• Title/Summary/Keyword: high-k dielectric

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Improvement of Connector Performance Using Analysis of Characteristic Impedance (특성임피던스 분석을 사용한 커넥터 성능향상)

  • Yang, Jeong-Kyu;Kim, Moon-Jung
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.48 no.9
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    • pp.47-53
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    • 2011
  • The signal transmission properties of the connector such as insertion loss and return loss are investigated using analysis procedure of S-parameter simulation, equivalent model extraction, and characteristic impedance calculation. S-parameter simulation is performed by connector's modeling and solving based on 3-dimensional finite element method. The connector's equivalent model of ${\pi}$ type is are proposed and extracted with an optimization process of circuit analysis simulator. The characteristic impedance of the connector is calculated with results of circuit analysis simulation and S-parameter data. According to the connector's characteristic impedance, it's revised design is carried out. In this work, the connector's effective contact area is increased and its body is applied as a high dielectric material in order to increase its capacitance and then obtain impedance matching. Therefore, return loss of the connector is improved by approximately 10 dB due to its design revision.

High Efficiency FPCB Antenna for the Dual Band Mobile Phone (휴대폰용 2중 대역 고효율 FPCB 안테나)

  • Seo, Sang-Hyuk;Son, Tae-Ho;Jo, Young-Min
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.11
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    • pp.1194-1200
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    • 2009
  • An internal antenna which has 1 cc volume was implemented on the FPCB(Flexible Printed Circuit Board) for the mobile phone. We increased antenna gain and efficiency by the applying of current direction concept on the antenna pattern for this small antenna. Short antenna length for the GSM band was compensated by the spiral inductor on the FPCB. For broadening bandwidth on GSM band, it's applied 2 spiral inductors. A conductor pattern for the DCS band was positioned perpendicular with the FPCB. Antenna was implemented on FPCB that is dielectric constant 4.4 and thickness 0.05 mm, and FPCB was attached on a carrier dimensioned $L{\times}W{\times}H=30{\times}7{\times}5\;mm$. Measurements showed that max. VSWR 2:1, efficiency 42.49~60.95 % and 47.95~73.21 %, average gain -3.72~-2.15 dBi and -3.19~-1.35 dBi on the GSM and DCS band, respectively. These results are good performances among the small antenna. And the radiation patterns are omnidirectional on the H-plane to both band.

Effect of Low-Temperature Sintering on Electrical Properties and Aging Behavior of ZVMNBCD Varistor Ceramics

  • Nahm, Choon-Woo
    • Korean Journal of Materials Research
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    • v.30 no.10
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    • pp.502-508
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    • 2020
  • This paper focuses on the electrical properties and stability against DC accelerated aging stress of ZnO-V2O5-MnO2-Nb2O5-Bi2O3-Co3O4-Dy2O3 (ZVMNBCD) varistor ceramics sintered at 850 - 925 ℃. With the increase of sintering temperature, the average grain size increases from 4.4 to 11.8 mm, and the density of the sintered pellets decreases from 5.53 to 5.40 g/㎤ due to the volatility of V2O5, which has a low melting point. The breakdown field abruptly decreases from 8016 to 1,715 V/cm with the increase of the sintering temperature. The maximum non-ohmic coefficient (59) is obtained when the sample is sintered at 875 ℃. The samples sintered at below 900 ℃ exhibit a relatively low leakage current, less than 60 mA/㎠. The apparent dielectric constant increases due to the increase of the average grain size with the increase of the sintering temperature. The change tendency of dissipation factor at 1 kHz according to the sintering temperature coincides with the tendency of the leakage current. In terms of stability, the samples sintered at 900 ℃ exhibit both high non-ohmic coefficient (45) and excellent stability, 0.8% in 𝚫EB/EB and -0.7 % in 𝚫α/α after application of DC accelerated aging stress (0.85 EB/85 ℃/24 h).

