• 제목/요약/키워드: high resolution transmission electron microscopy

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Development of Continuous Galvanization-compatible Martensitic Steel

  • Gong, Y.F.;Song, T.J.;Kim, Han S.;Kwak, J.H.;De Cooman, B.C.
    • Corrosion Science and Technology
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    • 제11권1호
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    • pp.1-8
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    • 2012
  • The development of martensitic grades which can be processed in continuous galvanizing lines requires the reduction of the oxides formed on the steel during the hot dip process. This reduction mechanism was investigated in detail by means of High Resolution Transmission Electron Microscopy (HR-TEM) of cross-sectional samples. Annealing of a martensitic steel in a 10% $H_2+N_2$ atmosphere with the dew point of $-35^{\circ}C$ resulted in the formation of a thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film and amorphous $_{a-X}MnO.SiO_{2}$ oxide particles on the surface. During the hot dip galvanizing in Zn-0.13%Al, the thin $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was reduced by the Al. The $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides however remained embedded in the Zn coating close to the steel/coating interface. No $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formation was observed. During hot dip galvanizing in Zn-0.20%Al, the $_{C-X}MnO.SiO_{2}$ (x>1) oxide film was also reduced and the amorphous $_{a-X}MnO.SiO_{2}$ and $a-SiO_{2}$ particles were embedded in the $Fe_{2}Al_{5-X}Zn_{X}$ inhibition layer formed at the steel/coating interface during hot dipping. The results clearly show that Al in the liquid Zn bath can reduce the crystalline $_{C-X}MnO.SiO_{2}$ (x>1) oxides but not the amorphous $_{a-X}MnO.SiO_{2}$ (x<0.9) and $a-SiO_{2}$ oxides. These oxides remain embedded in the Zn layer or in the inhibition layer, making it possible to apply a Zn or Zn-alloy coating on martensitic steel by hot dipping. The hot dipping process was also found to deteriorate the mechanical properties, independently of the Zn bath composition.

고상 에피택시에 의한 초박막 $CoSi_2$ 형성과 $Si/epi-CoSi_2/Si$(111)의 이중헤테로 에피택셜 성장 (Formation of $CoSi_2$ Film and Double Heteroepitaxial Growth of $Si/epi-CoSi_2/Si$(111) by Solid Phase Epitaxy)

  • 최치규;강민성;문종;현동걸;김건호;이정용
    • 한국재료학회지
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    • 제8권2호
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    • pp.165-172
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    • 1998
  • 초고진공에서 in situ 고상 에피택셜 방법으로 Si(111)기판 위에 에피택셜 $CoSi_2$ 초박막과 $Si/epi-CoSi_2/Si$(111) 의 이중 이종에피택셜 구조를 성장 시켰다. 2-MeV $^4He^{++}$ 이온 후방산란 분광기와 X-선 회절분석기 및 고분해능 투과전자 현미경을 이용하여 성장된 $CoSi_2$$Si/epi-CoSi_2/Si$(111)의 상, 조성, 결정성 그리고 계면의 미세구조를 조사하였다. 실온에서 증착된 Co 박막은 texture 구조를 갖는 Stransky-Krastanov 성장 모드를 나타내었다. 실온에서 Si(111)-$7\times{7}$ 기판 위에 Co를 $50\AA$ 증착한 후 $700^{\circ}C$로 10분간 in situ 열처리했을 때 초박막 A-type $CoSi_2$상이 성장되었고, 정합상관계는 $CoSi_2$[110]//Si[110] and $CoSi_2$(002)//Si(002)였으며, 편의각은 없었다. A-type $CoSi_2$/Si(111)계면은 평활하고 coherent 하였다. 양질의 epi-Si/epi-$CoSi_2$(A-type)/Si(111)구조는 Co/Si(111)계를 $700^{\circ}C$로 10분간 in situ로 열처리한 후 기판을 $500^{\circ}C$로 유지하면서 Si을 증착하였을 때 형성되었다.

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High quality topological insulator Bi2Se3 grown on h-BN using molecular beam epitaxy

  • Park, Joon Young;Lee, Gil-Ho;Jo, Janghyun;Cheng, Austin K.;Yoon, Hosang;Watanabe, Kenji;Taniguchi, Takashi;Kim, Miyoung;Kim, Philip;Yi, Gyu-Chul
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2016년도 제50회 동계 정기학술대회 초록집
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    • pp.284-284
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    • 2016
  • Topological insulator (TI) is a bulk-insulating material with topologically protected Dirac surface states in the band gap. In particular, $Bi_2Se_3$ attracted great attention as a model three-dimensional TI due to its simple electronic structure of the surface states in a relatively large band gap (~0.3 eV). However, experimental efforts using $Bi_2Se_3$ have been difficult due to the abundance of structural defects, which frequently results in the bulk conduction being dominant over the surface conduction in transport due to the bulk doping effects of the defect sites. One promising approach in avoiding this problem is to reduce the structural defects by heteroepitaxially grow $Bi_2Se_3$ on a substrate with a compatible lattice structure, while also preventing surface degradation by encapsulating the pristine interface between $Bi_2Se_3$ and the substrate in a clean growth environment. A particularly promising choice of substrate for the heteroepitaxial growth is hexagonal boron nitride (h-BN), which has the same two-dimensional (2D) van der Waals (vdW) layered structure and hexagonal lattice symmetry as $Bi_2Se_3$. Moreover, since h-BN is a dielectric insulator with a large bandgap energy of 5.97 eV and chemically inert surfaces, it is well suited as a substrate for high mobility electronic transport studies of vdW material systems. Here we report the heteroepitaxial growth and characterization of high quality topological insulator $Bi_2Se_3$ thin films prepared on h-BN layers. Especially, we used molecular beam epitaxy to achieve high quality TI thin films with extremely low defect concentrations and an ideal interface between the films and substrates. To optimize the morphology and microstructural quality of the films, a two-step growth was performed on h-BN layers transferred on transmission electron microscopy (TEM) compatible substrates. The resulting $Bi_2Se_3$ thin films were highly crystalline with atomically smooth terraces over a large area, and the $Bi_2Se_3$ and h-BN exhibited a clear heteroepitaxial relationship with an atomically abrupt and clean interface, as examined by high-resolution TEM. Magnetotransport characterizations revealed that this interface supports a high quality topological surface state devoid of bulk contribution, as evidenced by Hall, Shubnikov-de Haas, and weak anti-localization measurements. We believe that the experimental scheme demonstrated in this talk can serve as a promising method for the preparation of high quality TI thin films as well as many other heterostructures based on 2D vdW layered materials.

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