• Proceedings of the KSME Conference
• /
• 2007.05b
• /
• pp.2512-2517
• /
• 2007

Effect of natural convention for hot plate surface temperature uniformity was studied by experiments that were adjusted height of chamber and temperature difference. The hot plate chamber is composed of the hot plate and the upper heater and adiabatic vertical wall. The hot plate diameter is 220mm and maintains temperature at $150^{\circ}C$. Flow pattern compares with surface temperature and confirms that natural convection affects on temperature uniformity of hot plate surface. In case, temperature non-uniformity of hot plate surface is due to heater pattern, lots of weak and small flow cells more improve temperature uniformity than stronger flow cells or non-developing flow cell. Improve temperature uniformity $1.2^{\circ}C$ when developing weak and small flow cells.

• Journal of the Semiconductor & Display Technology
• /
• v.15 no.2
• /
• pp.74-80
• /
• 2016

This study presents a thermal device specially designed for thermal nanoimprint lithography equipments, which requires the capability of rapid heating and cooling, high temperature uniformity and the material strength to endure high stamping pressure. The proposal to meet these requirements is a planar-type hot plate extensible to a large area, in which long circular cartridge heaters and heat pipes are installed inside in parallel. The heat pipes are connected to the outside water cooling chamber. A hot plate made of stainless steel is fabricated with a dimension $240mm{\times}240mm{\times}20mm$. Laboratory experiments are conducted to examine the thermal performance of the hot plate. The results illustrate that the employment of heat pipes leads to a notable enhancement of temperature uniformity in the device and provides an efficient heat delivery from the hot plate to outside. It is verified that the suggested hot plate could be a feasible thermal tool for thermal nanoimprint lithography, satisfying the major design requirements.

• The Korean Journal of Pharmacology
• /
• v.18 no.2
• /
• pp.45-50
• /
• 1982

Yeum et al. formulated a new hot-plate method using the threshold temperature, and there are some controversies on the effects of naloxone and diazepam on the antinociceptive action. In this paper, the comparison of three methods registering analgesic activity and the application of the new hot-plate method formulated by Yeum et al. on the study of the influences of naloxone and diazepam on the analgesic effect of morphine were tried in male mice. The results obtained were summarized as follows; 1) The least-square regression lines of the morphine analgesia plotted against log-dose showed the correlation coefficient of above 0.90, but the competitive antagonism produced by naloxone (0.1 mg/kg) against the analgesia was more prominently demonstated by the new hot-plate method than the other methods: original hot-plate method and electrical stimulation method. 2) In the experiment using the new hot-plate method, the log dose-response curve of morphine (y=7.30 x+49.80, r=0.998) was shifted to the right by the pretreatment of naloxone (0.1 mg/kg), but was slightly shifted to the left by the pretreatment of diazepam (2.5 mg/kg). This study suggests that for the analgesia experiment, the new hot-plate method is superior to the original hot-plate method or the electrical stimulation method, and that the potentiative effect of diazepam on the morphine anagesia is not significant.

• Proceedings of the KSME Conference
• /
• 2008.11b
• /
• pp.2369-2374
• /
• 2008

In the precision hot plate for wafer processing, the temperature uniformity of upper plate surface is one of the key factors affecting the quality of wafers. Precision hot plates require temperature variations less than ${\pm}1.5%$ during heating to $120^{\circ}C$. In this study, we have manufactured the flat plate heat pipe hot chuck of circle type(300mm) and investigated the operating characteristics of flat plate heat pipe hot chuck experimentally. Various liquids(aceton, FC-40, water) were used as the working fluid and charging ratio was changed($14{\sim}36\;vol.%$). Several cases were tested to improve temperature uniformity. Major working fluid to be investigated was water. Using water, various parameters such as charging ratio, wafer operation on-off time, different working fluids. In case of water, the temperature uniformity was ${\pm}1.5%$, response time of wafer were investigated.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.6
• /
• pp.1150-1155
• /
• 1992

