temperatures below and above the metaling point of Al. It was also observed that the SHS reaction temperatures increased as the heating rate increased. A fully dense, well-bonded intermetallic composite sheet with a thickness of $700\;{\mu}m$ was formed by a heat treatment at $665^{\circ}C$ for 15 hours after a SHS reaction of alternatively layered 10 Fe and 9 Al foils. The phases and microstructures of the intermetallic composite sheets were confirmed by EPMA and XRD analyses.

A Study on the kinetics of Aluminizing of Cold rolled Steel Sheets (冷間壓廷鋼板의 Aluminizing에 對한 速度論的인 硏究)

  • Yoon, Byung-Ha;Kim, Young-Ki
    • Journal of the Korean institute of surface engineering
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    • v.12 no.2
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    • pp.75-83
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    • 1979
  • The Rates of formation and heats of activation for the intermatallic Compound Layers between Cold rolled sheet and molten aluminium &ath (adding small amounts of silicon) has been determined by Continous aluminizing method in the temperature range of 680$^{\circ}$ to 760$^{\circ}C$ and with immerssion time. The structure of the intermetallic Compound Layers was the shape of "Tongues" in pure Al-Bath and Al-Bath Containing 1% Si, But in Al-5% Si Bath was "Band" the Composition of the intermetallic Compound Layers were checked by microhardness measurements and X-Ray probe micro analyzer. FeAl intermetallic Compound layer was found to be uniform in pure Al-Bath and Al-5% Si Bath, But Fe Al intermetallic Compound Layer was shown in Al-1% Si Bath. The growth Rates of the intermetallic Compound Layers was most rapidly increased at Temperatures from 720$^{\circ}$ to 760$^{\circ}C$, at the immorsion time above 60 Second in pure Al-Bath, But in Al-1% Si Bath was solwly increased for the same conditions, and then in Al-5% Si Bath was hardly effected by these experimental condition. Heasts of activation of 29, 46 Kcal per mole which calculuted from Layer growth experiments were found in pure Al-Bath, Al-1% Si Bath respectively.

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INTERFACIAL REACTIONS BETWEEN SN-58MASS%BI EUTECTIC SOLDER AND (CU, ELECTROLESS NI-P/CU)SUBSTRATE

  • Yoon, Jeong-Won;Lee, hang-Bae;Park, Guang-Jin;Shin, Young-Eui;Jung, Seung-Boo
    • Proceedings of the KWS Conference
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    • 2002.10a
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    • pp.487-492
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    • 2002
  • The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.

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