• 한국주조공학회지
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• 제21권3호
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• pp.179-186
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• 2001

Melt super-heating which promotes shape modification of ${\beta}$ intermetallic compounds was conducted to improve mechanical properties of recycled AC2B aluminum alloy. Modification of needle-shape ${\beta}$ intermetallic compounds was effective for the specimens of AC2B aluminum alloys containing 0.85wt.% Fe by melt super-heating, in which the melts had been held at $850^{\circ}C$ or $950^{\circ}C$ for 30 minutes respectively. Owing to the modification of needle-shape of ${\beta}$ intermetallic compounds by melt superheating of the alloy with containing 0.85wt.% Fe to $950^{\circ}C$, increases in elongation and tensile strength were prominent to be more than double and 55% respectively in comparison with the melt heated to $740^{\circ}C$. Moreover, modification of needle-shape ${\beta}$ intermetallic compounds in the alloy containing O.85wt.% Fe by $950^{\circ}C$ melt super-heating led to 48% improvement of the value of impact absorbed energy as compared with the melt heated to $740^{\circ}C$.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.475-480
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• 2002

The reliability of the solder joint is affected by type and extent of the interfacial reaction between solder and substrates. Therefore, understanding of intermetallic compounds produced by soldering in electronic packaging is essential. In-based alloys have been favored bonding devices that demand low soldering temperatures. For photonic and fiber optics packaging, m-based solders have become increasingly attractive as a soldering material candidate due to its ductility. In the present work, the interfacial reactions between indium solder and bare Cu Substrate are investigated. For the identification of intermetallic compounds, both Scanning Electron Microscopy(SEM) and X-Ray Diffraction(XRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu$_{11}$In$_{9}$ was observed for bare Cu substrate. Additionally, the growth rate of these intermetallic compounds was increased with the reaction temperature and time. We found that the growth of the intermetallic compound follows the parabolic law, which indicates that the growth is diffusion-controlled.d.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 추계학술발표대회 논문집
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• pp.60-63
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• 2002

Metal/intermetallic laminated composites have been manufactured by SHS reactions between Ni and Al elemental metal foils. Microstructure showed that the intermetallic volume fraction was 55%, 45%, 35% in the 1:1, 2:1, 4:1 thickness ratio(Ni:Al) specimen and the main phases of the intermetallic were transformed from $Ni_2Al_3$ to NiAl when the thickness ratio was increased. Tensile strength and elongation were increased when the volume fraction of Ni metallic phase was increased. Under assumptions of isostrain condition, the tensile strength of metal/intermetallic laminated composites didn't obey the ROM due to the thermal residual stress and this was confirmed by X-ray residual stress analysis. Fracture toughness results by the SENB test showed R-curves with upward curvature based on LSB condition. Bridging stress based on LSB condition was determined by the curve fitting analysis, In-situ observed microstructure during fracture test showed that the various bridging mechanism such as crack bridging, crack branching and ductile failure of metallic layer were occurred

• Journal of Welding and Joining
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• 제31권5호
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• pp.64-70
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• 2013

The joining of Ti and SUS304 dissimilar metals is one of the effective measures to save rare metal. But Ti and SUS304 have differences in materials properties, and Ti and Fe intermetallic compounds such as TiFe and $TiFe_2$ are easily formed in weld fusion zone between Ti and SUS304. Nevertheless, in this study, full penetration lap dissimilar welding of Ti and SUS304 using single-mode fiber laser with ultra-high welding speed was tried, and it was found out that ultra-high welding speed could control the generation of intermetallic compound. To recognize the formation of intermetallic phase in the weld fusion zone and the compound zone of interface weld area were observed and analyzed using energy dispersive X-ray spectroscopy (EDX). And it was confirmed that the ultra-high welding speed could reduce amount of intermetallic compounds, but the intermetallic compounds were existed in the weld fusion zone under the all conditions.

• 한국재료학회지
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• 제11권5호
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• pp.345-353
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• 2001

본 연구에서는 MA 방법을 사용하여 $Al_3$Nb 금속간화합물의 조성에 Zr을 첨가하여 $Al_3$(Nb$_{1-x}$ )Zr$_{x}$ 합금분말을 제조한 후 이에 따른 상변화 거동 및 미세구조특성을 분석하였다. MA는Al$_3$(Nb$_{1-x}$ )Zr$_{x}$의 조성으로 Al, Nb, Zr 원료분말과 arc meltinly된 $Al_3$Nb, $Al_3$Zr 금속간화합물 분말을 사용하여 300rpm의 회전속도로 20시간 동안 MA하였다. 이때의 정상상태의 원료분말은 약 4$\mu\textrm{m}$의 평균입도와 약 12~18nm의 결정립크기를 가졌으며, arc melting된 분말은 약 2$\mu\textrm{m}$의 평균입도와 약 14nm의 결정립크기를 가지는 분말을 얻을 수 있었다 원료분말과 금속간화합물 분말의 MA 기구는 상이한 거동을 나타내었으며, 분말의 내부변형량은 원료분말이 금속간화합 분말보다 내부변형량이 더 많이 축적되었다. 이는 원료분말의 MA 경우 냉간 압접과 파괴가 반복적으로 진행되었지만 금속간화합물 분말은 취약한 화합물상이어서 냉간압접 보다는 파괴가 지배적으로 진행되었기 때문이다. 원료분말을 MA하였을 경우에는 Al (Nb.Zr)$_2$상이 형성되었으나 금속간화합물 분말로 MA하였을 경우에는 3원계 화합물상이나 비정질상으로 상변태 되지 않고 단지 두 합금상이 분쇄되어 나노복합화 되었다. 후속 열처리에 의해 원료분말인 경우에는 $Al_3$(Nb.Zr)의 화합물상이 쉽게 형성되었으나, 금속간화합물 분말의 경우에는 새로운 상 생성은 얼었고 단지 열처리 전의 분말내부에 쌓여있던 내부변형에너지가 약 60% 정도 감소하였다.

