• 한국재료학회지
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• 제24권11호
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• pp.617-624
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• 2014

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of $Cu_2O$ or $Cu(OH)_2$ layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

• 반도체디스플레이기술학회지
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• 제2권3호
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• pp.7-11
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• 2003

In this research, the etching characteristics of via contact and deep contact hole have been studied using multi-pole inductively coupled plasma(MICP) etching system. We investigated Plasma density of MICP source using the Langmuir probe and etching characteristics with RF frequency, wall temperature, chamber gap, and gas chemistry containing Carbon and Fluorine. As the etching time increases, formation of the polymer increases. To improve the polymer formation, we controlled the temperature of the reacting chamber, and we found that temperature of the chamber was very effective to decrease the polymer thickness. The deep contact etch profile and high selectivity(oxide to photoresist) have been achieved with the optimum mixed gas ratio containing C and F and the temperature control of the etching chamber.

• E2M - 전기 전자와 첨단 소재
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• 제8권1호
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• pp.64-70
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• 1995

We discussed the thermal analysis for a recording media with the variation of the laser pulse duration, the laser power and the temperature distribution in order to optimize the Te-based antireflection structure from the computer calculations. In the case that the radial heat diffusion is negligible, we can calculate the maximum temperature of the recording layer at the center of the spot by the Simple Model. The temperature profile of the recording layer is obtained from the Numerical Model by considering the total specific heat and the latent heat. As a result, the effect of the heat sinking acting as a thermal loss for the hole formation could be minimized by introducing the pulse with the hole formation duration(.tau.) below the thermal time constant(.tau.$_{D}$) of a dielectric layer. These requirments can be satisfied by using the dielectric thickness of the 2nd ART(Anti-Reflection Trilayer) condition or the dielectric materials with a low thermal diffusivity.y.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2002년도 International Meeting on Information Display
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• pp.762-765
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• 2002

The bilayer organic light-emitting diode using Al (DBM) $_3$ (DBM=Dibenzoylmethane) as an emitting material and poly (N-vinylcarbazole) (PVK) as hole-transport material, emitted bright blue-green light instead of blue light. The blue-green emission is attributed to exciplex formation at the solid interface between Al (DBM) $_3$ and the hole-transport material. The exciplex formation was evidenced by the measurement of the photoluminescence spectra and lifetimes of Al (DBM) $_3$, PVK and an equimolar amount of mixture of Al (DBM) $_3$ and PVK.

• 천문학회보
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• 제41권1호
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• pp.68.1-68.1
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• 2016

Binary black hole mergers are one of the important candidate of gravitational wave (GW) emission. Recently a successful GW observation was done by LIGO team, but it is still uncertain how many GW signals will be observable. In this research, we perform simplified N-body simulations containing three mass components, ordinary stars with two kind of stellar mass black holes. Various BH compositions are tested to investigate the effect of BH mass function on binary formation rate. As a result, we find the binary formation rate is not much affected by BH mass function and always around 30 %, but the detectable merging binaries are largely depend on higher mass BH population.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1994년도 춘계학술대회 논문집
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• pp.123-126
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• 1994

We discussed the thermal analysis for recording media with the variation of the laser pulse duration and the power and the temperature distribution for the optimized Te-based antireflection structure by using the computer calculations. If the radial diffusion of heat is negligible, we can calculate the maximum temperature at the spot center in recording layer by Simple Method, and the temperature profile considering the specific heat and the latent heat by Numerical Method. As a result, the effect of the heat sinking which acted as a loss for the hole formation can be minimized by introducing the pulse of the hole formation duration( $\tau$ ) shorter than the thermal time constant( $\tau$$\sub$D/) of dielectric layer. This requirments can be satisfied as using the dielectric thickness of the 7nd ART condition or the dielectric materials with low thermal diffusivity.

• Journal of Welding and Joining
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• 제25권2호
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• pp.24-30
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• 2007

• 대한기계학회:학술대회논문집
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• 대한기계학회 2001년도 춘계학술대회논문집D
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• pp.489-496
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• 2001

Two perforated plates are used to investigate local heat/mass transfer characteristics in an impingement/effusion cooling system. A naphthalene sublimation method is conducted to determine the local heat/mass transfer coefficients on the upward facing surface of the effusion plate. The two plates are placed in parallel position with gap distances of 1, 2, 4 and 6 times of effusion hole diameter. The effects of hole arrangements of the plates are studied for staggered, square, and hexagonal arrays. The experiments are conducted at Reynolds number of 10,000 based on the effusion hole diameter. The results show that the smaller hole size in the staggered array has the higher transfer coefficients on the stagnation region due to the formation of higher momentum flows through the impingement holes. In the square array, heat/mass transfer on the target plate is more uniform as the number of impingement holes increases. High and uniform heat/mass transfer coefficients are obtained in the hexagonal array.

• 화약ㆍ발파
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• 제26권1호
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• pp.57-66
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• 2008

발파에서 특정한 방향으로 균열 성장을 제어하는데 장약공 노치가 유효하다는 연구결과가 발표되어오고 있다. 본 연구에서는 장약공의 노치가 파단면 형성에 미치는 영향을 살펴보기 위하여 일반 장약공과 노치 장약공에 의한 파단면의 표면을 비교하였다. 암석시편에 노치를 형성하기 위하여 노치비트시스템이 적용되었다. 파단면의 표면은 디지털 영상 계측법을 적용하여 DEM 모델로 재구성하고, 표면 거칠기 지수를 사용하여 파단면의 거칠기를 평가하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 금형가공,미세가공,플라스틱가공 공동 심포지엄
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• pp.193-197
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• 2005

This paper presents a method by which multiple holes of ultra small size can be punched simultaneously. Silicon wafers were used to fabricate punching die. Workpiece used in the present investigation were the rolled pure copper of $3{\mu}m$ in thickness and CP titanium of $1.5{\mu}m$ in thickness. The metal foils were punched with the dies and arrays of circular and rectangular holes were made. The diameter of holes ranges from $2-10{\mu}m$. The process set-up is similar to that of the flexible rubber pad forming or Guerin process. Arrays of holes were punched successfully in one step forming. The punched holes were examined in terms of their dimensions, surface qualities, and potential defect. The effects of the die hole dimension on ultra small size hole formation of the thin foil were discussed. The optimum process condition such as proper die shape and diameter-thickness ratio (d/t) were also discussed. The results in this paper show that the present method can be successfully applied to the fabrication of ultra small size hole array in a one step operation.