• Journal of Adhesion and Interface
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• v.16 no.1
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• pp.35-39
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• 2015

• Journal of Adhesion and Interface
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• v.15 no.4
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• pp.174-177
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• 2014

• Journal of Adhesion and Interface
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• v.5 no.2
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• pp.40-50
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• 2004

• Journal of Adhesion and Interface
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• v.4 no.1
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• pp.43-50
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• 2003

점착제는 경피흡수제제(transdermal drug delivery system, TDDS)의 중요한 구성요소 중의 하나이다. TDDS용 점착제는 일반적인 점착제의 역할 외에도 부착되는 피부에 적합해야 하고, 이것에 포함되는 약물 및 첨가제들과 양립하면서 약물의 전달을 효과적으로 지속해야한다. 본 총설에서는 흔히 사용되는 TDDS용 점착제인 polyisobutylenes, polyacrylates, silicones와 최근에 개발된 제품들을 소개한다.

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.37-43
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• 2002

A number of thin-film deposition technologies have been developed. However, even a thin film whose properties are excellent may not be used as long as the adhesion strength between the thin film and the substrate is poor. For thin films, the adhesion strength is as important as the properties. In the present article, relation between interface structure and thin film adhesion, and factors affecting thin film adhesion are reviewed. Two kinds of factors, internal factors and external factors, affect thin film adhesion. Such factors as composition, structure, and reactivity of both thin film and substrate as well as surface roughness of the substrate and residual stress of the thin film belong to internal factors. And such factors as load, temperature, humidity, and corrosive environment belong to external factors. It is also reviewed that how we can control the internal factors and the external factors to enhance or keep the adhesion strength.

• Journal of Adhesion and Interface
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• v.3 no.4
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• pp.19-26
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• 2002

In order to study the toughening mechanism of rubber modified polycarbonate, the sequence of development of micro-voids was investigated by real-time small angle X-ray scattering with Synchrotron radiation (SR-SAXS). The used test method was wedge test. The scattering intensity increases with increasing penetration depth of wedge, i.e. applied strain. The increase is due to the micro-void formation during deformation. This micro-void was uniformly developed in matrix and was different from large-void due to internal cavitation of rubber particle and/or debonding between rubber particle and polycarbonate matrix. The micro-void was developed at the critical strain and the radius of micro-void is around $600{\AA}$. Above the critical strain the size of micro-void remains almost constant with increasing applied strain. However, the population of micro-void increased with applied strain.

• Journal of Adhesion and Interface
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• v.4 no.3
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• pp.21-32
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• 2003

Various methods for adhesion measurement, which are related to previously published paper [J. of Soc. of Adhe. and Inter, 3,4 (2002)], are reviewed. At first, the prerequisite for the ideal adhesion strength measurement is considered, and three categories of methods for adhesion measurement, such as mechanical, non-mechanical methods and miscellaneous methods, are introduced.

• Journal of Adhesion and Interface
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• v.3 no.1
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• pp.43-51
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• 2002

Advanced adhesive technologies and demanding applications of adhesive joints can no longer be developed successfully by the traditional "trial and error" approach. Appropriate technical solutions require reference to a reliable basis of well-established scientific knowledge about the elementary mechanisms of adhesion (i.e. the 'fundamental adhesion') as they are responsible for the capability of the compound w transmit mechanical force between the adhesive and the substrate surface (i.e. the 'practical adhesion'). Adhesion mechanisms also influence the formation of polymer structure in the adhesive and the resulting macromolecular dynamics in the interphase that is formed in the adhesive near to the substrate. These manifold molecular factors rule the macroscopic behaviour of an adhesive bond line in terms of mechanical and other physical properties as well as in terms of durability. This paper reviews the level of refinement that understanding of fundamental adhesion has achieved up to now.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.4
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• pp.33-39
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• 2014

To establish the reliability of a packaging structures, adhesion testing of key interfaces is a critical task. Due to the material mismatch, the interface may be prone to delamination failure due to conditions during the manufacturing of the product or just from the day-to-day use. To assess the reliability of the interface adhesion strength testing can be performed during the design phase of the product. One test method of interest is the four-point bending (4PB) adhesion strength test method. This test method has been implemented in a variety of situations to evaluate the adhesion strength of interfaces in bimaterial structures to the interfaces within thin film multilayer stacks. This article presents a review of the 4PB adhesion strength testing method and key implementations of the technique in regards to semiconductor packaging.

• Journal of Adhesion and Interface
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• v.8 no.4
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• pp.32-40
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• 2007