• Journal of Welding and Joining
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• 제20권5호
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• pp.106-112
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• 2002

In the present study, the wettability and interfacial tension between (bare Cu, electroless Ni/cu, immersion Au/Ni/Cu) substrates and indium solder were investigated as a function of soldering temperature, types of flux. The wettability of In solder increased with soldering temperature and solid content of flux. The wettability of In solder was affected by the substrate metal finish used, i.e., nickel, gold and copper. On the bare Cu substrate, In solder wet better than any of the substrate metal finishes tested. Intermetallic compound formation between liquid solder and substrate reduced the interfacial energy and improved wettability. For the identification of intermetallic compounds, X-Ray Diffraction(LRD) were employed. Experimental results showed that the intermetallic compounds, such as Cu11In9 and In27Ni10 are observed f3r different substrates respectively. The wetting kinetics is investigated by measuring wetting time with the wetting balance technique. The activation energy of wetting calculated for the In solder/cu substrate and In solder/electroless Au/Ni/Cu substrate are 36.13 and 27.36 kJ/mol, respectively.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.115-117
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• 2009

Interface dipole energies between interfacial layers with different thicknesses coated on indium tin oxides (ITOs) and 4,4'-bis[N-(1-naphtyl)-N-phenyl-amino]biphenyl are determined. After $O_2$ plasma treatment on thick-metal (>4 nm) coated ITO, the work function and interface dipole energy increased. In thin-metal (< 2 nm) coated ITO, no change in the interface dipole energy was found though the work function increased. Thus, the $O_2$ plasma treated thin (< 2 nm) interfacial layer reduced the hole injection barrier.

• 한국재료학회지
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• 제20권6호
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• pp.319-325
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• 2010

3-D IC integration enables the smallest form factor and highest performance due to the shortest and most plentiful interconnects between chips. Direct metal bonding has several advantages over the solder-based bonding, including lower electrical resistivity, better electromigration resistance and more reduced interconnect RC delay, while high process temperature is one of the major bottlenecks of metal direct bonding because it can negatively influence device reliability and manufacturing yield. We performed quantitative analyses of the interfacial properties of Al-Al bonds with varying process parameters, bonding temperature, bonding time, and bonding environment. A 4-point bending method was used to measure the interfacial adhesion energy. The quantitative interfacial adhesion energy measured by a 4-point bending test shows 1.33, 2.25, and $6.44\;J/m^2$ for 400, 450, and $500^{\circ}C$, respectively, in a $N_2$ atmosphere. Increasing the bonding time from 1 to 4 hrs enhanced the interfacial fracture toughness while the effects of forming gas were negligible, which were correlated to the bonding interface analysis results. XPS depth analysis results on the delaminated interfaces showed that the relative area fraction of aluminum oxide to the pure aluminum phase near the bonding surfaces match well the variations of interfacial adhesion energies with bonding process conditions.

• Corrosion Science and Technology
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• 제22권4호
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• pp.287-296
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• 2023

Li-ion batteries have been gaining increasing importance, driven by the growing utilization of renewable energy and the expansion of electric vehicles. To meet market demands, it is essential to ensure high energy density and battery safety. All-solid-state batteries (ASSBs) have attracted significant attention as a potential solution. Among the advantages, they operate with an ion-conductive solid electrolyte instead of a liquid electrolyte therefore significantly reducing the risk of fire. In addition, by using high-capacity alternative electrode materials, ASSBs offer a promising opportunity to enhance energy density, making them highly desirable in the automotive and secondary battery industries. In ASSBs, Li metal can be used as the anode, providing a high theoretical capacity (3860 mAh/g). However, challenges related to the high interfacial resistance between Li metal and solid electrolytes and those concerning material degradation during charge-discharge cycles need to be addressed for the successful commercialization of ASSBs. This review introduces and discusses the interfacial reactions between Li metal and solid electrolytes, along with research cases aiming to improve these interactions. Additionally, future development directions in this field are explored.

• Composites Research
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• 제21권4호
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• pp.7-14
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• 2008

접착제 이용 결합 조인트의 하중지지 능력 예측 기법은 점착제를 이용한 접합 조인트 설계에 있어서 가장 중요한 기술이다. 본 연구 계면 파괴역학을 이용하여 복합재료/금속 접착 조인트의 하중지시 능력을 예측하는 기법을 소개한다. 구체적으로 복합재료/탄소강 결합의 접착 강도를 계면 균열의 에너지 방출률과 계면 파괴인성치 개념을 사용하여 평가하는 방법을 제시 검증하였다. 계면 균열의 에너지 방출률은 유한요소해선 결과를 이용한 가상 균열 닫음 기법 (VCCT)을 사용하여 계산하였으며, 게면 파괴인성치는 이종재료 ENF (end-notched flexure) 시편을 고안하여 측정하였다. 고안된 이종 재료 ENF 시편을 사용하여 시편의 두께에 상관없이 일관된 Mode II 계면 파괴인성치를 측정할 수 있음과 양면 겹치기 접합 조인트의 특성 에너지 방출률이 측정된 계면 파괴인성치와 일치함을 확인하였다. 따라서 에너지 방출률에 근거한 계면 균열 진전 기준은 접착 조인트의 하중지지 능력을 신뢰성 있게 예측하는 실제적인 설계 도구로서 활용될 수 있다.