• 한국주조공학회지
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• 제31권2호
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• pp.66-70
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• 2011

Hot dip aluminizing (HDA) is widely used in industry for improving corrosion resistance of material. The formation of intermetallic compound layers during the contact between dissimilar materials at high temperature is common phenomenon. Generally, intermetallic compound layers of $Fe_2Al_5$ and $FeAl_3$ are formed at the Al alloy and Fe substrate interface. In case of cast iron, high contact angle of graphite existed in the matrix inhibits the formation of intermetallic compound layer, which carry with it the disadvantage of a reduced reaction area and mechanical properties. In present work, the process for the removal of graphite existed on the surface of specimen has been investigated. And also HDA was proceeded at $800^{\circ}C$ for 3 minutes in aluminum alloy melt. The efficiency of graphite removal was increased with the reduction of particle size in sanding process. Graphite appears to be present both in the region of melting followed by re-solidification and in the intermetallic compound layer, which could be attributed to the fact that the surface of cast iron is melted down by the formation of low melting point phase with the diffusion of Al and Si to the cast iron. Intermetallic compound layer consisted of $Fe(Al,Si)_3$ and $Fe_2Al_5Si$, the layer formed at cast iron side contained lower amount of Si.

• 한국재료학회지
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• 제18권3호
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• pp.153-158
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• 2008

Fe-aluminides have the potential to replace many types of stainless steels that are currently used in structural applications. Once commercialized, it is expected that they will be twice as strong as stainless steels with higher corrosion resistance at high temperatures, while their average production cost will be approximately 10% of that of stainless steels. Self-propagating, high-temperature Synthesis (SHS) has been used to produce intermetallic and ceramic compounds from reactions between elemental constituents. The driving force for the SHS is the high thermodynamic stability during the formation of the intermetallic compound. Therefore, the advantages of the SHS method include a higher purity of the products, low energy requirements and the relative simplicity of the process. In this work, a Fe-aluminide intermetallic compound was formed from high-purity elemental Fe and Al foils via a SHS reaction in a hot press. The formation of iron aluminides at the interface between the Fe and Al foil was observed to be controlled by the temperature, pressure and heating rate. Particularly, the heating rate plays the most important role in the formation of the intermetallic compound during the SHS reaction. According to a DSC analysis, a SHS reaction appeared at two different temperatures below and above the metaling point of Al. It was also observed that the SHS reaction temperatures increased as the heating rate increased. A fully dense, well-bonded intermetallic composite sheet with a thickness of $700\;{\mu}m$ was formed by a heat treatment at $665^{\circ}C$ for 15 hours after a SHS reaction of alternatively layered 10 Fe and 9 Al foils. The phases and microstructures of the intermetallic composite sheets were confirmed by EPMA and XRD analyses.

• Bulletin of the Korean Chemical Society
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• 제29권9호
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• pp.1787-1789
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• 2008

• 한국표면공학회지
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• 제12권2호
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• pp.75-83
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• 1979

The Rates of formation and heats of activation for the intermatallic Compound Layers between Cold rolled sheet and molten aluminium &ath (adding small amounts of silicon) has been determined by Continous aluminizing method in the temperature range of 680$^{\circ}$ to 760$^{\circ}C$ and with immerssion time. The structure of the intermetallic Compound Layers was the shape of "Tongues" in pure Al-Bath and Al-Bath Containing 1% Si, But in Al-5% Si Bath was "Band" the Composition of the intermetallic Compound Layers were checked by microhardness measurements and X-Ray probe micro analyzer. FeAl intermetallic Compound layer was found to be uniform in pure Al-Bath and Al-5% Si Bath, But Fe Al intermetallic Compound Layer was shown in Al-1% Si Bath. The growth Rates of the intermetallic Compound Layers was most rapidly increased at Temperatures from 720$^{\circ}$ to 760$^{\circ}C$, at the immorsion time above 60 Second in pure Al-Bath, But in Al-1% Si Bath was solwly increased for the same conditions, and then in Al-5% Si Bath was hardly effected by these experimental condition. Heasts of activation of 29, 46 Kcal per mole which calculuted from Layer growth experiments were found in pure Al-Bath, Al-1% Si Bath respectively.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.487-492
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• 2002

The growth kinetics of intermetallic compound layers formed between eutectic Sn-58Bi solder and (Cu, electroless Ni-P/Cu) substrate were investigated at temperature between 70 and 120 C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by volume diffusion over the temperature range studied. The apparent activation energies of Cu$_{6}$Sn$_{5}$ and Ni$_3$Sn$_4$ intermetallic compound in the couple of the Sn-58Bi/Cu and Sn-58Bi/electroless Ni-P were 127.9 and 81.6 kJ/mol, respectively.ely.