• Title/Summary/Keyword: high-power LED

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200[W] Half-Bridge LLC Series Resonant Converter for driving LED Lamp (LED 조명장치 구동용 200[W]급 하프브리지 LLC 직렬공진형 컨버터)

  • Han, Woo-Yong;Park, Hyo-Sik
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.11 no.11
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    • pp.4483-4488
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    • 2010
  • In comparison with some other light sources, LED has merits such as long lifetime, pollution free, and high energy efficiency. Lately, due to development of LED with high brightness and capacity, LED, which has been applied in display system only, has applied in the field of lighting system. Driving current of power LED has to be controlled below the designed value. In this paper, half-bridge LLC series resonant converter, which has the current limiting function, has been described. Half-bridge LLC series resonant converter allows in relatively wide input voltage and output load range when compared to the other resonant converter. Also, it is possible to reduce a magnetic component, because leakage inductance of transformer is used as a resonant inductance. It has been validated by designing and testing 200[W] half-bridge LLC converter of DC24[V] output voltage for LED lamp driver, which includes a current limiting function and power factor correction(PFC) function.

Influence of Bath Temperature on Electroless Ni-B Film Deposition on PCB for High Power LED Packaging

  • Samuel, Tweneboah-Koduah;Jo, Yang-Rae;Yoon, Jae-Sik;Lee, Youn-Seoung;Kim, Hyung-Chul;Rha, Sa-Kyun
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.02a
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    • pp.323-323
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    • 2013
  • High power light-emitting diodes (LEDs) are widely used in many device applications due to its ability to operate at high power and produce high luminance. However, releasing the heat accumulated in the device during operating time is a serious problem that needs to be resolved to ensure high optical efficiency. Ceramic or Aluminium base metal printed circuit boards are generally used as integral parts of communication and power devices due to its outstanding thermal dissipation capabilities as heat sink or heat spreader. We investigated the characterisation of electroless plating of Ni-B film according to plating bath temperature, ranging from $50^{\circ}C$ to $75^{\circ}C$ on Ag paste/anodised Al ($Al_2O_3$)/Al substrate to be used in metal PCB for high power LED packing systems. X-ray diffraction (XRD), Field-Emission Scanning Electron Microscopy (FE-SEM) and X-ray Photoelectron Spectroscopy (XPS) were used in the film analysis. By XRD result, the structure of the as deposited Ni-B film was amorphous irrespective of bath temperature. The activation energy of electroless Ni-B plating was 59.78 kJ/mol at the temperature region of $50{\sim}75^{\circ}C$. In addition, the Ni-B film grew selectively on the patterned Ag paste surface.

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Analysis of the thermal management of a high power LED package with a heat pipe

  • Kim, Jong-Soo;Kim, Eun-Pil
    • Journal of Advanced Marine Engineering and Technology
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    • v.40 no.2
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    • pp.96-101
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    • 2016
  • The thermal management of high-power LED components in an assembly structure is crucial for the stable operation and proper luminous function. This study employs numerical tools to determine the optimum thermal design in LEDs with a heat sink consisting of a crevice-type vapor-chamber heat pipe. The effects of the MCPCB are investigated in terms of the substrate thicknesses on which the LEDs are mounted. Further, different placement configurations in a system module are considered. This study found that for a confined area, a power of 40 W/LED is applicable to a high-power package. Furthermore, the thermal conductivity of dielectric layer materials should ideally be greater than 0.9 W/m.K. The temperature conditions of the vapor chamber in a heat pipe greatly affect the thermal performance of the system. At an offset distance of 9.0 mm and a $2^{\circ}C$ increase in the temperature of the heat pipe, the resulting maximum temperature increase is approximately $1.9^{\circ}C$ for each heat dissipation temperature. Finally, at a thermal conductivity of 0.3 W/m.K, it was found that the total thermal resistance changes dramatically. Above 1.2 W/m.K, the resistance change reduces exponentially.

Development of Current Control System Appropriate to a Big-Capacity LED Lamp using Microprocessor (마이크로 프로세서를 이용한 대용량 LED 등기구에 적합한 전류제어 시스템 개발)

  • Park, InKyoo;Lee, WanBum
    • The Journal of the Institute of Internet, Broadcasting and Communication
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    • v.15 no.4
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    • pp.191-198
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    • 2015
  • The purpose of this study is to develope a current variation control system appropriate to the various LED(Light Emitting Diode) lamps using current control system equipped with microcontroller based voltage regulator of power driving circuit. For this, we will suggest a stable control system of current variation to enable a stable power-supply and current-control, consisting of circuit to minimize the affects on the LED forward voltage using variable resistance and compensating resistance. The method of constant current circuit and energy savings using microcontroller based voltage regulator suggested in this study can be applied to various a big capacity LED lamp to minimize the unnecessay heat generation and to control resistace delicately. Ultimately, we expect the results of this study will upgrade the reliability of LED lamp by supplying the current stably.

