• 콘크리트학회지
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• 제9권4호
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• pp.197-205
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• 1997

폴리머 콘크리트를 오버레이 콘크리트로서 기존 시멘트 콘크리트 위에 타설할 경우 폴리머 콘크리트의 경화수축으로 말미암아 전단응력, 수직응력 및 축응력이 발생되며 이러한 응력은 폴리머 콘크리트와 기존 시멘트 콘크리트 사이의 접착성능에 영향을 미쳐 결국 역학적 성질 및 내구성이 저하될 수 있다. 오버레이 콘크리트의 수축응력은 본 실험에서 실시한 구속된 오버레이 콘크리트의 구속해제에 의한 수축변형량과 탄성계수로서 구할 수 있다. 본 연구에서는 폴리머 종류, 오버레이 콘크리트 두께, 양생시간과 온도에 따른 폴리머 콘크리트 및 폴리머 시멘트 콘크리트의 수축에 의한 축응력을 측정하여 폴리머 콘크리트를 각종 교량등의 오버레이 콘크리트로 사용하멩 있어서 기초적 자료를 제공하고자 하였다. 연구결과, 폴리머 콘크리트의 경화수축응력은 폴리머의 종류, 양생온도, 재령 및 두께에 의해 영향을 크게 받는 것으로 나타났다.

• 마이크로전자및패키징학회지
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• 제10권3호
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• pp.89-98
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• 2003

반도체 소자의 배선용 재료로서 사용가능한 합금원소 Mg를 첨가한 Cu(Mg) 박막의 기계 및 전기적 특성 변화를 조사하였다. Cu(2.7at.%Mg) 박막은 열처리를 할 경우 Cu 박막에 비하여 표면거칠기는 약 1/10 정도로 줄고 $SiO_2$와의 접착력도 2배 이상 향상된 결과를 나타내었다. 또한 $300^{\circ}C$이상의 온도에서 10분 이상 열처리를 할 경우 급격한 저항감소를 보여주었는데 이는 Mg 원소의 확산으로 인해 표면 및 계면에서 Mg 산화물이 형성되고 내부에는 순수 Cu와 같이 되었기 때문이다. 경도 및 열응력에 대한 저항력도 Cu박막에 비해 우수한 것으로 나타났으며 열응력으로 인해 Cu 박막에 나타나던 표면 void가 Cu(Mg) 박막에서는 전혀 관찰되지 않았다. EM Test 결과 lifetime은 2.5MA/$cm^2$, $297^[\circ}C$에서 순수 Cu 라인보다 5배 이상 길고 BTS Test 결과 Capacitance-Voltage 그래프의 플랫 밴드 전압(V$_{F}$ )의 shift현상이 Cu에서는 나타났지만 Cu(Mg) 박막에서는 발생하지 않는 우수한 신뢰성을 보여주었다. 누설전류 측정을 통한 $SiO_2$의 파괴시간은 Cu에 비하여 약 3배 이상 길어 합금원소에 의한 확산방지 효과가 있음을 확인하였다.

• 대한조선학회 특별논문집
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• 대한조선학회 2006년도 특별논문집
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• pp.112-121
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• 2006

The vertical displacement of a ship on the basis of the sea level is an important parameter for its stability and control. To indicate the displacement on operating conditions, "draft marks" are carved on the hull of the ship in various ways. One of the methods is welding. The position, shape and size of the marks are specified on the shipbuilding rules by classification societies to be checked by shipbuilders. In most cases, high-skilled workers do the welding along the drawing for the marks and welding bead becomes the marks. But the inaccuracies due to human errors and high labor cost increase the needs for automating the work process of the draft marks. In the preceding work, an indoor robot was developed for automatic marking system on flat surfaces and the work proved that the robot welding was more effective and accurate than manual welding. However, many parts of the hull structure constructed at the outdoor are cowed shapes, which is beyond the capability of the robot developed for the indoor works on the flat surface. The marking on the curved steel surface requiring the 25m elevations is one of the main challenges to the conventional robots. In the present paper, the robot capable of climbing vertical curved steel surfaces and performing the welding at the marked position by effectively solving the problems mentioned earlier is presented.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.30-32
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• 2006

