• Journal of Korean Society of Water and Wastewater
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• v.23 no.5
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• pp.599-608
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• 2009

This manuscript covers the results of field investigation and lab-scale experiments to design a double-layered biofilter system to control urban storm runoff. The biofilter system consisted of a coarse soil layer (CSL) for filtration and fine soil layer (FSL) for adsorption and biological degradation. The variations of flow rate and water quality of runoff from a local expressway were monitored for seven storm events. Laboratory column experiments were performed using seven kinds of soil and mulch to maximize pollutants removal. The site mean concentration (SMC) of storm runoff from the drainage area (runoff coefficient: 0.92) was measured to be 203 mg/L for SS, 307 mg/L for $TCOD_{Cr}$, 12.3 mg/L for TN, 7.3 mg/L for ${NH_4}^+-N$, and 0.79 mg/L for TP, respectively. This study employed a new design concept, to cover the maximum rainfall intensity with one month recurrence interval. Effective storms for last ten years (1998-2007) in seoul suggested the design rainfull intensity to be 8.8 mm/hr Single layer soil column showed the maximum removal rate of pollutants load when the uniformity coefficient of CSL was 1.58 and the silt/clay contents of FSL was virtually 7%. The removal efficiency during operation of double layer soil column was 98% for SS and turbidity, 75% for TCODCr, 56% for ${NH_4}^+-N$, 87% for TP, and 73-91% for heavy metals. The hydraulic conductivity of the soil column, 0.023 cm/sec, suggested that the surface area of the biofilter system should be about 1% of the drainage area to treat the rainfall intensity of one month recurrence interval.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.8 s.239
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• pp.948-955
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• 2005

A three-dimensional computation was conducted to understand effects of the inlet boundary layer thickness on the internal flow in a low-speed axial compressor operating at the design condition($\phi=85\%$) and near stall condition($\phi=65\%$). At the design condition, the flows in the axial compressor show, independent of the inlet boundary layer thickness, similar characteristics such as the pressure distribution, size of the hub comer-stall, tip leakage flow trajectory, limiting streamlines on the blade suction surface, etc. However, as the load is increased, the hub corner-stall grows to make a large separation region at the junction of the hub and suction surface for the inlet condition with thick boundary layers at the hub and casing. Moreover, the tip leakage flow is more vortical than that observed in case of the thin inlet boundary layer and has the critical point where the trajectory of the tip leakage flow is abruptly turned into the downstream. For the inlet condition with thin boundary layers, the hub corner-stall is diminished so it is indistinguishable from the wake. The tip leakage flow leans to the leading edge more than at the design condition but has no critical point. In addition to these, the severe reverse flow, induced by both boundary layer on the blade surface and the tip leakage flow, can be found to act as the blockage of flows near the casing, resulting in heavy loss.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.73-73
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• 2000

Shear strength of BGA solder joints on Cu pad was studied for Cu-contained Sn n.5 a and 2.5wt.% Cu) and Sn-Pb (o.5wt.% Cu) solders, with emphasis on the roles of the C Cu-Sn intermetallic layer thickness and the roughness of the interface between the i intermetallic layer and solder. The shear strength test was performed both for a as-soldered s이der joints with soldering reaction times of 1, 2, 4 min and for aged s이der j joints at 170 C up to 16 days. The Cu addition to both pure Sn and eutectic Sn-Pb s solders increased the intermetallic layer thickness at both soldering and aging t temperatures. The Cu addition also resulted in changes in the roughness of the interface b between the intermetallic layer and solder at as-soldered states. With increasing Cu c content. the interface roughened for Sn-Cu solders whereas it flattened for Sn-Pb-Cu s solders. The shear fractures in all solder joints investigated were confined in the bulk s solder rather than through the intermetallic layer. Therefore, the effect of Cu content in s solders on the shear strength of the solder joints was primarily attributed to its i influence on the micros$\sigma$ucture of bulk solder, such as the size and spatial distributions of CU6Sn5 precipitates. In addition, the critical intermetallic layer thickness for a m maximum shear strength seemed to depend on the Cu content in bulk solder.older.

• KOREAN JOURNAL OF CROP SCIENCE
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• v.50 no.6
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• pp.442-446
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• 2005

This study was conducted to obtain basic information on the utilization of wheat flour for good organoleptic evaluation score. Wheat seed was milled by Buhler test mill. Volatile flavor compounds of five milling fractions such as Break $I{\cdot}II (B_1+B_2)$, Reduction I ($R_1$), Reduction II ($R_2$), Bran and Short were determined and their differences were discussed. There was significant difference in quantity of flavor compounds but no difference in qualitative composition among milling fractions. The outer layer of wheat endosperm ($R_2$ layer) showed higher amount of m-xylene and n-butanol in volatile flavor com­pounds compared with inner endosperm layer ($B_1,\;B_2,\;R_1$). The $R_2$ layer showed quantitatively higher composition of major flavor compounds than inner endosperm layer ($B_1,\;B_2,\;R_1$). This result points out that the $R_2$ layer exhibited stronger flavor than $B_1,\;B_2$, and Rl layers.

