• Title/Summary/Keyword: insertion layer

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Organic Light-Emitting Diodes based on m-MTDATA as Hole Injection Layer

  • Kim, Jeong-Moon;Hwang, Hyun-Min;Park, Chin-Ho
    • 한국정보디스플레이학회:학술대회논문집
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    • 2003.07a
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    • pp.901-902
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    • 2003
  • Three-color organic light-emitting diodes (OLEDs) of metal-semiconductor-metal (MSM) structure have been favricated by using m-MTDATA [4,4',4"-tris (3-methylphenylphenylamino) triphenylamine] as hole injection layer(HIL). The mMTDATA is shown to be an effective hole injecting material, in that the insertion of mMTDATA greatly reduces the roughness of anode surface and improves the device performance. Red, green and blue OLEDs were fabricated, and their color coordinates in CIE chromaticity were found to be (0.600, 0.389), (0.240, 0.525), and (0.171, 0.171), respectively. The luminous efficiencies of the fabricated OLEDs were 1.4 lm/W at 106 $cd/m^{2}$ for red, 1.4 lm/W at 100 $cd/m^{2}$ for green, and 2.0 lm/W at 104 $cd/m^{2}$ for blue.

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Compact LTCC LPF Chip for Microwave Radar Sensor Applications

  • Lee, Young Chul
    • Journal of Sensor Science and Technology
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    • v.26 no.6
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    • pp.386-390
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    • 2017
  • A $5^{th}$-order low-pass filter (LPF) chip implemented in a six-layer low-temperature co-fired ceramic (LTCC) dielectric substrate has been presented. Lumped elements constituting the LPF are designed three-dimensionally in multilayers. In order to improve the parasitic and mutual coupling effects between them, the LPF is designed by sequentially integrating the three-dimensional (3D) lumped elements, by comparing it to the results of the schematic circuit and 3D electromagnetic (EM) analysis. The designed 3D LPF chip was fabricated in a six-layer LTCC substrate as small as $4.0{\times}3.22{\times}0.68mm^3$. The measured return and insertion losses are less than -11 dB and -0.61 dB, respectively, below 1.5 GHz.

A Low-Loss Patch LTCC 60 GHz BPF Using Double Patch Resonators

  • Lee, Young Chul
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2012.10a
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    • pp.570-572
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    • 2012
  • In this paper, a three-dimensional (3-D) low-loss and wide-band BPF based on low-temperature co-fired ceramic (LTCC) has been presented for mm-wave wireless communication applications. The proposed BPF is designed in a 6-layer LTCC substrate. The double patch resonators are fully integrated into the LTCC dielectrics and vertical via and planar CPW transitions are designed for interconnection between embedded resonators and in/output ports and MMICs, respectively. The designed BPF was fabricated in a 6-layer LTCC dielectric. The fabricated BPF shows a centre frequency (fc) of 53.23 GHz and a 3dB bandwidth of 14.01 % from 49.5 to 56.9 GHz (7.46 GHz). An insertion loss of -1.56 dB at fc and return losses below -10 dB are achieved. Its whole size is $4.7{\times}1.7{\times}0.684mm^3$.

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Effect of Interface Roughness on Magnetoresistance of[Ni/Mn] Superlattice-Based Spin Valves

  • J.R. Rhee;Kim, M.Y.;J.Y. Hwang;Lee, S.S.
    • Journal of Magnetics
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    • v.6 no.4
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    • pp.145-147
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    • 2001
  • The effect of interface roughness between [Ni/Mn] superlattice and pinned NiFe layer on magnetoresistance (MR) of [Ni/Mn] superlattice-based spin valve films was investigated. Antiferromagnetic phase structure and interface roughness of [Ni/Mn] superlattice spin valve films were compared in the as-deposited and the annealed samples at 240$\^{C}$, respectively. Surface morphology of spin valves was substantially flattened due to the formation of the antiferromatic NiMn phase. In case of Co insertion between Cu and NiFe, the interlace roughness and MR ratio in the annealed [NiMn] superlattice and pinned NiFe/Co layer increased more than those in the annealed [Ni/Mn] superlattice and pinned NiFe layers respectively.

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$LiNbO_3$ integrated optic devices with an UV-curable polymer buffer layer (고분자 버퍼층을 갖는 $LiNbO_3$ 집적 광디바이스)

  • Jeong, Woon-Jo;Kim, Seong-Ku;Kim, Dae-Joung;Kim, Jong-Uk;Park, Gye-Choon;Gu, Hal-Bon
    • Proceedings of the KIEE Conference
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    • 2002.11a
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    • pp.230-233
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    • 2002
  • A new lithium niobate optical modulator with a polymer buffer layer on Ni in-diffused optical waveguide is proposed for the fist time, successfully fabricated and examined at a wavelength of 1.3 ${\mu}m$. The experimental results show that the measured half-wave voltage is of ${\sim}10$ V and the total measured fiber-to-fiber insertion loss is of ${\sim}-6.4$ dB for a 40 mm long waveguide at a wavelength of 1.3 ${\mu}m$, respectively.

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Performance of the Phoneme Segmenter in Speech Recognition System (음성인식 시스템에서의 음소분할기의 성능)

  • Lee, Gwang-seok
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2009.10a
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    • pp.705-708
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    • 2009
  • This research describes a neural network-based phoneme segmenter for recognizing spontaneous speech. The input of the phoneme segmenter for spontaneous speech is 16th order mel-scaled FFT, normalized frame energy, ratio of energy among 0~3[KHz] band and more than 3[KHz] band. All the features are differences of two consecutive 10 [msec] frame. The main body of the segmenter is single-hidden layer MLP(Multi-Layer Perceptron) with 72 inputs, 20 hidden nodes, and one output node. The segmentation accuracy is 78% with 7.8% insertion.

