• Journal of Adhesion and Interface
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• v.15 no.3
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• pp.109-115
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• 2014

In this study, we synthesized and identified microcapsule containing isocyanate, and investigated the mechanical and adhesion properties of polyurethane resin by adding microcapsule. We found out that the core material of microcapsule and the component weight fraction of microcapsule from the FT-IR and TGA analysis. From the results of adhesion and mechanical property tests, we confirmed that in case of using microcapsule for adhesive resin composition, adhesion strength, tensile strength and abrasion were improved by cross-linking reaction between urethane and IPDI in microcapsule.

• Proceedings of the Korea Concrete Institute Conference
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• 2000.10b
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• pp.1031-1036
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• 2000

In this study, a numerical simulation that can effectively predict the strengthening effect of repaired aged RC structures is developed using the axial deformation link elements. In repaired structures, concrete and interface are modeled as quasi-brittle materials. An elastic-perfectly plastic constitutive relationship is introduced for reinforcing bars. Also, a linear-elastic relationship for repair materials such as FRP or CFS. Structural deterioration in terms of corrosion of steel rebar is considered. The interfacial property between steel and concrete which is reduced by corrosion of steel rebar is obtained by comparing numerical results with experimental results of pull out tests. Obtained values are used in repaired reinforced concrete structures under flexural loading conditions. To investigate strengthening effect of the structures repaired with carbon fiber sheet(CFS), repaired and unrepaired RC structures are analyzed numerically. From analysis, rip-off, debonding and rupture failure mechanisms of interface between substrate and CFS can be determined. Finally, strengthening effect according to the variation of interfacial material properties is investigated, and it is shown that interfacial material properties have influence on the mechanical behavior of repaired structure systems Therefore, the developed numerical method using axial deformation link elements can use for determining the strengthening effects and failure mechanism of repaired aged RC structure.

• Proceedings of the Korea Society for Simulation Conference
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• 2001.05a
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• pp.82-87
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• 2001

In this paper we described the generation method of interface logic which can be replace between IP and IP handshaking signal with asynchronous logic circuit. Especially, we suggest the new \"Waveform Conversion Algorithm : Wave2VHDL\", if only mixed asynchronous timing waveform suggested which level type input and pulse type input for handshaking, we can convert waveform to flowchart and then replaced with VHDL code according to converted flowchart. Also, we assure that asynchronous electronic circuits for IP interface are generated by applying extracted VHDL source code from suggested algorithm to conventional domestic/abroad CAD Tool, and then we proved that coincidence simulation result and suggested timing diagram.g diagram.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.13-19
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• 2002

We have studied on the surface and adhesion properties for acrylic terpolymers, having both hydrophobic and hydrophilic side chains, synthesized via solution polymerization. In order to develop a waterborne material. we tried to synthesize these terpolymers via emulsion polymerization. The polymeric emulsion synthesized was mainly composed of methyl methacrylate (MMA), methoxy-polyethyleneglycol methacrylate (MPEGMA) having hydrophilic side chains and methoxypolypropyleneglycol methacrylate (MPEGMA) having hydrophobic side chains. The viscosities of this series increased with an increase in the content of the co-monomer such as MPEGMA and (MPEGMA). This behavior resulted in the increase in the diameter and heterogeneity of the emulsion particle via AFM observation. Furthermore. the tensile adhesion strength and 90-degree peel strength of the adhesive of these polymeric emulsions were measured. In the case of polymeric emulsion composed of the same content of both hydrophilic and hydrophobic component, the adhesion property showed the highest value. However, since the adhesion properties as a practical applicable adhesive were poor, some improvements were required. When the composition above was modified with butyl acrylate (BA), the improvement effect on adhesion strength was accepted. In particular, 90-degree peel strength increased up to a maximum of 400% of the original value.

• Journal of Adhesion and Interface
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• v.12 no.1
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• pp.11-15
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• 2011

In this study we synthesized low VOC-solvent soluble thermo plastic polyurethane, The effect of chain extender and NCO/OH ratio for properties of thermoplastic polyurethane was investigated. Also, we prepared low VOC-type primer by TPU and acrylic modified tackifier resin. When NCO/OH ratio was 2 or more, TPU was insoluble in low VOC solvent. And peel strength was higher value using polar type tackifier than non-ploar type tackifier.