Optimization of Thermal Performance in Nano-Pore Silicon-Based LED Module for High Power Applications

  • Chuluunbaatar, Zorigt;Kim, Nam-Young
    • International Journal of Internet, Broadcasting and Communication
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    • v.7 no.2
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    • pp.161-167
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    • 2015
  • The performance of high power LEDs highly depends on the junction temperature. Operating at high junction temperature causes elevation of the overall thermal resistance which causes degradation of light intensity and lifetime. Thus, appropriate thermal management is critical for LED packaging. The main goal of this research is to improve thermal resistance by optimizing and comparing nano-pore silicon-based thermal substrate to insulated metal substrate and direct bonded copper thermal substrate. The thermal resistance of the packages are evaluated using computation fluid dynamic approach for 1 W single chip LED module.

Wireless Digital Signal Transmission using Visible Light Communication with High-Power LEDs

  • Ng, Xiao-Wei;Chung, Wan-Young
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2010.10a
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    • pp.139-140
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    • 2010
  • This paper presents an indoor prototype for wireless digital signal transmission using Visible Light Communications (VLC) in which high power Light Emitting Diode (LED) is used. Using low cost and off-the-shelf components, the transmitter module is constructed using an AVR Atmega128 microcontroller and commercial white beam LEDs. Modulating the light intensity of the LED enables digital signals to be transmitted across the optical link. The receiver module employs a high speed PIN photodetector for optical signal detection and a recovery circuit for optical-electro signal conversion. By sending digitalized data via VLC technology, many applications can be realized in the areas of consumer advertising, traffic safety information and disaster control.

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Modeling and Analysis of Radiation Patterns of High Power LED Package for Luminarie (루미나리에(Luminarie)용 고출력 LED패키지 배광분포 모델링 및 광학적 특성 분석)

  • Cho, Jae-Moon;Kim, Byung-Il;Kwak, Joon-Seop;Yoon, Dong-Joo;Yu, Jin-Yeul
    • Korean Journal of Optics and Photonics
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    • v.18 no.4
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    • pp.264-269
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    • 2007
  • Today's research has been focused on changing the light source from filament to LED for luminarie illumination to overcome the shortcoming of a filament. The purpose of this research is to make an appropriate high power LED package structure for luminarie. We simulated radiation patterns of the various structures by the ray tracing simulator (Light Tools), and also analyzed the radiation patterns using an LED test system (OL770). As we increased an inner reflector angle, the radiation pattern split into two peaks and the angle between two peaks became larger. In addition, when we increased an outer reflector angle, the angle between side peaks gradually decreased, while it increased again when the angle reach $50^{\circ}$. These results could be understood from the ray tracing of the light reflected from two reflectors. We made the high power LED package for luminarie on the condition of the optimized structure which was made by ray tracing simulation results, and we measured the radiation patterns by using an LED test system, and these results were well matched to the simulation results.

Comparison of Radiation Characteristics and Radiant Quantities per unit Electrical Power between High Luminance Light Emitting Diode and Fishing Lamp light Source (고휘도 발광다이오우드와 집어등 광원의 방사특성 및 단위 전력당 방사량 비교)

  • Choi, Sok-Jin
    • Korean Journal of Fisheries and Aquatic Sciences
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    • v.41 no.6
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    • pp.511-517
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    • 2008
  • The radiation characteristics and economic efficiency of high - luminance light - emitting diodes (LEDs), a metal halide lamp, and a halogen lamp were studied to evaluate their potential as an energy-saving light source for fishing lamps. The wavelengths at which irradiance was maximum were 709, 613, 473, 501, 525, 465, 578, and 973 nm for red, orange, blue, peacock blue, green, and white LEDs, the metal halide lamp, and the halogen lamp, respectively. If the irradiance characteristics at 300-1,100 nm wavelengths are set as 100%, the irradiance rates at 381-780 nm were 99-78%, 82%, and 24% for the LEDs, metal halide lamp, and halogen lamp, respectively. The economic efficiency was superior in the order metal halide lamp, halogen lamp, peacock blue LED, and blue LED at 381-780 nm and metal halide lamp, peacock blue LED, blue LED, and halogen lamp at 480-520 nm. Based on the radiation characteristics and economic efficiency evaluated at 480-520 nm, the blue and peacock blue LED light sources can be used as energy-saving light sources for fishing lamps.