• Proceedings of the Korean Institute of Building Construction Conference
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• 2013.11a
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• pp.128-131
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• 2013

Energy losses through windows and doors are big problems in the construction industry. For glass only, it has takes the largest portion of mass from window assembly and it responsible for 24 ~ 45% of energy loss from total building energy loss. Insulating glass unit should maintain their basic functions during their working life in order to contribute positively for global warming issue. There have been many research works for improving insulating glass unit durability. But it is not easy job to fulfill the requirements because insulating glass units composed of many components. So, overall it is required to have right qualify control procedures starting from material selection to fabrication, shipping and installation to the customer site. In this report, we have reviewed the durability of insulating glass unit made from different grades of sealing materials based on globally accepted industry codes such as EN1279. ASTM E 2190 and Locally available code. KS L 2003. The result showed that there is a relationship between the mechanical properties of insulating glass 2nd sealant and the durability of the units.

• Wind and Structures
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• v.37 no.4
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• pp.289-302
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• 2023

Insulating glass units (IGUs) have been widely used in buildings in recent years due to their superior thermal insulation performance. However, because of the panel reciprocating motion and fatigue deterioration of sealants under long-term wind loads, many IGUs have the problem of early failure of watertight properties in real usage. This study aimed to propose a statistical method for wind-induced deflection of IGU panels during the whole life service period, for further precise analysis of the accumulated fatigue damage at the sealed part of the edge bond. By the estimation of the wind occurrence regularity based on wind pressure return period, the events of each wind speed interval during the whole life were obtained for the IGUs at 50m height in Beijing, which are in good agreement with the measured data. Also, the wind-induced deflection analysis method of IGUs based on the formula of airspace coefficient was proposed and verified as an improvement of the original stiffness distribution method with the average relative error compared to the test being about 3% or less. Combining the two methods above, the deformation of the outer and inner panes under wind loads during 30 years was precisely calculated, and the deflection and stress state at selected locations were obtained finally. The results show that the compression displacement at the secondary sealant under the maximum wind pressure is close to 0.3mm (strain 2.5%), and the IGUs are in tens of thousands of times the low amplitude tensile-compression cycle and several times to dozens of times the relatively high amplitude tensile-compression cycle environment. The approach proposed in this paper provides a basis for subsequent studies on the durability of IGUs and the wind-resistant behaviors of curtain wall structures.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.30 no.2 s.245
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• pp.153-160
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• 2006

A technique for measuring surface temperature field in micro scale is newly proposed, which uses temperature-sensitive fluorescent (TSF) dye coated on the surface and is easily implemented with a fluorescence microscope and a CCD camera. The TSF dye is chosen among mixtures of various chemical compositions including rhodamine B as the fluorescent dye to be most sensitive to temperature change. In order to examine the effectiveness of this temperature measurement technique, numerical analysis and experiment on transient conduction heat transfer for two different substrate materials, i. e., silicon and glass, are performed. In the experiment, to accurately measure the temperature with high resolution temperature calibration curves were obtained with very fine spatial units. The experimental results agree qualitatively well with the numerical data in the silicon and glass substrate cases so that the present temperature measurement method proves to be quite reliable. In addition, it is noteworthy that the glass substrate is more appropriate to be used as thermally-insulating locally-heating heater in micro thermal devices. This fact is identified in the temperature measuring experiment on the locally-heating heaters made on the wafer of silicon and glass substrates. Accordingly, this technique is capable of accurate and non-intrusive high-resolution measurement of temperature field in microscale.