• Informatization Policy
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• v.25 no.4
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• pp.108-120
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• 2018

With the rise of the Fourth Industrial Revolution and I-Korea 4.0, both of which pursue strategies for industrial innovation and for the solution to social problems, the real estate industry needs to change in order to make effective use of available space in smart environments. The implementation of smart spaces is a promising solution for this. The smart space is defined as a good use of space, whether it be a home, office, or retail store, within a smart environment. To enhance the use of smart spaces, efficient decision-making and well-timed and accurate interaction are required. This paper proposes a smart space based on platform which takes advantage of emerging technologies for the efficient storage, processing, analysis, and utilization of big data. The platform is composed of six layers - collection, transfer, storage, service, application, and management - and offers three service frameworks: activity-based, market-based, and policy-based. Based on these smart space services, decision-makers, consumers, clients, and social network participants can make better decisions, respond more quickly, exhibit greater innovation, and develop stronger competitive advantages.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2002.10b
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• pp.153-154
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• 2002

Wear map of silver coatings on AISI 52100 has been constructed to delineate the wear transition behavior with the change in operating conditions in various environments. Three main regimes were clearly identified: (i) elastic/plastic deformation of silver coating without failure. (ii) mild wear regime after initial failure of silver coating and (iii) severe wear regime. In the mild wear regime, the contact surfaces were covered with transfer layers of agglomerated wear particles. The transfer layer acted as a protective layer and resulted in low friction even after the initial failure of the coated films, whose characteristics were strongly dependent on both the operating and environmental conditions. Also, the existence of the critical sliding speed, above which no transfer layer was able to form, was discussed in the work.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.154-154
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• 2009

Cr capping layer를 이용하여 Titanium germanide의 열적 안정성을 향상시키는 연구를 수행하였다. n-type Ge(100) 기판 위에 전자빔 증착기를 이용하여 30nm 두께의 Ti와 Cr capping layer를 증착하고 $400\;^{\circ}C$에서 $800\;^{\circ}C$까지 30초간 N2 분위기로 급속 열처리하여 Ti germanide를 형성하였다. XRD결과로부터 Cr capping layer의 유무에 관계 없이 Ti germanide가 형성된 것을 관찰할 수 있었다. Ge 기판 위에 CTLM 패턴을 형성하고 실험을 진행하여 Ti germanide의 I-V 측정 데이터를 통해 Ohmic 특성을 알아보았고, contact resistance, sheet resistance, specific contact resistance를 구하였다.

• Journal of Korean Vacuum Science & Technology
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• v.6 no.1
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• pp.51-54
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• 2002

Polymer EL devices of glass/ITO/PI/MEH-PPV/Al structure were fabricated using spin coating and the Ionized Cluster Beam deposition technique. PMDA-ODA type thin polyimide films which can be used as a impurity blocking layer of EL device were deposited by ICB. According to our previous results, the packing densities of polyimide films were subject to change and depend on their deposition condition. By inserting a Pl layer with various thickness and packing density, I-V characteristics and life time of the devices were investigated to determine the role of a interlayer. The blocking of impurity diffusion from ITO to luminescent layer were confirmed by XPS.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.10a
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• pp.215-222
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• 2007

Coating of Hot-dip galvannealed steel consists of various Fe-Zn intermetallic compounds. Since the coating is hard and there for is very brittle, the surface of steel sheet is easy to be ruptured during second manufacturing processing. This is called as powdering. In addition, forming equipment might be polluted with debris by powdering. Therefore, various research have been carried out to prohibit powdering fur improving the quality of GA steel. This paper carried out finite element analysis combined with damage model which simulate the failure of local layer of hot-dip galvannealed steel surface during v-bending test. Since the mechanical property of intermetallic compound was unknown exactly, we used the properties calculated from measurements. The specimen was divided into substrate, coating layer and interface layer. Local failure at coating layer or interface layer was simulated when elemental strain reached a prescribed strain.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.465-465
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• 2013

Inorganic 물질인 SiO2 dielectric 위에 organic dielectric PVP (4-vinyphenol)를 spin coating으로 올려, inorganic/organic dielectric 형태의 double layer구조로 High-performance amorphous indiumgallium zinc oxide thin-film transistors (IGZO TFT)를 제작하여 보았다. SiO2 dielectric을 buffer layer로 80 nm, PVP는 10Wt% 400 nm로 구성하였으며, 200 nm single SiO2 dielectric과 동일한 수준의 leakage current 특성을 MIM Capacitor 구조를 통해서 확인할 수 있었다. 이 소자의 장점은 용액공정의 도입으로 공정 시간의 단축 및 원가 절감을 이룰 수 있으며, dielectric과 channel 사이의 균일한 interface의 형성으로 interface trap 개선 및 Yield 향상의 장점을 갖는다. 우리는 실험을 통해서 SiO2 buffer layer가 수직 electric field에 의한 leakage current을 제어하고, PVP dielectric은 interface를 개선하는 것을 확인하였다. Vth의 negative shift 및 slope의 향상으로 구동전압이 줄어들고, 균일한 I-V Curve 형성을 통해서 Process Yield의 향상을 확인하였다.