The interfacial reaction and reliability of eutectic Sn-Pb and Pb-free eutectic Sn-Ag ball-grid-array (BGA) solders with an immersion Ag-plated Cu substrate were evaluated following isothermal aging at $150^{\circ}C$. During reflowing, the topmost Ag layer was dissolved completely into the molten solder, leaving the Cu layer exposed to the molten solder for both solder systems. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer was formed at both of the solder/Cu interfaces during reflowing. The thickness of the Cu-Sn IMCs for both solders was found to increase linearly with the square root of isothermal aging time. The growth of the $Cu_3Sn$ layer for the Sn-37Pb solder was faster than that for the Sn-3.5Ag solder, In the case of the Sn-37Pb solder, the formation of the Pb-rich layer on the Cu-Sn IMC layer retarded the growth of the $Cu_6Sn_5$ IMC layer, and thereby increased the growth rate of the $Cu_3Sn$ IMC layer. In the ball shear test conducted on the Sn-37Pb/Ag-plated Cu joint after aging for 500h, fracturing occurred at the solder/$Cu_6Sn_5$ interface. The shear failure was significantly related to the interfacial adhesion strength between the Pb-rich and $Cu_6Sn_5$ IMC layers. On the other hand, all fracturing occurred in the bulk solder for the Sn-3.5Ag/Ag-plated Cu joint, which confirmed its desirable joint reliability.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.19-24
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• 2000

Workstation이나 PC seven옹 메모리칩의 고밀도 실장을 위한 stack chips package (SCP)를 만들기 위해서는 여러 개의 리드프레임이 수직으로 접합되어야 한다. 이를 위하여 Cu리드프레임 위에 전기화학증착법으로 Sn 또는 Sn/Ag를 도금한 후 XRD와 SEM으로 미세구조를 분석하였다. 그리고 두 개의 시편을 $250^{\circ}C$에서 10분간 열처리하고 가압하여 접합한 후 전단강도를 측정하여 비교하였다. Sn만이 도금된 경우, Sn과 Cu리드프레임이 반응하여 $Cu_3Sn$이 생성되었고, Sn/Ag의 경우에는 $Cu_3Sn$외에 Sn과 Ag가 반응하여 $Ag_3Sn$이 형성되었다. 전단강도는 Sn/Ag의 경우가 Sn만이 도금되었을 때보다 약 1.2배 정도 강하였다. 이는 접합면에 형성된 $Ag_3Sn$이 전단강도를 강화시켰기 때문이다.

• International Journal of Korean Welding Society
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• 제2권2호
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• pp.19-25
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• 2002

In recent years, techniques for micro-assembly with high repeatability under a scanning electron microscope (SEM) are required to construct highly functional micro-devices. Adhesion phenomenon is more significant for smaller objects, because adhesional force is proportional to size of the objects while gravitational force is proportional to the third power of it. It is also known that adhesional force between micro-objects exposed to Electron Beam irradiation of SEM increases with the elapsed time. Therefore, mechanical manipulation techniques using a needle-shaped tool by adhesional force are often adopted in basic researches where micro-objects are studied. These techniques, however, have not yet achieved the desired repeatability because many of these could not have been supported theoretically. Some techniques even need the process of trial-and-error. Thus, in this paper, mechanical and adhesional micro-manipulation are analyzed theoretically by introducing new physical factors, such as adhesional force and rolling-resistance, into the kinematic system consisting of a sphere, a needle-shaped tool, and a substrate. Through this analysis, they are revealed that how the micro-sphere behavior depends on the given conditions, and that it is possible to cause the fracture of the desired contact Interfaces selectively by controlling the force direction in which the tool-tip loads to the sphere. Based on the acquired knowledge, a mode diagram, which indicates the micro-sphere behavior for the given conditions, is designed. By referring to this mode diagram, the practical technique of the pick and place manipulation of a micro-sphere under an SEM by the selective interface fracture is proposed.

• 한국도로학회논문집
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• 제17권3호
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• pp.77-83
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• 2015