The Characteristics of (Ba,Sr)$TiO_3$ Thin Films Etched With The high Density $BCl_3/Cl_2$/Ar Plasma ($BCl_3/Cl_2$/Ar 고밀도 플라즈마에서 (Ba,Sr)$TiO_3$ 박막의 식각 특성에 관한 연구)

  • Kim, Seung-Bum;Kim, Chang-Il
    • Proceedings of the KIEE Conference
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    • 1999.11d
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    • pp.863-866
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    • 1999
  • (Ba,Sr)$TiO_3$ thin films have attracted groat interest as new dielectric materials of capacitors for ultra-large-scale integrated dynamic random access memories (ULSI-DRAMs) such as 1 Gbit or 4 Gbit. In this study, inductively coupled $BCl_3/Cl_2$/Ar plasmas was used to etch (Ba,Sr)$TiO_3$ thin films. RF power/dc bias voltage = 600 W/-250 V and chamber pressure was 10 mTorr. The $Cl_2/(Cl_2+Ar)$ was fixed at 0.2, the (Ba,Sr)$TiO_3$ thin films were etched adding $BCl_3$. The highest (Ba,Sr)$TiO_3$ etch rate is 480$\AA/min$ at 10 % $BCl_3$ adding to $Cl_2$/Ar. The characteristics of the plasmas were estimated using optical emission spectroscopy (OES). The change of Cl, B radical density measured by OES as a function of $BCl_3$ percentage in $Cl_2$/Ar. The highest Cl radical density was shown at the addition of 10% $BCl_3$ to $Cl_2$/Ar. To study on the surface reaction of (Ba,Sr)$TiO_3$ thin films was investigated by XPS analysis. Ion enhancement etching is necessary to break Ba-O bond and to remove $BaCl_2$. There is a little chemical reaction between Sr and Cl, but Sr is removed by physical sputtering. There is a chemical reaction between Ti and Cl, and Tic14 is removed with ease. The cross-sectional of (Ba,Sr)$TiO_3$ thin film was investigated by scanning electron microscopy (SEM), the etch slope is about $65\;{\sim}\;70$.

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Role of CH2F2 and N-2 Flow Rates on the Etch Characteristics of Dielectric Hard-mask Layer to Extreme Ultra-violet Resist Pattern in CH2F2/N2/Ar Capacitively Coupled Plasmas

  • Kwon, B.S.;Lee, J.H.;Lee, N.E.
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.210-210
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    • 2011
  • The effects of CH2F2 and N2 gas flow rates on the etch selectivity of silicon nitride (Si3N4) layers to extreme ultra-violet (EUV) resist and the variation of the line edge roughness (LER) of the EUV resist and Si3N4 pattern were investigated during etching of a Si3N4/EUV resist structure in dual-frequency superimposed CH2F2/N2/Ar capacitive coupled plasmas (DFS-CCP). The flow rates of CH2F2 and N2 gases played a critical role in determining the process window for ultra-high etch selectivity of Si3N4/EUV resist due to disproportionate changes in the degree of polymerization on the Si3N4 and EUV resist surfaces. Increasing the CH2F2 flow rate resulted in a smaller steady state CHxFy thickness on the Si3N4 and, in turn, enhanced the Si3N4 etch rate due to enhanced SiF4 formation, while a CHxFy layer was deposited on the EUV resist surface protecting the resist under certain N2 flow conditions. The LER values of the etched resist tended to increase at higher CH2F2 flow rates compared to the lower CH2F2 flow rates that resulted from the increased degree of polymerization.

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Piezoelectric and Dielectric Properties on PSN-PMN-PZT Composition according to CeO2 Addition (PSN-PMN-PZT 조성의 CeO2첨가에 따른 압전.유전특성 변화)

  • Yoon, Man-Soon;Chio, Yong-Gil;Ur, Soon-Chul
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.19 no.9
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    • pp.838-842
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    • 2006
  • 0.03Pb$(Sb_{0.5}Nb_{0.5})O_{3}-0.03Pb(Mn{1/3}Nb{2/3)O_{3}-(0.94-x)PbTiO_{3}-xPbZrO_{3}$ ceramics doped with $CeO_{2}$ were synthesized by conventional bulk ceramic processing technique. Phases analysis, microstructures and piezoelectric properties were investigated as a function of $CeO_{2}$ content (0.03, 0.05, 0.1 0.3, 0.5 and 0.7 wt%). Microstructures and phases information were characterized using a scanning electron microscope (SEM) and an X-ray diffractometer (XRD). Mechanical quality factor ($Q_{m}$) and coupling factor(kp) were obtained from the resonance measurement method. Both $Q_{m}$ and $k_{p}$ were shown to reach to the maximum at 0.1 wt% $CeO_{2}$. In order to evaluate the stability of resonance frequency and effective electromechanical coupling factor ($K_{eff}$) as a function of $CeO_{2}$, the variation of resonance and anti-resonance frequency were also measured using a high voltage frequency response analyzer under various alternating electric fields from 10 V/mm to 80 V/mm. It was shown that the stability of resonance frequency and effective electromechanical coupling factor were increased with increasing the $CeO_{2}$ contents.

