• Journal of Welding and Joining
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• v.29 no.1
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• pp.99-106
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• 2011

Joint strength between a solder ball and a pad on a substrate is one of the major factors which have effects on electronic device reliability. The effort to improve solder joint strength via surface cleaning, heat treatment and solder composition change have been in progress. This paper will discuss the method of solder ball joint strength improvement using LF hydrogen radical cleaning treatment and focus on the effects of surface treatment condition on the solder ball shear strength and interfacial reactions. In the joint without radical cleaning, voids were observed at the interface. However, the specimens cleaned by hydrogen-radical didn't have voids at the interface regardless of cleaning time. The shear strength between the solder ball and the pad was increased over 120%(about 800gf) when compared to that without the radical treatment (680gf) under the same reflow condition. Especially, at the specimen treated for 5minutes, ball shear strength was considerably increased over 150%(1150gf). Through the observation of fracture surface and cross-section microstructure, the increase of joint strength resulted from the change of fracture mode, that is, from the solder ball fracture to IMC/Ni(P) interfacial fracture. The other cases like radical treated specimen for 1, 3, 7, 9min. showed IMC/solder interfacial fracture rather than fracture in the solder ball.

• Journal of Welding and Joining
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• v.35 no.3
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• pp.1-6
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• 2017

The effect of metal turnover (MTO) of electroless Ni plating bath on the brittle fracture behavior of electroless nickel electroless palladium immersion gold (ENEPIG)/Sn-3.0wt%Ag-0.5wt%Cu(SAC305) solder joint was evaluated in this study. The MTOs of the electroless Ni for the ENEPIG surface finish were 0 and 3. As the MTO increased, the interfacial IMC thickness increased. The brittle fracture behavior of the ENEPIG/SAC305 solder joint was evaluated with high speed shear (HSS) test. The HSS strength decreased with increasing the MTO of the electroless Ni bath. The brittle fracture increased with increasing the shear speed of the HSS test. The percentage of the brittle fracture for the 3 MTO sample was much higher than that for the 0 MTO sample.

• Macromolecular Research
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• v.9 no.1
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• pp.20-29
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• 2001

Interfacial adhesion and nondestructive behavior of electrodeposited (ED) carbon fiber rein-forced composites were evaluated using electro-micromechanical techniques and acoustic emission (AE). The interfacial shear strength (IFSS) of the ED carbon fiber/epoxy composites was higher than that of the untreated fiber. This might be expected because of the possibility of chemical or hydrogen bonding in an electrically adsorbed polymeric interlayer. The logarithmic electrical resistivity of the untreated single-carbon fiber composite increased suddenly to infinity when fiber fracture occurred, whereas that of the ED composite increased relatively gradually to infinity. This behavior may arise from the retarded fracture time due to enhanced IFSS. In single- and ten-carbon fiber composites, the number of AE signals coming from interlayer failure of the ED carbon fiber composite was much larger than that of the untreated composite. As the number of the each first fiber fractures increased in the ten-carbon fiber composite, the electrical resistivity increased stepwise, and the slope of the logarithmic electrical resistance increased.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2000.11a
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• pp.17-21
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• 2000

Logarithmic electrical resistivity of the untreated or thin diameter carbon fiber composite increased suddenly to the infinity when the fiber fracture occurred by tensile electro-micromechanical test, whereas that of the ED or thick fiber composite increased relatively broadly up to the infinity. Electrical resistance of single-carbon fiber composite increased suddenly due to electrical disconnection by the fiber fracture in tensile electro-micromechanical test, whereas that of SFC increased stepwise due to the occurrence of the partial electrical contact with increasing the buckling or overlapping in compressive test. Electrical resistivity measurement can be very useful technique to evaluate interfacial properties and to monitor curing behavior of single-carbon fiber/epoxy composite under tensile/compressive loading.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.36-41
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• 2004

A method to measure the interfacial toughness of film/substrate by nanoindenter is proposed. As the thickness of the film decreases, the measurement of the interfacial toughness requires the more sophisticated equipment such as nanoindenter. In this study, the nanoindenter is applied to the substrate near the interface of film/substrate in the direction perpendicular to the normal of the interface, causing the cohesive fracture of the substrate, followed by the interfacial cracking. The specimen of Cu($0.56 {\mu}m$)/Si(530 ${\mu}$) are made by sputtering the copper onto the silicon wafer. By scratching the copper surface, we can make the easy interfacial cracking during the nanoindentation. It is found that the averaged values of the interfacial toughness of the Cu/Si is $0.664{\pm}0.3\;J/m^2$ . The phase angle of the specimen in this study is ${\psi}{\simeq}-36.8^{\circ}$, computed by the method of Suo and Hutchinson.[1]

