• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2004년도 춘계학술대회 논문집
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• pp.172-177
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• 2004

A planetary gear trains has characteristics in compactness, power transformation ability and constant meshing. Usability is increased in applications of auto transmission and industrial gearbox. Study on optimum design of planetary gear train has been progressed on minimization of weight, miniaturization of planetary gear train and improvement of high strength. There are demands of study for the planetary gear train required long lift estimation In this wort being considered life, strength, intereference, contact ratio and aspect ratio, the optimum design algorithm is proposed to reduce the volume of planetary gear train with transferring the same amount of power. In the design of algorithm for planetary gear train, the determination of teeth number is separated to achieve simplicity and the simulated annealing method as a global optimal technique is used for optimal design method.

• 한국공작기계학회논문집
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• 제14권1호
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• pp.58-65
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• 2005

A planetary gear trains has characteristics in compactness, power transformation ability and constant meshing. Usability is increased in applications of auto transmission and industrial gearbox. Study on optimum design of planetary gear train has been progressed on miniaturization of weight, miniaturization of planetary gear train and improvement of high strength. There are demands of study f3r the planetary gear train required long life estimation. In this work being considered life, strength, interference, contact ratio and aspect ratio, the optimum design algorithm is proposed to reduce the volume of planetary gear train with transferring the same amount of power. In the design of algerian for planetary gear train, the determination of teeth number is separated to achieve simplicity and the simulated annealing method as a global optimal technique is used far optimal design method.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제40회 동계학술대회 초록집
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• pp.284-284
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• 2011

Recently, the increasing degree of device integration in the fabrication of Si semiconductor devices, etching processes of nano-scale materials and high aspect-ratio (HAR) structures become more important. Due to this reason, etch selectivity control during etching of HAR contact holes and trenches is very important. In this study, The etch selectivity and etch rate of TEOS oxide layer using ACL (amorphous carbon layer) mask are investigated various process parameters in CH2F2/C4F8/O2/Ar plasma during etching TEOS oxide layer using ArF/BARC/SiOx/ACL multilevel resist (MLR) structures. The deformation and etch characteristics of TEOS oxide layer using ACL hard mask was investigated in a dual-frequency superimposed capacitively coupled plasma (DFS-CCP) etcher by different fHF/ fLF combinations by varying the CH2F2/ C4F8 gas flow ratio plasmas. The etch characteristics were measured by on scanning electron microscopy (SEM) And X-ray photoelectron spectroscopy (XPS) analyses and Fourier transform infrared spectroscopy (FT-IR). A process window for very high selective etching of TEOS oxide using ACL mask could be determined by controlling the process parameters and in turn degree of polymerization. Mechanisms for high etch selectivity will discussed in detail.

• 대한기계학회논문집A
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• 제24권6호
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• pp.1540-1546
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• 2000

Recently, force measurement systems are commonly used in many industrial fields and the precision of the measurement system is getting more important as the industry needs more precise tools and in struments to make high quality products. However, a high precision force measurement system is hard to make unless we know precisely the causes, quality and quantity of measurement errors in advance. In this work, many possible mechanical causes of measurement errors are reviewed including ratio of length to diameter of sensing part, radius of contact area, radius of bearing part, ratio of material properties and change of boundary conditions. Also, the measurement errors are analyzed by nonlinear finite element method and the nonlinear behavior of the errors are investigated. The results can be used to design force measurement systems and expected to be very useful especially for compact type load cells.

• Earthquakes and Structures
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• 제15권5호
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• pp.513-528
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• 2018

A typical viable technique to decrease the seismic response of liquid storage tanks is to isolate them at the base. Base-isolation systems are an efficient and feasible solution to reduce the vulnerability of structures in high seismic risk zones. Nevertheless, when liquid storage tanks are under long-period shaking, the base-isolation systems could have different impacts. These kinds of earthquakes can damage the tanks readily. Hence, the seismic behaviour and vibration of cylindrical liquid storage tanks, subjected to earthquakes, is of paramount importance, and it is investigated in this paper. The Finite Element Method is used to evaluate seismic response in addition to the reduction of excessive liquid sloshing in the tank when subjected to the long-period ground motion. The non-linear stress-strain behaviour pertaining to polymers and rubbers is implemented while non-linear contact elements are employed to describe the 3-D surface-to-surface contact. Therefore, Nonlinear Procedures are used to investigate the fluid-structure interactions (FSI) between liquid and the tank wall while there is incompressible liquid. Part I, examines the effect of the flexibility of the isolation system and the tank aspect ratio (height to radius) on the tank wall radial displacements of the tank wall and the liquid sloshing heights. Maximum stress and base shear force for various aspect ratios and different base-isolators, which are subjected to three seismic conditions, will be discussed in Part II. It is shown that the composite-base isolator is much more effective than other isolators due to its high flexibility and strength combined. Moreover, the base isolators may decrease the maximum level pertaining to radial displacement.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.230-230
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• 2013

