• Journal of Institute of Control, Robotics and Systems
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• v.14 no.5
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• pp.444-452
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• 2008

This paper presents an overall image processing approach of defect inspection of patterned TFT-LCD panels for the real manufacturing process. A prototype of AOI(Automatic Optical Inspection) system which is composed of air floating stage and multi line scan cameras is developed. Adjacent pattern comparison algorithm is enhanced and used for pattern elimination to extract defects in the patterned image of TFT-LCD panels. New region merging algorithm which is based on border expansion is proposed to identify defects from the pattern eliminated defect image. Experimental results show that a developed AOI system has acceptable performance and the proposed algorithm reduces environmental effects and processing time effectively for applying to the real manufacturing process.

• 제어로봇시스템학회:학술대회논문집
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• 2000.10a
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• pp.171-171
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• 2000

We have developed m innovative surface inspection system for automated quality control for steel products in POSCO. We had ever installed the various kinds of surface inspection systems, such as a linear CCD and a laser typed surface inspection systems at cold rolled strips production lines. But, these systems cannot fulfill the sufficient detection and classification rate, and real time processing performance. In order to increase detection and classification rate, we have used the Dark, Bright and Transition Field illumination and area type CCD camera, and fur the real time image processing, parallel computing has been used. In this paper, we introduced the automatic surface inspection system and real time image processing technique using the Object Detection, Defect Detection, Classification algorithms and its performance obtained at the production line.

• Proceedings of the KIEE Conference
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• 2003.07d
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• pp.2453-2455
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• 2003

We propose a path planning method to reduce the inspection time of AOI (automatic optical inspection) machines in SMT (surface mount technology) in-line system. Inspection windows of board should be clustered to consider the FOV (field-of-view) of camera. The number of clusters is desirable to be minimized in order to reduce the overall inspection time. We newly propose a genetic algorithm to minimize the number of clusters for a given board. Comparative simulation results are presented to verify the usefulness of proposed algorithm.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.1
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• pp.150-155
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• 2013

This work present a new method of sealing inspection system for vehicle in which foam rubber materials are used for sealing the vehicle parts. This system is composed from a devices comprising non-contact and real-time scanning on visual inspection in machine parts. We have been investigated qualitative factors that influenced on sealing system of vehicle structure which flexibly attenuated vibration and plenty of foam rubber materials having elastic property. However, there are different factors which still depended on outdated technique (personnel subjective judgment) in the performance inspection of rubber parts, specially for cross section inspection. Through a newly developed inspection system which recently applied for the production line, we successfully achieved more effective results of matching rate by about 80 % in the sealing performance inspection with 0.7% to 1.4% in the repeated errors. These are resulted from non-contacted response by CCD camera and vision program using geometry matching method. We expect that this system may be widely applied in the strict inspection parts of more diverse cross-section in future.

• Journal of Institute of Control, Robotics and Systems
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• v.21 no.8
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• pp.788-793
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• 2015

This paper proposes a path planning algorithm to reduce the inspection time of AOI (Automatic Optical Inspection) machines for SMT (Surface Mount Technology) in-line system. Since the field-of-view of the camera attached at the machine is much less than the entire inspection region of board, the inspection region should be clustered to many groups. The image acquisition time depends on the number of groups, and camera moving time depends on the sequence of visiting the groups. The acquired image is processed while the camera moves to the next position, but it may be delayed if the group includes many components to be inspected. The inspection delay has influence on the overall job time of the machine. In this paper, we newly considers the inspection delay time for path planning of the inspection machine. The unified approach using genetic algorithm is applied to generates the groups and visiting sequence simultaneously. The chromosome, crossover operator, and mutation operator is proposed to develop the genetic algorithm. The experimental results are presented to verify the usefulness of the proposed method.

• International journal of advanced smart convergence
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• v.1 no.1
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• pp.57-60
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• 2012

In this paper, we have performed a safety analysis on an automotive evaporator inspection system. We performed the bi-directional analysis on the manufacturing line. Software Fault Tree Analysis (SFTA) as backward analysis and Software Failure Modes, Effects, & Criticality Analysis (SFMECA) as forward analysis are performed alternately to detect potential cause-to-effect relations. The analysis results indicate the possibility of searching and summarizing fault patterns for future reusability.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.286-289
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• 2007

We have developed an automated circuit defect inspection and repair method that can be used to improve the yield ratio of TFT-LCD. The method focuses on correcting resist patterns after the development process to ensure shape regularity. We built a prototype system and confirmed that the method is valid.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.946-949
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• 2005

This paper deals with the algorithm development that inspects defects such as Bright Defect Dots, Dark Defect Dots, and Line Defect caused by the process of LCD(Liquid Crystal Display). While most of LCD production process is automated, the inspection of LCD panel and its appearance depends on manual process. So, the quality of the inspection is affected by the condition of worker. Especially, the more LCD size increases, the more the worker feels fatigued, which causes the probability of miss judgement. So, the automated inspection is required to manage the consistent quality of the product and reduce the production costs. In this paper, to solve these problems, we developed the imaging processing algorithm to inspect the defects in captured image of LCD. Experimental results reveal that we can recognize various types of defect of LCD with good accuracy and high speed.

• Tunnel and Underground Space
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• v.16 no.4 s.63
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• pp.347-356
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• 2006

We analyzed case studies doing in-depth inspection of tunnel to maintain safety of existing tunnel in constructing new tunnel near to a existing tunnel with single track. Futhermore, We accomplished in-depth inspection of existing tunnel and numerical analysis. We suggested remedies to security safety of existing tunnel. We applied line drilling and pre-large hole boring method not to have an effect on existing tunnel and convinced the safety of existing tunnel from blast-vibration and blast-noise of numerical analysis. We planed to install basset system to measure displacement of existing tunnel according to excavating new tunnel.

• JSTS:Journal of Semiconductor Technology and Science
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• v.13 no.4
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• pp.402-409
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• 2013

An innovative application of voltage-contrast (VC) inspection allowed inline detection of NMOS leakage in dense SRAM cells is presented. Cell sizes of SRAM are continual to do the shrinkage with bit density promotion as semiconductor technology advanced, but the resulting challenges include not only development of smaller-scale devices, but also intra-devices isolation. The NMOS leakage caused by the underneath n+/P-well shorted to the adjacent PMOS/N-well was inspected by the proposed electron-beam (e-beam) scan in which VC images were compared during the in-line process step of post contact tungsten (W) CMP (Chemical Mechanical Planarization) instead of end-of-line electrical test, which has a long response time. A series of experiments based on the mechanism for improving the intra-well isolation was performed and verified by the inline VC inspection. An optimal process-integration condition involved to the tradeoff between the implant dosage and photo CD was carried out.