• Title/Summary/Keyword: high temperature insulation

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Influence of Polarization Behaviors on the ECM Characteristics of SnPb Solder Alloys in PCB (PCB에서의 ECM 특성에 미치는 SnPb 솔더 합금의 분극거동의 영향)

  • Lee Shin-Bok;Yoo Young-Ran;Jung Ja-Young;Park Young-Bae;Kim Young-Sik;Joo Young-Chang
    • Journal of the Microelectronics and Packaging Society
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    • v.12 no.2 s.35
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    • pp.167-174
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    • 2005
  • Smaller size and higher integration of electronic components make smaller gap between metal conducting layers in electronic package. Under harsh environmental conditions (high temperature/humidity), electronic component respond to applied voltages by electrochemically ionization of metal and metal filament formation, which lead to short failure and this phenomenon is termed electrochemical migration(ECM). In this work, printed circuit board(PCB) is used for determination of ECM characteristics. Copper leads of PCB are soldered by eutectic solder alloys. Insulation breakdown time is measured at $85^{\circ}C,\;85{\%}RH$. CAF is the main mechanism of ECM at PCB. Pb is more susceptible to CAF rather than Sn, which corresponds well to the corrosion resistance of solder materials in aqueous environment. Polarization tests in chloride or chloride-free solutions fur pure metal and eutectic solder alloys are performed to understand ECM characteristics. Lifetime results show well defined log-normal distribution which resulted in biased voltage factor(n=2) by voltage scaling. Details on migration mechanism and lifetime statistics will be presented and discussed.

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Intelligent Smart Farm A Study on Productivity: Focused on Tomato farm Households (지능형 스마트 팜 활용과 생산성에 관한 연구: 토마토 농가 사례를 중심으로)

  • Lee, Jae Kyung;Seol, Byung Moon
    • Asia-Pacific Journal of Business Venturing and Entrepreneurship
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    • v.14 no.3
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    • pp.185-199
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    • 2019
  • Korea's facility horticulture has developed remarkably in a short period of time. However, in order to secure international competitiveness in response to unfavorable surrounding conditions such as high operating costs and market opening, it is necessary to diagnose the problems of facility horticulture and prepare countermeasures through analysis. The purpose of this study was to analyze the case of leading farmers by introducing information and communication technology (ICT) in hydroponic cultivation agriculture and horticulture, and to examine how agricultural technology utilizing smart farm and big data of facility horticulture contribute to farm productivity. Crop growth information gathering and analysis solutions were developed to analyze the productivity change factors calculated from hydroponics tomato farms and strawberry farms. The results of this study are as follows. The application range of the leaf temperature was verified to be variously utilized such as house ventilation in the facility, opening and closing of the insulation curtain, and determination of the initial watering point and the ending time point. Second, it is necessary to utilize water content information of crop growth. It was confirmed that the crop growth rate information can confirm whether the present state of crops is nutrition or reproduction, and can control the water content artificially according to photosynthesis ability. Third, utilize EC and pH information of crops. Depending on the crop, EC values should be different according to climatic conditions. It was confirmed that the current state of the crops can be confirmed by comparing EC and pH, which are measured from the supplied EC, pH and draining. Based on the results of this study, it can be confirmed that the productivity of smart farm can be affected by how to use the information of measurement growth.

Development of Environmentally Friendly Backfill Materials for Underground Power Cables Considering Thermal Resistivity (열 저항특성을 고려한 지중송전관로 친환경 되메움재 개발)

  • Kim, Daehong;Oh, Gidae
    • Journal of the Korean GEO-environmental Society
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    • v.12 no.1
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    • pp.13-26
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    • 2011
  • Because the allowable current loading of buried electrical transmission cables is frequently limited by the maximum permissible temperature of the cable or of the surrounding ground, there is a need for cable backfill materials to be maintained at a low thermal resistivity during the service period. Temperatures greater than $50^{\circ}C$ to $60^{\circ}C$ may lead to breakdown of cable insulation and thermal runaway if the surrounding backfill material is unable to dissipate the heat as rapidly as it is generated. This paper describes the results of studies aimed at the development of backfill material to reduce the thermal resistivity. A large number of different additive materials were tested to determine their applicability as a substitute material. The results of Dong-rim river sand (relatively uniform) show that as water content level increases, thermal resistivity tends to decrease, whereas the thermal resistivity on dry condition is very high value($260^{\circ}C-cm/watt$). In addition, other materials(such as Jinsan granite screenings, A-2(sand and gravel mixture), E-1(rubble and granite screenings mixture) and SGFC(sand, gravel, fly-ash and cement mixture)) are well-graded materials with low thermal resistivity($100^{\circ}C-cm/watt$ when dry). Based on this research, 4 types of improved materials were suggested as the environmentally friendly backfill materials with low thermal resistivity.