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Performance improvements of organic solar cell using dual cathode buffer layers

  • Sachdeva, Sheenam;Kaur, Jagdish;Sharma, Kriti;Tripathi, S.K.
    • Current Applied Physics
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    • v.18 no.12
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    • pp.1592-1599
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    • 2018
  • The present study deals with the effect of dual cathode buffer layer (CBL) on the performance of bilayer of 4,4'-cyclohexylidenebis[N,N-bis(4-methylphenyl)benzenamine] (TAPC) and fullerene (C70)-based organic solar cell (OSC) with low donor concentration. OSC devices with CBLs have been fabricated using thermal vapor deposition technique. We report the use of lithium fluoride (LiF) and molybdenum trioxide ($MoO_3$) as CBLs. The insertion of LiF between C70 and aluminium (Al) electrode enhances the power conversion efficiency (PCE) of device from 1.89% to 2.47% but quenching of photogenerated excitons is observed at interface of C70 and LiF layers. Incorporation of $MoO_3$ between LiF and Al electrode further enhances PCE of device to 3.51%. This has also improved the material quality and device properties, by preventing the formation of gap states and diminishing exciton quenching.

Review of interface engineering for high-performance all-solid-state batteries (계면 제어를 기반으로 한 고성능 전고체 전지 연구)

  • Insu, Hwang;Hyeon Jeong, Lee
    • Journal of Industrial Technology
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    • v.42 no.1
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    • pp.19-27
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    • 2022
  • This review will discuss the effort to understand the interfacial reactions at the anode and cathode sides of all-solid-state batteries. Antiperovskite solid electrolytes have received increasing attention due to their low melting points and anion tunability which allow controlling microstructure and crystallographic structures of this material system. Antiperovskite solid electrolytes pave the way for the understanding relationship between critical current density and mechanical properties of solid electrolytes. Microstructure engineering of cathode materials has been introduced to mitigate the volume change of cathode materials in solid-state batteries. The hollow microstructure coupled with a robust outer oxide layer effectively mitigates both volume change and stress level of cathode materials induced by lithium insertion and extraction, thus improving the structural stability of the cathode and outer oxide layer, which results in stable cycling performance of all-solid-state batteries.

Improvement of Electrical and Mechanical Characteristics of Organic Thin Film Transistor with Organic/Inorganic Laminated Gate Dielectric (유연성 유기 박막트랜지스터 적용을 위한 다층 게이트 절연막의 전기적 및 기계적 특성 향상 연구)

  • Noh, H.Y.;Seol, Y.G.;Kim, S.I.;Lee, N.E.
    • Journal of the Korean institute of surface engineering
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    • v.41 no.1
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    • pp.1-5
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    • 2008
  • In this work, improvement of mechanical and electrical properties of gate dielectric layer for flexible organic thin film transistor (OTFT) devices was investigated. In order to increase the mechanical flexibility of PVP (poly(4-vinyl phenol) organic gate dielectric, a very thin inorganic $HfO_2$ layers with the thickness of $5{\sim}20nm$ was inserted in between the spin-coated PVP layers. Insertion of the inorganic $HfO_2$ in the laminated organic/inorganic structure of PVP/$HfO_2$/PVP layer led to a dramatic reduction in the leakage current compared to the pure PVP layer. Under repetitive cyclic bending, the leakage current density of the laminated PVP/$HfO_2$/PVP layer with the thickness of 20-nm $HfO_2$ layer was not changed, while that of the single PVP layer was increased significantly. Mechanical flexibility tests of the OTFT devices by cyclic bending with 5 mm bending radius indicated that the leakage current of the laminated PVP/$HfO_2$(20 nm)/PVP gate dielectric in the device structure was also much smaller than that of the single PVP layer.

Effect of a 3C-SiC buffer layer on SAW properties of AlN films (3C-SiC 버퍼층이 AlN 박막형 SAW 특성에 미치는 영향)

  • Hoang, Si-Hong;Chung, Gwiy-Sang
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.235-235
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    • 2009
  • This paper describes the influence of a polycrystalline (poly) 3C-SiC buffer layer on the surface acoustic wave (SAW) properties of poly aluminum nitride (AlN) thin films by comparing the center frequency, insertion loss, the electromechanical coupling coefficient ($k^2$), andthetemperaturecoefficientoffrequency(TCF) of an IDT/AlN/3C-SiC structure with those of an IDT/AlN/Si structure, The poly-AlN thin films with an (0002)-preferred orientation were deposited on a silicon (Si) substrate using a pulsed reactive magnetron sputtering system. Results show that the insertion loss (21.92 dB) and TCF (-18 ppm/$^{\circ}C$) of the IDT/AlN/3C-SiC structure were improved by a closely matched coefficient of thermal expansion (CTE) and small lattice mismatch (1 %) between the AlN and 3C-SiC. However, a drawback is that the $k^2(0.79%)$ and SAW velocity(5020m/s) of the AlN/3C-SiC SAW device were reduced by appearing in some non-(0002)AlN planes such as the (10 $\bar{1}$ 2) and (10 $\bar{1}$ 3) AlN planes in the AlN/SiC film. Although disadvantages were shown to exist, the use of the AlN/3C-SiC structure for SAW applications at high temperatures is possible. The characteristics of the AlN thin films were also evaluated using FT-IR spectra, XRD, and AFM images.

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