The cooling characteristics of a hot steel plate by a laminar impinging water bar were investigated experimentally. The dynamic parameters investigated were nozzle height L between nozzle and the hot plate, flow rate Q, and initial cooling temperature. Because the boiling phenomena on a hot steel plate are unsteady and change discontinuously, it is difficult to analyze the cooling characteristics directly. In this study the cooling efficiency was estimated by using the temperature decay rates and expansion speed of the water cooling zone. Temperature in the water cooling zone decreased rapidly and the radius of the water cooling zone expanded nearly in proportion to square root of the cooling time. With increasing initial temperature of a hot steel plate, the cooling efficiency became descendent. The cooling curve in the case of L/D = 30 showed the largest temperature decay rate and excellent cooling performance.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2001.04a
• /
• pp.566-569
• /
• 2001

Hot Plate is the major unit that it used to remove damp of wafer surface, to strength adhesion of photoresist(PR) and to bake coated PR in FAB process of semiconductor. It is necessary to guarantee the performance of Hot Plate(HP). Therefore, in this study designed and developed the reliability system of HP to measure and estimated thermal uniformity and flatness in temperature setting amplitude $0~250^{\circ}C$. We developed the techniques that measures and analyzes thermal uniformity using infrared thermal vision, and compensates measuring error of flatness using laser displacement sensor. For measuring flatness, we specially makes the measurement stage of 3 axes which adopts the precision encoder. The allowable error of measuring technique is less than thermal uniformity, $\pm 0.1^{\circ}C$ and flatness, $\pm 1mm$. It is expected that the developed system can measure from $\Phi$210(wafer 8") to $\Phi$356(wafer 12") and also can be used in performance test of the Cool Plate and industrial heater, etc.

• Transactions of Materials Processing
• /
• v.17 no.2
• /
• pp.107-112
• /
• 2008

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the size of residual stress region was expanded. The gradient of residual stress within the plate was reduced during the leveling process. But the residual stress itself was not removed completely within the ranges of tested conditions. The exact camber of cut plate was able to be predicted by the measurement of residual stress distribution after leveling of the plate.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.10a
• /
• pp.112-115
• /
• 2007

In order to investigate the residual stress evolution during the leveling process of hot rolled high strength coils for cold forming, the in-plane residual stress of plate sampled at SPM, rough leveler and finish leveler were measured by cutting method. Residual stress was localized near the edge of plate. As the thickness of plate was increased, the region with residual stress was expanded. The gradient of residual stress within plate was reduced during the leveling process. But the residual stress itself was not removed at the ranges of tested conditions. From the measured residual stress distribution within the plate, camber of plate cut to small width was predicted exactly within error range of experiment.

• Transactions of Materials Processing
• /
• v.20 no.4
• /
• pp.316-323
• /
• 2011

The hot curvature-forming of large aluminum thick plate using a grid-typed hybrid die is a process for the production of a spherical LNG tank. Many variables such as the initial die surface quality, grid size, grid thickness, size of blank plate and cooling line design, control the success of the process. In addition, the plate used in this process is generally larger than $10{\times}10m$ in size. Thus, it is very difficult to predict the surface characteristics of the plate during forming and to measure the different parameters due to the high cost of the experiments. In order to optimize the process design for the grid-type die, the development of an analytical method to predict the surface characteristics of the final product in hot curvature-forming is needed. This paper described the development of the method and procedures for FE simulations of the hot curvature-forming process, including hot forming, air flow, cooling, and thermal deformation analyses. An experiment for a small scale model of the process was conducted to check the validity of the numerical method. The results showed that the curvature of the plate in the analysis agrees well with that of the experiment within 0.037 and 0.016% tolerance margins for its side and corner, respectively.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
• /
• v.28 no.12
• /
• pp.477-482
• /
• 2016

Airtight containers have been widely used in many industries and household. They need a packing for sealing between the inside and outside. Previous packing materials have some drawbacks like stench, stickiness, and difficulty of applying to automated manufacturing systems. So, a new packing material which is harmless and suitable for automation is needed. This study performed a hot plate welding process of thermoplastic elastomer (TPE) as the packing material. The hot plate welding process included a phase change process of solidification and melting. The porosity-enthalpy method was adopted in order to simulate phase change problems. The TPE showed non-Newtonian fluid characteristics during the melting process. Since properties of SEBS are not well-defined, we established TPE properties by observing the melting behavior of TPE. In order to find an optimized condition, a parametric study including packing thickness, shapes, hot plate temperature, and thermal resistance, was conducted.