Power Amplifier Design using the Novel PBG Structure for Linearity Improvement and Size Reduction (선형성 개선과 크기 축소를 위한 새로운 PBG 구조를 이용한 전력증폭기 설계)

  • Choi, Jae-Won;Seo, Chul-Hun
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.44 no.7 s.361
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    • pp.29-34
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    • 2007
  • This paper presents a novel photonic bandgap (PBG) structure for size reduction and linearity improvement in power amplifier. The proposed structure is a two-dimensional (2-D) periodic lattice patterned on a dielectric slab that does not require nonplanar fabrication process. Throughout the experi-mental results, this structure has more broad stopband and high suppression performance than conventional three cell PBG and distorted uniplanar compact-PBG (DUC-PBG). This new PBG structure can be applied with power amplifier for linearity improvement. The 3rd intermodulation distortion (IMD3) of the power amplifier using new PBG structure is -36.16 dBc for (code division multiple access) CDMA applications. Compared with power amplifier without the proposed PBG structure, improved IMD3 is -13.49 dBc.

A Highly Efficiency CLass-F Power Amplifier Using The Spiral PBG(Photonic Bandgap) Structure (나선형 구조의 PBG(Photonic Bandgap)를 적용한 고효율 Class-F 전력 증폭기)

  • Kim, Sun-Young;Seo, Chul-Hun
    • Journal of the Institute of Electronics Engineers of Korea TC
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    • v.45 no.9
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    • pp.49-54
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    • 2008
  • In this paper, the power added efficiency(PAE) of class F power amplifier is improved by applying a new Photonic Bandgap (PBG) structure on the output of amplifier. The proposed spiral PBG structure is a two-dimensional (2-D) periodic lattice patterned on a dielectric slab that does not require nonplanar fabrication process. This structure bas higher suppression performance at second harmonic. Also, It has a sharp skirt property. This new PBG structure can be applied with class F power amplifier for efficiency improvement. We obtained the PAE of 73.62 % for CDMA applications, and the PAE performance is improved as much as 6.2 % compared with that of a conventional class F power amplifier.

The Calculation of the Energy Band Gaps and Optical constants of Zincblende GaAs1-X NX on Temperature and Composition (온도 및 조성비 변화에 따른 질화물계 화합물 반도체 GaAs1-X NX의 에너지 밴드갭과 광학상수 계산)

  • Chung, Ho-Yong;Kim, Dae-Ik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.13 no.6
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    • pp.1213-1222
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    • 2018
  • The energy band gaps and the bowing parameters of zincblende $GaAs_{1-x}N_x$ on the variation of temperature and composition are determined by using an empirical pseudo-potential method with another virtual crystal approximation, which includes the disorder effect. The bowing parameter is calculated as 15eV and the energy band gaps are decreasing rapidly in $GaAs_{1-x}N_x$ ($0{\leq}x{\leq}0.05$, 300K). A refractive index n and a function of high-frequency dielectric constant ${\varepsilon}$ are calculated by the results of energy band gaps and the calculation results of energy band gaps are consistent with experimental values.

The Calculation of the Energy Band Gaps and Optical Constants of Zincblende InyGa1-yAs1-xNx on Composition (조성비 변화에 따른 질화물계 화합물 반도체 InyGa1-yAs1-xNx의 에너지 밴드갭과 광학상수 계산)

  • Chung, Ho-Yong;Kim, Dae-Ik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.5
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    • pp.877-886
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    • 2019
  • The energy band gaps and optical constants of zincblende $In_yGa_{1-y}As_{1-x}N_x$ on the variation of temperature and composition are determined by using band anticrossing method. The energy band gaps are decreasing continuously in $In_yGa_{1-y}As_{1-x}N_x$ ($0{\leq}x{\leq}0.05$, $0{\leq}y{\leq}1.0$, 300K) and the bowing parameter is calculated as 0.522eV. The calculation results of energy band gaps are consistent with those of other studies. A refractive index n and a high-frequency dielectric constant ${\varepsilon}$ are calculated by a proposed modeling equation using the results of energy band gaps.