• Nuclear Engineering and Technology
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• 제32권5호
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• pp.433-445
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• 2000

The interfacial area concentration (IAC) is one of the most important parameters in the two-fluid model for two-phase flow analysis. The IAC can be measured by a local conductivity probe method that uses the difference of conductivity between water and air/steam. The number of sensors in the conductivity probe may be differently chosen by considering the flow regime of two-phase flow. The four sensor conductivity probe method predicts the IAC without any assumptions of the bubble shape. The local IAC can be obtained by measuring the three dimensional velocity vector elements at the measuring point, and the directional cosines of the sensors. The five sensor conductivity probe method proposed in this study is based on the four sensor probe method. With the five sensor probe, the local IAC for a given referred measuring area of the probe can be predicted more exactly than the four sensor probe. In this paper, the mathematical approach of the five sensor probe method for measuring the IAC is described, and a numerical simulation is carried out for ideal cap bubbles of which the sizes and locations are determined by a random number generator.

• 대한기계학회논문집A
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• 제26권6호
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• pp.1047-1052
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• 2002

The impact value, the interfacial shear strength, the tensile strength and the fracture strain of Nb/MoSi$_2$laminate composites, which were associated with the interfacial reaction layer, have been investigated. Three types of Nb/MoSi$_2$ laminate composites alternating sintered MoSi$_2$ layers and Nb foils were fabricated as the parameter of hot press temperature. The thickness of interfacial reaction layer of Nb/MoSi$_2$ laminate composites increased with increasing the fabrication temperature. The growth of interfacial reaction layer increased the interfacial shear strength and led to the decrease of impact value in Nb/MoSi$_2$ laminate composites. It was also found that in order to maximize the fracture energy of Nb/MoSi$_2$ laminate composites, interfacial shear strength and the thickness of interfacial reaction layer must be secured appropriately.

• Korea-Australia Rheology Journal
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• 제13권3호
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• pp.125-130
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• 2001

Block copolymers of PC-b-PMMA (polycarbonate-b-polymethylmethacrylate) and PC -b-SAN (polycarbonate-b-(styrene-c-acrylonitrile)), were examined as compatibilizers for blonds of PC with SAN copolymer. The average diameter of the dispersed particles was measured with an image analyser, and the interfacial properties of the blonds were analysed with an imbedded fiber retraction (IFR) technique. The average diameter of dispersed particles and interfacial tension of the PC/SAN blends reached a minimum value when the SAN copolymer contained about 24 wt% AN. Interfacial tension and particle size were further reduced by adding compatibilizer to the PC/SAN blends. PC-b-PMMA was more effective than PC-b-SAN as a compatibilizer in reducing the average diameter of the dispersed particles and interfacial tension of PC/SAN blend. A direct proportionality between the particle diameter and interfacial tension was also observed. The interfacial properties of the PC/SAN blends were optimized by adding a block copolymer and using an SAN copolymer that had minimum interaction energy with PC.

• 마이크로전자및패키징학회지
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• 제25권2호
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• pp.41-48
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• 2018

Fan-out wafer level packaging (FOWLP) 적용을 위한 최적의 Cu 재배선 계면접착에너지 측정방법을 도출하기 위해, 전기도금 Cu 박막과 WPR 절연층 계면의 정량적 계면접착에너지를 $90^{\circ}$ 필 테스트, 4점 굽힘 시험법, double cantilever beam (DCB) 측정법을 통해 비교 평가 하였다. 측정 결과, 세 가지 측정법 모두 배선 및 패키징 공정 후 박리가 일어나지 않는 산업체 통용 기준인 $5J/m^2$보다 높게 측정되었다. 또한, DCB, 4점 굽힘 시험법, $90^{\circ}$ 필 테스트 순으로 계면접착에너지가 증가하는 거동을 보였는데, 이는 계면파괴역학 이론에 의해 위상각 증가에 따라 이종재료 계면균열 선단의 전단응력성분 증가에 따른 소성변형에너지 및 계면 거칠기 증가 효과에 의한 것으로 설명이 가능하다. FOWLP 재배선에 대한 최적의 계면접착에너지 도출을 위해서는 시편제작 공정, 위상각 차이, 정량적 측정 정확도 및 결합력 크기 등을 고려하여 4점 굽힘 시험법 또는 DCB 측정법을 적절히 혼용 사용하는 것이 타당한 것으로 판단된다.

• Journal of Mechanical Science and Technology
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• 제14권8호
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• pp.830-835
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• 2000

The thermodynamical estimation of the interfacial reaction and the impact properties of $Nb/MoSi_2$ laminate composites containing SiC, $NbSi_2$ or $ZrO_2$ particles are investigated. Laminate composites, which comprise alternating layers of $MoSi_2$ with the particle and Nb foil, were fabricated by the hot press process. It is clearly found out that the interfacial reaction of $Nb/MoSi_2$ can be controlled by the addition of $ZrO_2$ particle to the $MoSi_2$ phase. The addition of $ZrO_2$ particle increases both the impact value and the sintered density of Nb/McSij, The suppression of the interfacial reaction is caused by the formation of $ZrSiO_2$ in $MoSi_2-ZrO_2$ matrix mixture.