PURPOSES : In this study, a fracture-based finite element (FE) model is proposed to evaluate the fracture behavior of fiber-reinforced asphalt (FRA) concrete under various interface conditions. METHODS : A fracture-based FE model was developed to simulate a double-edge notched tension (DENT) test. A cohesive zone model (CZM) and linear viscoelastic model were implemented to model the fracture behavior and viscous behavior of the FRA concrete, respectively. Three models were developed to characterize the behavior of interfacial bonding between the fiber reinforcement and surrounding materials. In the first model, the fracture property of the asphalt concrete was modified to study the effect of fiber reinforcement. In the second model, spring elements were used to simulated the fiber reinforcement. In the third method, bar and spring elements, based on a nonlinear bond-slip model, were used to simulate the fiber reinforcement and interfacial bonding conditions. The performance of the FRA in resisting crack development under various interfacial conditions was evaluated. RESULTS : The elastic modulus of the fibers was not sensitive to the behavior of the FRA in the DENT test before crack initiation. After crack development, the fracture resistance of the FRA was found to have enhanced considerably as the elastic modulus of the fibers increased from 450 MPa to 900 MPa. When the adhesion between the fibers and asphalt concrete was sufficiently high, the fiber reinforcement was effective. It means that the interfacial bonding conditions affect the fracture resistance of the FRA significantly. CONCLUSIONS : The bar/spring element models were more effective in representing the local behavior of the fibers and interfacial bonding than the fracture energy approach. The reinforcement effect is more significant after crack initiation, as the fibers can be pulled out sufficiently. Both the elastic modulus of the fiber reinforcement and the interfacial bonding were significant in controlling crack development in the FRA.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.75-75
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• 2011

Recently, dye-sensitized solar cell (DSSC) attracts great attention as a promising alternative to conventional silicon solar cells. One of the key components for the DSSC would be the nanocrystalline TiO2 electrode, and the control of interface between TiO2 and TCO is a highly important issue in improving the photovoltaic conversion efficiency. In this work, we applied various interfacial layers, and analyzed their effect in enhancing photovoltaic properties. In overall, introduction of interfacial layers increased both the Voc and Jsc, since the back-reaction of electrons from TCO to electrolyte could be blocked. First, several metal oxides with different band gaps and positions were employed as interfacial layer. SnO2, TiO2, and ZrO2 nanoparticles in the size of 3-5 nm have been synthesized. Among them, the interfacial layer of SnO2, which has lower flat-band potential than that of TiO2, exhibited the best performance in increasing the photovoltaic efficiency of DSSC. Second, long-range ordered cubic mesoporous TiO2 films, prepared by using triblock copolymer-templated sol-gel method via evaporation-induced self-assembly (EISA) process, were utilized as an interfacial layer. Mesoporous TiO2 films seem to be one of the best interfacial layers, due to their additional effect, improving the adhesion to TCO and showing an anti-reflective effect. Third, we handled the issues related to the optimum thickness of interfacial layers. It was also found that in fabricating DSSC at low temperature, the role of interfacial layer turned out to be a lot more important. The self-assembled interfacial layer fabricated at room temperature leads to the efficient transport of photo-injected electrons from TiO2 to TCO, as well as blocking the back-reaction from TCO to I3-. As a result, fill factor (FF) was remarkably increased, as well as increase in Voc and Jsc.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2005년도 International Meeting on Information Displayvol.I
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• pp.700-702
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• 2005

A 5.0-inch transmissive type plastic TFT arrays were successfully fabricated on a plastic substrate at the resolution of $400{\times}3{\times}300$ lines (100ppi). All of the TFT processes were carried out below $150^{\circ}C$ on PES plastic films. After thin film deposition using PECVD, thin film failures such as film delamination and cracking often occurred. For successful growth of thin films (about 1um) without their failures, it is necessary to solve the critical problem related to the internal compressive stress (some GPa) leading to delamination at a threshold thickness value of the films. The Griffith's theory explains the failure process by looking at the excess of elastic energy inside the film, which overcomes the cohesive energy between film and substrate. To increase the above mentioned threshold thickness value there are two possibilities: (i) the improvement of the interface adhesion (for example, through surface micro-roughening and/or surface activation), and (ii) the reduction of the internal stress. In this work, reducing a-Si layer film thickness and optimizing a barrier SiNx layer have produced stable CVD films at 150oC, over PES substrates

• 한국재료학회지
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• 제30권8호
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• pp.426-434
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• 2020

The performance characteristics of a lead acid battery are investigated with the content of Sodium Perborate Tetrahydrate (SPT, NaBO₃·4H₂O) in a positive plate active material. SPT, which reacts with water to form hydrogen peroxide, is applied as an additive in the positive plate active material to increase adhesion between the substrate (positive plate) and the active material; this phenomenon is caused by a chemical reaction on the surface of substrate. A positive plate with the increasing content of SPT is prepared to compare its properties. It is confirmed that the oxide layer increases at the interface between the substrate and the active material with increasing content of SPT; this is proven to be an oxide layer through EDS analysis. Battery performance is confirmed: when SPT content is 2.0 wt%, the charging acceptance and high rate discharge properties are improved. In addition, the lifetime performance according to the Standard of Battery Association of Japan (SBA) S0101 test is improved with increasing content of SPT.