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1197-1201
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• 1994

The fracture strength and fracture modes were studied in 3Y-TZP/NiNi bonding which change their interfacial structure with bonding condition. Average 4-point bending strength of 200 MPa to 400 MPa were achieved. The formation of Ti-oxide phase at the interface critically influenced the bonding strength and fracture mode. The fracture surface of Ti-oxide free interface contained multiphase in some case including ZrO2. From the result it was confirmed that in order to maximize the bonding strength crack deflection from interface to ceramic was required.

• Journal of Advanced Marine Engineering and Technology
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• v.25 no.5
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• pp.1140-1147
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• 2001

This paper describes the effect of various molding pressure for Mode I. Mode II interlaminar fracture toughness of carbon fiber reinforced plastic composites by using double cantilever beam(DCB), end notched flexure(ENF) and end loaded split(ELS) Specimen. The value of $G_{IC}$, $G_{IIC}$ as a function of various molding pressure is almost same at 307, 431, 585 kPa, however it shows highest value under 307kPa molding pressure, The SEM photographs show good fiber distribution and interfacial bonding of composites when the molding pressure is the 307kPa.

• Proceedings of the Korean Society For Composite Materials Conference
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• 2002.05a
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• pp.109-113
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• 2002

Interfacial and electrical properties for the carbon fiber reinforced epoxy-amine terminated (AT) PEI composites were performed using microdroplet test and electrical resistance measurements. As AT PEI content increased, the fracture toughness of epoxy-AT PEI matrix increased, and IFSS was improved due to the improved toughness and energy absorption mechanisms of AT PEI. The microdroplet in the carbon fiber/neat epoxy composite showed brittle microfailure mode. At 15 wt% AT PEI content, ductile microfailure mode appeared because of improved fracture toughness. After curing, the changes of electrical resistance (ΔR) with increasing AT PEI content increased gradually because of thermal shrinkage. The matrix fracture toughness was correlated to IFSS, TEC and electrical resistance. In cyclic strain test, the maximum stress and their slope of the neat epoxy case were higher than those of 15 wt% AT PEI. The results obtained from electrical resistance measurements under curing process and reversible stress and strain were consistent well with matrix toughness properties.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.40-44
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• 2008

The interfacial adhesion energy between resist and a substrate is very important due to resist pull-off problems during separation of mold from a substrate in nanoimprint process. And effect of substrate surface roughness on interfacial adhesion energy is very important. In this paper, we have treated glass wafer surface using $CF_4$ gas for increase surface roughness and it has tested interfacial adhesion properties of UV resin/glass substrate interfaces by 4 point bending test. The interfacial adhesion energies by bare, 30, 60 and 90 sec surface treatments are 0.62, 1.4, 1.36 and 2 $J/m^2$, respectively. The test results showed quantitative comparisons of interfacial fracture energy (G) effect of glass wafer surface roughness.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.22 no.2
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• pp.416-427
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• 1998

Unidirectional commingled-yarn-based carbon fiber(CF)/polyamide(PA) 6 composite was fabricated under molding pressures of 0.4, 0.6 and 1.0 MPa to study its flexural deformation and fracture behavior. Fiber/matrix interfacial bonding area became larger with an increase of molding pressure from 0.4 to 0.6 MPa. For molding pressures .geq. 0.6 MPa, good flexural performance of similar magnitudes was attained. For the fracture test, four kinds of notch direction were adopted : edgewise notches parallel (L) and transverse (T) to the major direction of fiber bundles, and flatwise notches parallel(ZL) and perpendicular(ZT) to this direction. Nominal bend strength for L and ZL specimens exhibited high sensitivity to notching. ZL specimens revealed the lowest values of the critical stress intensity factor $K_c$ which was slightly superior to those of unfilled PA6 matrix. Enlargement of the compression area for T specimens was analyzed by means of the rigidity reduction resulting from the fracture occurrence.