플라즈마를 활용한 미세 패턴의 건식 식각은 반도체 소자 공정에 있어서 가장 중요한 기술 중 하나이다. 한편, 매년 발행되는 ITRS Roadmap 에 따르면 DRAM 의 1/2 pitch 는 감소하는 동시에 Contact A/R (Aspect Ratio) 는 증가하고 있다. 이러한 추세 속에서 기존의 공정을 그대로 활용할 경우 식각물의 프로파일 왜곡 혹은 휨 현상이 발생하고 식각 속도가 저하되며 이러한 특성들이 결과적으로는 생산성의 저하로 이어질 수 있다. 이러한 현상을 최소화하기 위해서는 무엇보다 독립된 plasma parameter 들이 식각물의 프로파일 혹은 식각 속도 등에 어떠한 영향을 주는 지에 대한 학문적 이해가 필요하다. 본 논문에서는 최소 CD (Critical Dimenstion) 100nm, 최대 A/R 30 인 HARC (High Aspect Ration Contact hole) 의 식각 특성이 plasma parameter 에 따라 어떻게 변하는지 확인해 보고자 한다. 산화물의 식각은 대표적인 high density plasma source 중의 하나인 ICP에서 진행하였으며 기존에 알려진 plasma parameter 에 더하여 자장의 인가가 산화물의 식각 특성에 어떠한 영향을 주는지 살펴보고자 전자석을 ICP 에 추가로 설치하여 실험을 진행하였다. 결과적으로, plasma parameter 에 따른 혹은 자장의 세기 변화에 따른 산화물의 식각 실험을 플라즈마 진단 실험과 병행하여 진행함으로써 다양한 인자에 따른 산화물의 식각 메커니즘을 정확하게 이해하고자 하였다. 실험 내용을 요약하면 다음과 같다. 먼저, 전자석의 전류 인가 조건에 따라 축 방향 혹은 반경 방향으로의 자장의 분포가 달라질 수 있음을 확인하였고 플라즈마 진단 결과 축 방향 혹은 반경 방향으로의 자장이 증가하였을 때 고밀도의 플라즈마가 형성될 수 있음은 물론 반경 방향으로의 플라즈마 밀도의 균일도가 향상됨을 확인할 수 있었다. 또한 ICP 조건에서 바이어스 주파수, 압력, 바이어스 파워, 소스 파워, 가스 유량 등의 plasma parameter 가 산화물의 식각 특성에 미치는 영향 및 메커니즘을 규명하였고 이 과정을 통해 최적화된 프로파일을 바탕으로 축 방향 혹은 반경 방향으로 증가하는 자장을 인가하였을 때 (M-ICP 혹은 자화 유도 결합 플라즈마) ICP 대비 산화물의 식각 속도가 증가함은 물론 PR-to-oxide 의 선택비가 개선될 수 있음을 확인할 수 있었다. 자장의 인가에 따른 산화물의 정확한 식각 메커니즘은 향후의 실험 진행을 통해 이해하고 이를 통해 궁극적으로는 산화물의 식각 공정이 나아가야 할 올바른 방향을 제시하고자 한다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.600-600
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• 2013