• Journal of Adhesion and Interface
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• v.12 no.4
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• pp.138-143
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• 2011

Recently epoxy resin compositions having backbone of novolac derivatives with biphenylene compounds have been used as materials of eco-freindly EMC (Epoxy Molding Compound), because the cured epoxy resin compositions show the self-extinguishing without flame retardant additives. In this study, epoxy resin compositions were prepared and cured using novolac derivateves with biphenylene. Their propeties - structures of phenol derivatives and reactivity, thermal expansion, modulus, and thermal degradation - were obtained by DSC, DMA, TMA, TGA method. When both epoxy resin and hardenr had the biphenyl novolac structure, epoxy resin compositions showed low thermal expansion, good mechanical property, and combustion retardation.

• Journal of Adhesion and Interface
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• v.12 no.2
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• pp.67-72
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• 2011

Acrylic pressure-sensitive adhesives are used in many different parts in the world. But acrylic acid in PSAs may occur unexpected results such as corroding adherends or producing by-products when applied within electronic devices. This study employed acrylic PSAs based on 2-ethylhexyl acrylate (2-EHA), 2-hydroxyethyl acrylate (2-HEA) and butyl acrylate (BA) with different coating thickness. There are two types of curing agents. One is methylaziridine derivative (MAZ) and the other is aluminum acetylacetonate (AlACA). This study examined the adhesion performance and curing behaviors using peel strength, probe tack and gel fraction. Also, the viscoelastic properties of acrylic PSAs were investigated from Advanced rheometric expansion system (ARES).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.6
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• pp.580-585
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• 2004

Silicon dioxide (SiO$_2$) is widely used as a gate dielectric material for thin film transistors (TFT) and semiconductor devices. In this paper, SiO$_2$ films were grown by APCVD(Atmospheric Pressure chemical vapor deposition) at the high temperature. Experimental investigations were carried out as a function of $O_2$ gas flow ratios from 0 to 200 1pm. This article presents the SiO$_2$ gate dielectric studies in terms of deposition rate, refrative index, FT-IR, C-V for the gate dielectric layer of thin film transistor applications. We also study defect passivation technique for improvement interface or surface properties in thin films. Our passivation technique is Forming Gas Annealing treatment. FGA acts passivation of interface and surface impurity or defects in SiO$_2$ film. We used RTP system for FGA and gained results that reduced surface fixed charge and trap density of midgap value.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.3
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• pp.241-246
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• 2000

We fabricated Bi-2223 multi-filaments superconductor tape and evaluated the effect of twisting on the microstructural evolution and critical current. Twist pitches of the tapes are in the range of 70- 8mm and uniformly deformed. It was observed that grain size and the degree of texture decreased as decreasing pitch probably due to the formation of the irregular interface between Ag and filaments. In addition critical current of the tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tapes decreased to 6.5 A with decreasing pitch to 8mm, showing 48% of degradation compared to the untwisted tape(12.5 A). These reduction of critical current may be related to the interface irregularity smaller grain size worse texture and the presence of cracks due to the induced strain during twisting processing.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.11a
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• pp.15-18
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• 2003

Ta-Ti metal alloy is proposed for alternate gate electrode of ULSI MOS device. Ta-Ti alloy was deposited directly on $SiO_2$ by a co-sputtering method and good interface property was obtained. The sputtering power of each metal target was 100W. Thermal and chemical stability of the electrode was studied by annealing at $500^{\circ}C$ and $600^{\circ}C$ in Ar ambient. X-ray diffraction was measured to study interface reaction and EDX(energy dispersive X-ray) measurement was performed to investigate composition of Ta and Ti element. Electrical properties were evaluated on MOS capacitor, which indicated that the work function of Ta-Ti metal alloy was ${\sim}4.1eV$ compatible with NMOS devices. The measured sheet resistance of alloy was lower than that of poly silicon.