We have fabricated Cr nanodot Schottky diodes utilizing AAO templates formed on n-Si substrates. Three different sizes of Cr nanodots (about 75.0, 57.6, and 35.8 nm) were obtained by controlling the height of the AAO template. Cr nanodot Schottky diodes showed a rectifying behavior with low SBHs of 0.17~0.20 eV and high ideality factors of 5.6~9.2 compared to those for the bulk diode. Also, Cr nanodot Schottky diodes with smaller diameters yield higher current densities than those with larger diameters. These electrical behaviors can be explained by both Schottky barrier height (SBH) lowering effects and enhanced tunneling current due to the nanoscale size of the Schottky contact. Also, we have fabricated Cr-Si nanorod Schottky diodes with three different lengths (130, 220, and 330 nm) by dry etching of n-Si substrate. Cr-Si nanorod Schottky diodes with longer nanorods yield higher reverse current than those with shorter nanorods due to the enhanced electric field, which is attributed to a high aspect ratio of Si nanorod.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2010년도 춘계학술발표대회
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• pp.31.1-31.1
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• 2010

Various ZnO nanostructures were synthesized and ZnO nanostructure-based self-assembled transistors were fabricated. Compared to spindle and flower like nanostructure, the ZnO nanorod (NR) structure showed much stronger gate controllability, and greatly enhanced device performance, demonstrating that this structural variation leads to significant differences of the nanostructure network-based device performance. Also, patterned dry transfer-printing technique that can generate monolayer-like percolating networks of ZnO NRs has been developed. The method exploits the contact area difference between NR-NR and NR-substrate, rather than elaborate tailoring of surface chemistry or energetic. The devices prepared by the transferring method exhibited on/off current ratio, and mobility of ${\sim}2.7{\times}10^4$ and ${\sim}1.03\;cm^2/V{\cdot}s$, respectively. Also, they exhibited showing lower off-current and stronger gate controllability due to defined-channel between electrodes and monolayer-like network channel configuration. With multilayer stacks of nanostructures on stamp, the monolayer-like printing can be repeated many times, possibly on large area substrate, due to self-regulating printing characteristics. The method may enable high-performance macroelectronics with materials that have high aspect ratio.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.61.1-61.1
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• 2015

Nanoscale semiconductor plasma processing has become one of the most challenging issues due to the limits of physicochemical fabrication routes with its inherent complexity. The mission of future and emerging plasma processing for development of next generation semiconductor processing is to achieve the ideal nanostructures without abnormal profiles and damages, such as 3D NAND cell array with ultra-high aspect ratio, cylinder capacitors, shallow trench isolation, and 3D logic devices. In spite of significant contributions of research frontiers, these processes are still unveiled due to their inherent complexity of physicochemical behaviors, and gaps in academic research prevent their predictable simulation. To overcome these issues, a Korean plasma consortium began in 2009 with the principal aim to develop a realistic and ultrafast 3D topography simulator of semiconductor plasma processing coupled with zero-D bulk plasma models. In this work, aspects of this computational tool are introduced. The simulator was composed of a multiple 3D level-set based moving algorithm, zero-D bulk plasma module including pulsed plasma processing, a 3D ballistic transport module, and a surface reaction module. The main rate coefficients in bulk and surface reaction models were extracted by molecular simulations or fitting experimental data from several diagnostic tools in an inductively coupled fluorocarbon plasma system. Furthermore, it is well known that realistic ballistic transport is a simulation bottleneck due to the brute-force computation required. In this work, effective parallel computing using graphics processing units was applied to improve the computational performance drastically, so that computer-aided design of these processes is possible due to drastically reduced computational time. Finally, it is demonstrated that 3D feature profile simulations coupled with bulk plasma models can lead to better understanding of abnormal behaviors, such as necking, bowing, etch stops and twisting during high aspect ratio contact hole etch.

• ETRI Journal
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• 제28권3호
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• pp.389-392
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• 2006

In this letter, a laterally-driven bistable electromagnetic microrelay is designed, fabricated, and tested. The proposed microrelay consists of a pair of arch-shaped leaf springs, a shuttle, and a contact bar made from silicon, low temperature oxide (LTO), and gold composite materials. Silicon-on-insulator wafers are used for electrical isolation and releasing of the moving microstructures. The high-aspect-ratio microstructures are fabricated using a deep reactive ion etching (DRIE) process. The tandem-typed leaf springs with a silicon/gold composite layer enhance the mechanical performances while reducing the electrical resistance. A permanent magnet is attached at the bottom of the silicon substrate, resulting in the generation of an external magnetic field in the direction vertical to the surface of the silicon substrate. The leaf springs show bistable characteristics. The resistance of the pair of leaf springs was $7.5\;{\Omega}$, and the contact resistance was $7.7\;{\Omega}$. The relay was operated at ${\pm}0.12\;V$.